Diodes ZXTN25060BFH User Manual

Page 1
ZXTN25060BFH 60V, SOT23, NPN medium power transistor
Summary
BV
> 150V
CEX
BV
> 60V
BV
> 6V
I
= 3.5A
C(cont)
V
R
P
Complementary part number ZXTP25060BFH
< 65 mV @ 1A
CE(sat)
= 43 m
CE(sat)
= 1.25W
D
Description
Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium.
Features
High power dissipation SOT23 package
High peak current
Low saturation voltage
150V forward blocking voltage
Applications
Lamp, relay and solenoid drivers
General switching in automotive and industrial applications
Motor drive and control
Ordering information
Device Reel size
(inches)
Tape width
(mm)
Quantity per reel
C
B
E
E
C
B
Pinout - top view
ZXTN25060BFHTA 7 8 3,000
Device marking
019
Issue 1 - March 2006 1 www.zetex.com
© Zetex Semiconductors plc 2006
Page 2
ZXTN25060BFH
Absolute maximum ratings
Parameter Symbol Limit Unit
Collector-base voltage V
Collector-emitter voltage (forward blocking) V
Collector-emitter voltage V
Emitter-collector voltage (reverse blocking) V
Emitter-base voltage V
Continuous collector current
(b)
Peak pulse current I
Power dissipation at T
=25°C
A
(a)
Linear derating factor
Power dissipation at T
=25°C
A
(b)
Linear derating factor
Power dissipation at T
=25°C
A
(c)
Linear derating factor
Power dissipation at T
=25°C
A
(d)
Linear derating factor
CBO
CEX
I
C
CM
P
D
P
D
P
D
P
D
150 V
150 V
60 V
6V
7V
3.5 A
10 A
0.73
5.84
1.05
8.4
1.25
9.6
1.81
14.5
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
Operating and storage temperature range T
j
, T
stg
- 55 to 150 °C
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs.
(a)
(b)
(c)
(d)
R
R
R
R
JA
JA
JA
JA
171 °C/W
119 °C/W
100 °C/W
69 °C/W
Issue 1 - March 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
Page 3
Characteristics
ZXTN25060BFH
Issue 1 - March 2006 3 www.zetex.com
© Zetex Semiconductors plc 2006
Page 4
ZXTN25060BFH
ELECTRICAL CHARACTERISTICS (at T
= 25°C unless otherwise stated)
amb
Parameter Symbol Min. Typ. Max. Unit Conditions
Collector-base breakdown
BV
CBO
150 190 V IC = 100␮A
voltage
Collector-emitter breakdown voltage (forward blocking)
Collector-emitter breakdown voltage (base open)
Emitter-collector breakdown voltage (reverse
BV
BV
BV
CEX
ECX
150 190 IC = 100␮A, RBE 1k or
-1V < V
60 80 V
68 VI
I
C
E
BE
= 10mA
= 100A, RBC 1k or
0.25V > V
blocking)
Emitter-collector
BV
67 VI
= 100␮A,
E
breakdown voltage (base open)
Emitter-base breakdown
BV
78 VI
= 100␮A
E
voltage
Collector cut-off current I
Collector-emitter cut-off
CBO
I
CEX
current
Emitter cut-off current I
Collector-emitter saturation
V
CE(sat)
voltage
Base-emitter saturation
V
BE(sat)
voltage
Base-emitter turn-on
V
BE(on)
voltage
Static forward current
h
FE
transfer ratio
Transition frequency f
Output capacitance C
Turn-on time t
Turn-off time t
NOTES:
(*) Measured under pulsed conditions. Pulse width
T
OBO
(on)
(off)
100 200 300
90 180
25 40
300s; duty cycle 2%.
<1 50
20
-100nA
<1 50 nA V
33 40 mV
73 95 mV
50 65 mV
150 175 mV
960 1050 mV
865 950 mV
nA␮AV
CB
V
CB
= 120V = 120V, T
VCE = 120V; RBE ⱕ 1k⍀ or
-1V < V
I
C
I
C
I
C
I
C
I
C
I
C
I
C
I
C
I
C
BE
= 5.6V
EB
= 0,5A, IB = 50mA
= 0,5A, IB = 10mA
= 1A, IB = 100mA
= 3.5A, IB = 350mA
= 3.5A, IB = 350mA
= 3.5A, VCE = 2V
= 10mA, VCE = 2V
= 1A, VCE = 2V
= 3.5A, VCE = 2V
185 MHz IC = 100mA, VCE = 5V
= 100MHz
f
11.5 20 pF
34 ns V
566 ns
= 10V, f = 1MHz
V
CB
= 10V. IC = 500mA,
CC
= IB2= 50mA.
I
B1
< 0.25V
(*)
> -0.25V
BC
amb
< 0.25V
= 100°C
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
Issue 1 - March 2006 4 www.zetex.com
© Zetex Semiconductors plc 2006
Page 5
Typical characteristics
ZXTN25060BFH
Issue 1 - March 2006 5 www.zetex.com
© Zetex Semiconductors plc 2006
Page 6
Package outline - SOT23
L
ZXTN25060BFH
H
N
D
G
3 leads
M
B
A
C
K
F
Dim. Millimeters Inches Dim. Millimeters Inches
Min. Max. Min. Max. Min. Max. Max. Max.
A 2.67 3.05 0.105 0.120 H 0.33 0.51 0.013 0.020
B 1.20 1.40 0.047 0.055 K 0.01 0.10 0.0004 0.004
C - 1.10 - 0.043 L 2.10 2.50 0.083 0.0985
D 0.37 0.53 0.015 0.021 M 0.45 0.64 0.018 0.025
F 0.085 0.15 0.0034 0.0059 N 0.95 NOM 0.0375 NOM
G 1.90 NOM 0.075 NOM - - - - -
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Europe
Zetex GmbH Streitfeldstraße 19 D-81673 München Germany
Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com
For international sales offices visit www.zetex.com/offices Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Americas
Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA
Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com
Asia Pacific
Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong
Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com
Corporate Headquarters
Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom
Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
Issue 1 - March 2006 6 www.zetex.com
© Zetex Semiconductors plc 2006
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