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Diodes Incorporated
40V NPN MEDIUM POWER PLANAR TRANSISTOR IN SOT23
Features
• BV
• I
• Low Saturation Voltage V
• Complementary Part Number ZXTP2041F
• Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
> 40V
CEO
= 1A Continuous Collector Current
C
< 500mV @ 1A
CE(sat)
Description
This transistor combines high gain, high current operation and low
saturation voltage making it ideal for power MOSFET gate driving and
low loss power switching.
SOT23
B
Top View
Mechanical Data
• Case: SOT23
• Case material: Molded Plastic. “Green” Molding Compound
• UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish; Solderable per MIL-STD-202,
Method 208
• Weight: 0.008 grams (Approximate)
Applications
• Power MOSFET date driving
• Low loss power switching
C
C
E
Device Symbol
Top View
Pin Configuration
ZXTN2040F
E
B
Ordering Information (Note 4)
Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXTN2040FTA N40 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
N40
ZXTN2040F
Document number: DS33668 Rev. 3 - 2
N40 = Product Type Marking Code
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Maximum Ratings (@T
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current (Note 5)
Peak Pulse Current
Peak Base Current
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
V
V
V
CBO
CEO
EBO
I
I
CM
I
BM
C
40 V
40 V
6 V
1 A
2 A
1 A
ZXTN2040F
Thermal Characteristics
Characteristic Symbol Value Unit
Collector Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range
Notes: 5. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition .
6. Same as Note 5, expect the device is mounted on 15mm X 15mm X 1.6mm FR4 PCB.
7. Thermal resistance from junction to solder-point (at the end of the collector lead).
(Note 5)
(Note 6) 350
(Note 5)
(Note 6) 357
R
R
T
J,TSTG
P
θJA
θJL
D
310
403
350
-55 to +150
mW
°C/W
°C/W
°C
0.4
0.3
0.2
0.1
0.0
0 255075100125150
Max Power Dissi pa t i o n (W)
Temperature (°C)
Derating Curve
10
Single Pulse. T
1
0.1
10m 100m 1 10 100 1k
Max Power Dissipation (W)
Pulse Width (s )
Pulse Power Dissipation
amb
=25°C
400
350
300
250
D=0.5
200
150
D=0.2
100
50
0
100µ 1m 10m 100m 1 10 100 1k
Thermal Resistance (°C/W)
D=0.1
Single Pulse
D=0.05
Pulse Width (s)
Transient Thermal Impedance
ZXTN2040F
Document number: DS33668 Rev. 3 - 2
2 of 6
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© Diodes Incorporated
August 2012