Diodes MMBTA28 User Manual

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Features

 BV
 Epitaxial Planar Die Construction
 Ideal for Low Power Amplification and Switching
 High Current Gain
 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)
 Qualified to AEC-Q101 Standards for High Reliability

CES

> 80V

SOT23

Top View Device Symbol

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MMBTA28

80V NPN DARLINGTON TRANSISTOR IN SOT23

Mechanical Data

 Case: SOT23
 Case Material: molded plastic, “Green” molding compound
 UL Flammability Classification Rating 94V-0
 Moisture Sensitivity: Level 1 per J-STD-020
 Terminals: Finish – Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208

 Weight 0.008 grams (approximate)

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Top View

Pin-Out

Ordering Information (Note 4)

Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel

MMBTA28-7-F AEC-Q101 K6R 7 8 3,000

MMBTA28-13-F AEC-Q101 K6R 13 8 10,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

Date Code Key

Year 2010 2011 2012 2013 2014 2015 2016 2017

Code X Y Z A B C D E

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

K6R

YM

K6R = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: B = 2014)
M or M = Month (ex: 9 = September)

MMBTA28

Document number: DS30367 Rev. 10 - 2

1 of 6

www.diodes.com

February 2014

© Diodes Incorporated

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Absolute Maximum Ratings (@T

Characteristic Symbol Value Unit

Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current

Thermal Characteristics (@T

Characteristic Symbol Value Unit

Power Dissipation

Thermal Resistance, Junction to Ambient

Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range

Notes: 5. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB; device is measured under still air

conditions whilst operating in a steady-state.

6. Same as note (5), except the device is mounted on 15 mm x 15mm 1oz copper.

7. Thermal resistance from junction to solder-point (at the end of the leads).

= +25°C, unless otherwise specified.)

A

V

V

V

= +25°C, unless otherwise specified.)

A

(Note 5)
(Note 6) 350
(Note 5)
(Note 6) 357

R

R

T

J,TSTG

CBO

CES

EBO

I

C

P

D

θJA

θJL

80 V
80 V
12 V

500 mA

310

403

350

-55 to +150

MMBTA28

mW

C/W

C/W

C

0.4

0.3

0.2

0.1

0.0
0 25 50 75 100 125 150

Max Power Dissipation (W)

Temperature (°C)

Derating Curve

10

Single Pulse. T

1

amb

=25°C

400

350

300

250

D=0.5

200

150

D=0.2

100

50

0

100µ 1m 10m 100m 1 10 100 1k

Thermal Resistance (°C/W)

D=0.1

Single Pulse

D=0.05

Pulse Width (s)

Transient Thermal Impedance

0.1

10m 100m 1 10 100 1k

Max Power Dissipation (W)

Pulse Width (s)

Pulse Power Dissipation

MMBTA28

Document number: DS30367 Rev. 10 - 2

2 of 6

www.diodes.com

February 2014

© Diodes Incorporated