Diodes MMBT6427 User Manual

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MMBT6427
NPN SURFACE MOUNT DARLINGTON TRANSISTOR

Features

Epitaxial Planar Die Construction
Ideal for Low Power Amplification and Switching
High Current Gain
"Green" Device (Notes 1 and 4)

Mechanical Data

Case: SOT-23
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
Terminal Connections: See Diagram
Marking (See Page 3): K1D
Ordering & Date Code Information: See Page 3
Weight: 0.008 grams (approximate)
Maximum Ratings @T
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
E
B
C
TOP VIEW
G H
B
A
E
D
C
B
C
K
J
E
L
V
CBO
V
CEO
V
EBO
IC
M
40 V 40 V 12 V
500 mA
SOT-23
Dim Min Max
A 0.37 0.51 B 1.20 1.40 C 2.30 2.50 D 0.89 1.03 E 0.45 0.60 G 1.78 2.05 H 2.80 3.00 J 0.013 0.10 K 0.903 1.10 L 0.45 0.61 M 0.085 0.180 α
0° 8°
All Dimensions in mm
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 2) @ TA = 25°C PD Thermal Resistance, Junction to Ambient (Note 2)@ TA = 25°C Operating and Storage Temperature Range
Electrical Characteristics @T
OFF CHARACTERISTICS (Note 3)
Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Collector Cutoff Current Emitter Cutoff Current
ON CHARACTERISTICS (Note 3)
DC Current Gain
Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage
Base-Emitter On Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance Input Capacitance
Notes: 1. No purposefully added lead. Halogen and Antimony Free.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
DS30048 Rev. 9 - 2 1 of 3
Characteristic Symbol Min Max Unit Test Condition
= 25°C unless otherwise specified
A
TJ, T
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
CEO
I
EBO
40 40
12
10,000 20,000
hFE
14,000
V
CE(SAT)
V
BE(SAT)
V
BE(ON)
C C
obo ibo
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R
JA
θ
STG
⎯ ⎯ ⎯
V V V
50 nA
1.0
μA
50 nA
100,000 200,000
140,000
1.2
1.5
V
2.0 V
1.75 V
8.0 Typical pF 15 Typical pF
Fire Retardants.
2O3
300 mW 417
-55 to +150
°C/W
°C
IC = 100μA, IE = 0 IC = 10mA, IB = 0 IE = 10μA, IC = 0 VCB = 30V, IE = 0 V
= 25V, IB = 0
CE
V
= 10V, IC = 0
EB
IC = 10mA, VCE = 5.0V IC = 100mA, V
CE
= 5.0V IC = 500mA, VCE = 5.0V IC = 50mA, IB = 0.5mA IC = 500mA, IB = 0.5mA IC = 500mA, IB = 0.5mA IC = 50mA, VCE =5.0V
VCB = 10V, f = 1.0MHz, IE = 0 VEB = 0.5V, f = 1.0MHz, IC = 0
MMBT6427
© Diodes Incorporated
400
350
300
250
200
150
100
D
P , POWER DISSIPATION (mW)
50
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
Fig. 1, Max Power Dissipation vs Ambient Temperature
1,000,000
100,000
10,000
FE
h , DC CURRENT GAIN
1,000
100
1000
A
1
I , COLLECTOR CURRENT (mA)
C
Fig. 3, DC Current Gain vs Collector Current
75
10
100 125
100
150
175
200
1000
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
CE(SAT)
V , COL L E C T O R T O E MITT E R
SA T U R ATION V O LTA G E (V )
0.45
0.40 1
I , COLLECTOR CURRENT (mA)
Fig. 2, Collector Emitter Saturation Voltage vs. Collector Current
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
BE(ON)
0.4
V , BASE EMITTER VOLTAGE (V)
0.3
0.2
0.1 1
C
Fig. 4, Base Emitter Voltage vs. Collector Current
10
I , COLLECTOR CURRENT (mA)
C
100
10
1000
100
100
10
T
f , GAIN BANDWIDTH PRODUCT (MHz)
1
110
Fig. 5, Gain Bandw idth Product vs Collector Curr ent
I , COLLECTOR CURRENT (mA)
C
100
DS30048 Rev. 9 - 2 2 of 3
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MMBT6427
© Diodes Incorporated
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