Diodes ZLLS1000 User Manual

A

f

Features

• Low Equivalent on Resistance

• Extremely Low Leakage (typically 6μA @30V)

• High current capability (I

• Low V

• SOT23 Package

• ZLLS1000 Complements Low Temperature Equivalent

• Package Thermally Rated to +150°C

• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

, Fast Switching Schottky

F

ZHCS1000

= 1.16A)

F

SOT23

Top View

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Diodes Incorporated

ZLLS1000

40V HIGH CURRENT LOW LEAKAGE SCHOTTKY DIODE

Mechanical Data

• Case: SOT23

• UL Flammability Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish

• Weight: 0.008 grams (Approximate)

Applications

• DC – DC Converters

• Strobes

• Mobile Phones

• Charging Circuits

• Motor Control

Cathode

N/C

C

A

Anode

Device Symbol

Pinout – Top View

Ordering Information

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

ZLLS1000TA L10 7 8 3,000 units
ZLLS1000TC L10 13 8 10,000 units

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

Marking Information

L10

ZLLS1000

Document Number DS32021 Rev. 6 - 2

L10 = Product type Marking Code

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ZLLS1000

Maximum Ratings (@T

Characteristic Symbol Value Unit

Continuous Reverse Voltage
Forward Current
Peak Repetitive Forward Current

Rectangular Pulse Duty Cycle 50% 100μs pulse width
Non Repetitive Forward Current t≤100μs
t≤10ms

= +25°C, unless otherwise specified.)

A

V

R

I

F

I

FPK

I

FSM

40 V

1.16 A

2.6 A
22

6.4

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation @TA = +25°C Single Die Continuous
Single Die Measured at t<5 secs

Thermal Resistance Junction to Ambient (Note 4)
Thermal Resistance Junction to Ambient (Note 5)
Thermal Resistance Junction to Lead (Solder Point)
Storage temperature range
Junction temperature

Notes: 4. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

5. For a device mounted on FRB PCB measured at t<5secs.

R
R
R
T

P

θJA
θJA
θJL

STG

T

D

J

0.8

1.18
155 °C/W
106 °C/W

80 °C/W

-55 to +150 °C
150 °C

A
A

W

Thermal Characteristics and Derating information

150

100

T

=25°C

amb

Rectangular Pulse

D=0.5

0.9

0.8

0.7

0.6

0.5

0.4

50

D=0.2

0

100µ 1m 10m 100m 1 10 100 1k

Thermal Resistance (°C/W)

D=0.1

Single Pulse

D=0.05

0.3

0.2

0.1

0.0

Max Power Di ssi p ation (W)

Pulse Width (s )

Transient Thermal Impedance

0 20 40 60 80 100 120 140 160

Temperature (°C)

Derating Curve

ZLLS1000

Document Number DS32021 Rev. 6 - 2

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