
ZXTN25060BFH
60V, SOT23, NPN medium power transistor
Summary
BV
> 150V
CEX
BV
> 60V
CEO
BV
> 6V
ECO
I
= 3.5A
C(cont)
V
R
P
Complementary part number ZXTP25060BFH
< 65 mV @ 1A
CE(sat)
= 43 m⍀
CE(sat)
= 1.25W
D
Description
Advanced process capability and package design have been used to
maximize the power handling and performance of this small outline
transistor. The compact size and ratings of this device make it ideally
suited to applications where space is at a premium.
Features
• High power dissipation SOT23 package
• High peak current
• Low saturation voltage
• 150V forward blocking voltage
Applications
• Lamp, relay and solenoid drivers
• General switching in automotive and industrial applications
• Motor drive and control
Ordering information
Device Reel size
(inches)
Tape width
(mm)
Quantity per reel
C
B
E
E
C
B
Pinout - top view
ZXTN25060BFHTA 7 8 3,000
Device marking
019
Issue 1 - March 2006 1 www.zetex.com
© Zetex Semiconductors plc 2006

ZXTN25060BFH
Absolute maximum ratings
Parameter Symbol Limit Unit
Collector-base voltage V
Collector-emitter voltage (forward blocking) V
Collector-emitter voltage V
Emitter-collector voltage (reverse blocking) V
Emitter-base voltage V
Continuous collector current
(b)
Peak pulse current I
Power dissipation at T
=25°C
A
(a)
Linear derating factor
Power dissipation at T
=25°C
A
(b)
Linear derating factor
Power dissipation at T
=25°C
A
(c)
Linear derating factor
Power dissipation at T
=25°C
A
(d)
Linear derating factor
CBO
CEX
CEO
ECO
EBO
I
C
CM
P
D
P
D
P
D
P
D
150 V
150 V
60 V
6V
7V
3.5 A
10 A
0.73
5.84
1.05
8.4
1.25
9.6
1.81
14.5
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
Operating and storage temperature range T
j
, T
stg
- 55 to 150 °C
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
(b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(d) As (c) above measured at t<5secs.
(a)
(b)
(c)
(d)
R
R
R
R
⍜JA
⍜JA
⍜JA
⍜JA
171 °C/W
119 °C/W
100 °C/W
69 °C/W
Issue 1 - March 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006

Characteristics
ZXTN25060BFH
Issue 1 - March 2006 3 www.zetex.com
© Zetex Semiconductors plc 2006

ZXTN25060BFH
ELECTRICAL CHARACTERISTICS (at T
= 25°C unless otherwise stated)
amb
Parameter Symbol Min. Typ. Max. Unit Conditions
Collector-base breakdown
BV
CBO
150 190 V IC = 100A
voltage
Collector-emitter breakdown
voltage (forward blocking)
Collector-emitter breakdown
voltage (base open)
Emitter-collector
breakdown voltage (reverse
BV
BV
BV
CEX
CEO
ECX
150 190 IC = 100A, RBE ⱕ 1k⍀ or
-1V < V
60 80 V
68 VI
I
C
E
BE
= 10mA
= 100A, RBC ⱕ 1k⍀ or
0.25V > V
blocking)
Emitter-collector
BV
ECO
67 VI
= 100A,
E
breakdown voltage (base
open)
Emitter-base breakdown
BV
EBO
78 VI
= 100A
E
voltage
Collector cut-off current I
Collector-emitter cut-off
CBO
I
CEX
current
Emitter cut-off current I
Collector-emitter saturation
EBO
V
CE(sat)
voltage
Base-emitter saturation
V
BE(sat)
voltage
Base-emitter turn-on
V
BE(on)
voltage
Static forward current
h
FE
transfer ratio
Transition frequency f
Output capacitance C
Turn-on time t
Turn-off time t
NOTES:
(*) Measured under pulsed conditions. Pulse width
T
OBO
(on)
(off)
100 200 300
90 180
25 40
ⱕ 300s; duty cycle ⱕ2%.
<1 50
20
-100nA
<1 50 nA V
33 40 mV
73 95 mV
50 65 mV
150 175 mV
960 1050 mV
865 950 mV
nAAV
CB
V
CB
= 120V
= 120V, T
VCE = 120V; RBE ⱕ 1k⍀ or
-1V < V
I
C
I
C
I
C
I
C
I
C
I
C
I
C
I
C
I
C
BE
= 5.6V
EB
= 0,5A, IB = 50mA
= 0,5A, IB = 10mA
= 1A, IB = 100mA
= 3.5A, IB = 350mA
= 3.5A, IB = 350mA
= 3.5A, VCE = 2V
= 10mA, VCE = 2V
= 1A, VCE = 2V
= 3.5A, VCE = 2V
185 MHz IC = 100mA, VCE = 5V
= 100MHz
f
11.5 20 pF
34 ns V
566 ns
= 10V, f = 1MHz
V
CB
= 10V. IC = 500mA,
CC
= IB2= 50mA.
I
B1
< 0.25V
(*)
> -0.25V
BC
amb
< 0.25V
= 100°C
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
Issue 1 - March 2006 4 www.zetex.com
© Zetex Semiconductors plc 2006

Typical characteristics
ZXTN25060BFH
Issue 1 - March 2006 5 www.zetex.com
© Zetex Semiconductors plc 2006

Package outline - SOT23
L
ZXTN25060BFH
H
N
D
G
3 leads
M
B
A
C
K
F
Dim. Millimeters Inches Dim. Millimeters Inches
Min. Max. Min. Max. Min. Max. Max. Max.
A 2.67 3.05 0.105 0.120 H 0.33 0.51 0.013 0.020
B 1.20 1.40 0.047 0.055 K 0.01 0.10 0.0004 0.004
C - 1.10 - 0.043 L 2.10 2.50 0.083 0.0985
D 0.37 0.53 0.015 0.021 M 0.45 0.64 0.018 0.025
F 0.085 0.15 0.0034 0.0059 N 0.95 NOM 0.0375 NOM
G 1.90 NOM 0.075 NOM - - - - -
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Europe
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
For international sales offices visit www.zetex.com/offices
Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
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Zetex Inc
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Asia Pacific
Zetex (Asia Ltd)
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Corporate Headquarters
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
United Kingdom
Telephone: (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
Issue 1 - March 2006 6 www.zetex.com
© Zetex Semiconductors plc 2006