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MMBTA55 / MMBTA56
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary NPN Types Available (MMBTA05 /
MMBTA06)
• Ideal for Low Power Amplification and Switching
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020d
• Terminal Connections: See Diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
• MMBTA55 Marking (See Page 3): K2H, K2G
• MMBTA56 Marking (See Page 3): K2G
• Ordering Information: See Page 3
• Weight: 0.008 grams (approximate)
Maximum Ratings @T
Characteristic Symbol MMBTA55 MMBTA56 Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous (Note 1)
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
= 25°C unless otherwise specified
A
A
C
TOP VIEW
BE
E
D
G
H
J
C
B
V
CBO
V
CEO
V
EBO
IC
Pd
R
JA
θ
Tj, T
STG
B
C
K
L
E
M
-60 -80 V
-60 -80 V
-4.0 V
-500 mA
300 mW
417
-55 to +150
SOT-23
Dim Min Max
A 0.37 0.51
B 1.20 1.40
C 2.30 2.50
D 0.89 1.03
E 0.45 0.60
G 1.78 2.05
H 2.80 3.00
J 0.013 0.10
K 0.903 1.10
L 0.45 0.61
M 0.085 0.180
α
0° 8°
All Dimensions in mm
°C/W
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 2)
Collector-Base Breakdown Voltage MMBTA55
MMBTA56
Collector-Emitter Breakdown Voltage MMBTA55
MMBTA56
Emitter-Base Breakdown Voltage
Collector Cutoff Current MMBTA55
MMBTA56
Collector Cutoff Current MMBTA55
MMBTA56
ON CHARACTERISTICS (Note 2)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
DS30054 Rev. 11 - 2 1 of 3
V
V
V
(BR)CBO
(BR)CEO
(BR)EBO
I
CBO
I
CEX
hFE
V
CE(SAT)
V
BE(SAT)
fT
www.diodes.com
-60
-80
-60
-80
-4.0
⎯
⎯
100
⎯
⎯
50
Fire Retardants.
2O3
⎯
⎯
⎯
-100 nA
-100 nA
⎯ ⎯
-0.25 V
-1.2 V
⎯
MHz
V
IC = -100μA, IE = 0
V
IC = -1.0mA, IB = 0
V
IE = -100μA, IC = 0
VCB = -60V, IE = 0
VCB = -80V, IE = 0
V
= -60V, IBO = 0V
CE
V
= -80V, IBO = 0V
CE
IC = -10mA, VCE = -1.0V
IC = -100mA, V
IC = -100mA, IB = -10mA
IC = -100mA, VCE = -1.0V
VCE = -1.0V, IC = -100mA,
f = 100MHz
= -1.0V
CE
MMBTA55 / MMBTA56
© Diodes Incorporated
400
Note 1
350
300
N (mW)
I
250
A
200
DISSI
150
,
100
D
50
EMI
LLE
CE(SAT)
V,
SATURATION VOLTAGE (V)
0.25
0.20
0.15
0.10
0.05
I
C
= 10
I
B
T= 25°C
A
T = 150°C
A
T = -50°C
A
1,000
100
FE
h, D
10
100
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75
100 125
Fig. 1 Max Power Dissipation vs
Ambie nt Temper at ure
V= 5V
CE
T= 25°C
A
1
I , COLLECTOR CURRENT (mA)
C
10
T = -50°C
A
100
Fig. 3 DC Current Gain vs. Collector Current
175
150
T = 150°C
A
200
1,000
0
110
I , COLLECTOR CURRENT (mA)
C
100
1,000
Fig. 2 Collector Emitter Saturation Voltage
vs. Collector Current
1.0
0.9
E (V)
0.8
0.7
0.6
V= 5V
CE
T= -50°C
A
T= 25°C
A
0.5
0.4
T = 150°C
0.3
BE(ON)
V , BASE EMI
0.2
A
0.1
10.1
I , COLLECTOR CURRENT (mA)
C
Fig. 4 Base Emitter Voltage vs. Collector Current
10 100
z)
(M
V= 5V
CE
10
DWID
-BA
AI
T
f,
1
110
I , COLLECTOR CURRENT (mA)
C
Fig. 5 Gain-Bandwidth Product vs. Collector Current
DS30054 Rev. 11 - 2 2 of 3
100
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MMBTA55 / MMBTA56
© Diodes Incorporated