Diodes ZXTD718MC User Manual
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DUAL 20V PNP LOW SATURATION SWITCHING TRANSISTOR
Features and Benefits
• BV
• I
• R
• Low Saturation Voltage (-220mV @ -1A)
• hFE characterized up to -6A for high current gain holds up
• Dual NPN saving footprint and component count
• Low profile 0.8mm high package for thin applications
• R
• 6mm
• Lead-Free, RoHS Compliant (Note 1)
• Halogen and Antimony Free. “Green” Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
> -20V;
CEO
= -3.5A Continuous Collector Current
C
= 64 mΩ for Low Equivalent On Resistance
SAT
efficient, 40% lower than SOT26
θJA
2
footprint, 50% smaller than TSOP6 and SOT26
DFN3020B-8
Top View
Bottom View
B2
PNP Transistor
Mechanical Data
• Case: DFN3020B-8
• Case material: Molded Plastic. “Green” Molding Compound.
• UL Flammability Rating 94V-0
• Terminals: Pre-Plated NiPdAu leadframe.
• Nominal package height: 0.8mm
• Moisture Sensitivity: Level 1 per J-STD-020
• Solderable per MIL-STD-202, Method 208
• Weight: 0.013 grams (approximate)
Applications
• Battery charging circuits
• Load disconnect switches
• DC-DC converters
• Motor drive
• LED backlighting circuits
• Portable applications
C2
B1
2
Equivalent Circuit
Diodes Incorporated
C
E1
PNP Transistor
ZXTD718MC
C2 C2 C1 C1
C1C2
E2 B2 E1 B1
Bottom View
Pin Out
Pin 1
Ordering Information (Note 3)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
ZXTD718MCTA D22 7 8 3,000
Notes: 1. No purposefully added lead.
2. Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com
3. For Packaging Details, go to our website at http://www.diodes.com.
Marking Information
ZXTD718MC
Document Number DS32000 Rev. 2 - 2
D22
www.diodes.com
D22 = Product type Marking Code
Top view, dot denotes Pin 1
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ZXTD718MC
Maximum Ratings @ T
= 25°C unless otherwise specified
A
Parameter Symbol Limit Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
Continuous Collector Current (Notes 4 and 7)
Base Current
V
CBO
V
CEO
V
EBO
I
CM
I
C
I
B
-25
-20
-7
-6
-3.5
-1
V
A
Thermal Characteristics @ T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
1.5
12
2.45
19.6
1.13
8
1.7
13.6
83.3
W
mW/°C
°C/W
Power Dissipation
Linear Derating Factor
Thermal Resistance, Junction to Ambient
(Notes 4 & 7)
(Notes 5 & 7)
P
D
(Notes 6 & 7)
(Notes 6 & 8)
(Notes 4 & 7)
(Notes 5 & 7) 51.0
(Notes 6 & 7) 111
R
JA
θ
(Notes 6 & 8) 73.5
Thermal Resistance, Junction to Lead (Notes 7 & 9)
Operating and Storage Temperature Range
Notes: 4. For a dual device surface mounted on 28mm x 28mm (8cm2) FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is
measured when operating in a steady-state condition. The heatsink is split in half with the exposed collector pads connected to each half.
5. Same as note (4), except the device is measured at t <5 sec.
6. Same as note (4), except the device is surface mounted on 31mm x 31mm (10cm
7. For a dual device with one active die.
8. For dual device with 2 active die running at equal power.
9. Thermal resistance from junction to solder-point (at the end of the collector lead).
R
JL
T
, T
J
STG
2
) FR4 PCB with high coverage of single sided 1oz copper.
17.1
-55 to +150
°C
ZXTD718MC
Document Number DS32000 Rev. 2 - 2
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Thermal Characteristics
ZXTD718MC
10
V
CE(SAT)
Limited
1
0.1
0.01
Collector Current (A)
C
I
0.1 1 10
DC
1s
8sqcm 2oz Cu
One active die
Single Pulse, T
100ms
=25°C
amb
10ms
1ms
100us
VCE Collector-Emitter Voltage (V)
Safe Operating Area
8sqcm 2oz Cu
80
One active die
60
D=0.5
40
D=0.2
20
Thermal Resistance (°C/W)
0
100µ 1m 10m 100m 1 10 100 1k
Pulse Width (s )
Single Pulse
D=0.05
D=0.1
2.0
T
=25°C
amb
1.5
1.0
10sqcm 1oz Cu
Two active die
8sqcm 2oz Cu
One active die
0.5
10sqcm 1oz Cu
0.0
0 25 50 75 100 125 150
Max Power Di ssip at i o n (W)
One active die
Temperature (°C)
Derating Curve
225
200
175
150
125
100
75
2oz Cu
50
One active die
25
Thermal Resistance (°C/W)
0
0.1 1 10 100
1oz Cu
One active die
1oz Cu
Two active die
2oz Cu
Two active die
Board Cu Area (sqcm)
Transient Thermal Impedance
Thermal Resistance v Board Area
3.5
3.0
2.5
2.0
T
=25°C
amb
T
=150°C
j max
Continuous
2oz Cu
One active die
2oz Cu
Two active die
1.5
1.0
Dissipation (W)
D
0.5
P
0.0
0.1 1 10 100
1oz Cu
One a ctive die
1oz Cu
Two active die
Board Cu Area (sqcm)
Power Dissipation v Bo ard A rea
ZXTD718MC
Document Number DS32000 Rev. 2 - 2
3 of 7
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January 2011
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