Diodes MMBTA28 User Manual

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Features

 BV  Epitaxial Planar Die Construction  Ideal for Low Power Amplification and Switching  High Current Gain  Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  Qualified to AEC-Q101 Standards for High Reliability

CES

> 80V

SOT23

Top View Device Symbol

MMBTA28

80V NPN DARLINGTON TRANSISTOR IN SOT23

Mechanical Data

 Case: SOT23  Case Material: molded plastic, “Green” molding compound  UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Finish – Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208

 Weight 0.008 grams (approximate)

Top View

Pin-Out

Ordering Information (Note 4)

Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel

MMBTA28-7-F AEC-Q101 K6R 7 8 3,000

MMBTA28-13-F AEC-Q101 K6R 13 8 10,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

Date Code Key

Year 2010 2011 2012 2013 2014 2015 2016 2017

Code X Y Z A B C D E

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

K6R

K6R = Product Type Marking Code YM = Date Code Marking Y or Y = Year (ex: B = 2014) M or M = Month (ex: 9 = September)

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Absolute Maximum Ratings (@T

Characteristic Symbol Value Unit

Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current

Thermal Characteristics (@T

Characteristic Symbol Value Unit

Power Dissipation

Thermal Resistance, Junction to Ambient

Thermal Resistance, Junction to Leads (Note 7) Operating and Storage Temperature Range

Notes: 5. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB; device is measured under still air

conditions whilst operating in a steady-state.

6. Same as note (5), except the device is mounted on 15 mm x 15mm 1oz copper.

7. Thermal resistance from junction to solder-point (at the end of the leads).

= +25°C, unless otherwise specified.)

(Note 5) (Note 6) 350 (Note 5) (Note 6) 357

J,TSTG

CBO

CES

EBO

θJA

θJL

80 V 80 V 12 V

500 mA

310

403

350

-55 to +150

MMBTA28

C/W

C

0.4

0.3

0.2

0.1

0.0 0 25 50 75 100 125 150

Max Power Dissipation (W)

Temperature (°C)

Derating Curve

Single Pulse. T

amb

=25°C

400

350

300

250

D=0.5

200

150

D=0.2

100

100µ 1m 10m 100m 1 10 100 1k

Thermal Resistance (°C/W)

D=0.1

Single Pulse

D=0.05

Pulse Width (s)

Transient Thermal Impedance

0.1

10m 100m 1 10 100 1k

Max Power Dissipation (W)

Pulse Width (s)

Pulse Power Dissipation

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Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

Characteristic Symbol Min Typ Max Unit Test Condition

OFF CHARACTERISTICS

Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 8) Emitter-Base Breakdown Voltage

Collector cut-off current

Emitter-base Cut-off Current

BV BV BV

CBO

CES

EBO

CBO

CES

EBO

ON CHARACTERISTICS (Note 8)

Static Forward Current Transfer Ratio

Collector-Emitter Saturation Voltage

Base-Emitter Turn-On Voltage

CE(sat)

BE(on

10,000 10,000

SMALL SIGNAL CHARACTERISTICS (Note 8)

Current Gain-Bandwidth Product

Output Capacitance Input Capacitance

Note: 8. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%

obo

ibo

80 — — V 80 — — V 12 — — V — — 100 nA — — 500 nA — — 100 nA

— —

1.2

1.5

— — 2.0 V

125 — — MHz

— 8.0 — pF — 15.0 — pF

IC = 100µA, IE = 0 IC = 100µA, VBE = 0 IE = 100µA, IC = 0 VCB = 60V, IE = 0 VCE = 60V, VBE = 0 VEB = 10V, IC = 0

—

IC = 100mA, VCE = 5V

f = 100MHz VCB = 10V, f = 1MHz, IE = 0 VEB = 0.5V, f = 1MHz, IC = 0

MMBTA28

= 10mA, V = 100mA, V = 10mA, IB = 10µA = 100mA, IB = 100µA

= 10mA, VCE = 5V,

= 5V

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CTO

TURATIO

TER VOLTAG

C CUR

REN

T GAIN

H PRODUCT

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Typical Electrical Characteristics (@T

1.1

SA E

-EMI

LLE

CE(SAT)

1,000,000

1.0

= 1000

T = -50°C

0.9

0.8

T = 25°C

0.7

0.6

T = 150°C

0.5

0.4

VOLTAGE (V)

0.3

0.2

0.1

110

I , COLLECTOR CURRENT (mA)

100 1,000

Fig. 2 Typical Collector-Emitter Saturation Voltage

vs. Collector Current

V= 5V

= +25°C, unless otherwise specified.)

1.6

V = 5V

1.5

1.4

E (V)

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

BE(ON)

V , BASE-EMI

0.4

0.3

0.1 1 10 100 I , COLLECTOR CURRENT (mA)

Fig. 3 Typical Base-Emitter Voltage

1,000

V = 5V

T = -50°C

T = 25°C

T = 150°C

vs. Collector Current

MMBTA28

100,000

T = 150°C

T = 25°C

100

10,000

T = -50°C

h, D

1,000

100

110100

I , COLLECTOR CURRENT (mA)

1,000

AIN BANDWID

Fig. 4 Typical DC Current Gain

vs. Collector Current

110

COLLECTOR CURRENT I (mA)

Fig. 5 Typical Gain Bandwidt h Product

vs. Collector Current

100

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Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

All 7

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

Dimensions Value (in mm)

Dim Min Max Typ

A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90

J 0.013 0.10 0.05

K 0.890 1.00 0.975

K1 0.903 1.10 1.025

L 0.45 0.61 0.55

L1 0.25 0.55 0.40

M 0.085 0.150 0.110

Z 2.9 X 0.8 Y 0.9 C E

SOT23

8°

All Dimensions in mm

2.0

1.35

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IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

www.diodes.com

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