Features
• Epitaxial Planar Die Construction
• Complementary PNP Type Available (MMBT3906T)
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
Mechanical Data
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
• Terminal Connections: See Diagram
• Marking Information: 1N, See Page 3
• Ordering & Date Code Information: See Page 3
• Weight: 0.002 grams (approximate)
MMBT3904T
NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
A
C
TOP VIEW
B
G
H
K
J
D
C
B
E
C
B
SOT-523
Dim Min Max Typ
A 0.15 0.30 0.22
B 0.75 0.85 0.80
E
C 1.45 1.75 1.60
D
⎯ ⎯
0.50
G 0.90 1.10 1.00
N
M
H 1.50 1.70 1.60
J 0.00 0.10 0.05
L
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
0° 8°
α
All Dimensi mm ons in
⎯
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30270 Rev. 8 - 2
www.diodes.com
1 of 4
V
V
V
R
Tj, T
CBO
CEO
EBO
IC
Pd
JA
θ
STG
60 V
40 V
6.0 V
200 mA
150 mW
833 °C/W
-55 to +150
°C
MMBT3904T
© Diodes Incorporated
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Base Cutoff Current
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CEX
IBL
ON CHARACTERISTICS (Note 5)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
hFE
V
CE(SAT)
V
BE(SAT)
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Input Capacitance
Input Impedance
Voltage Feedback Ratio
Small Signal Current Gain
Output Admittance
Current Gain-Bandwidth Product
C
C
hie
hre
hfe
hoe
obo
ibo
fT
Noise Figure NF
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
Notes: 5. Short duration pulse test used to minimize self-heating effect.
td
tr
ts
tf
250
60
40
6.0
⎯
⎯
40
70
100
60
30
⎯
0.65
⎯
⎯
⎯
1.0 10
0.5 8.0 x 10-4
100 400
1.0 40
300
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
V
V
V
50 nA
50 nA
⎯
⎯
300
⎯
⎯
⎯
0.20
0.30
0.85
0.95
V
V
4.0 pF
8.0 pF
kΩ
⎯
μS
⎯
MHz
5.0 dB
35 ns
35 ns
200 ns
50 ns
15
IC = 10μA, IE = 0
IC = 1.0mA, IB = 0
IE = 10μA, IC = 0
V
= 30V, V
CE
V
= 30V, V
CE
IC = 100µA, V
EB(OFF)
EB(OFF)
= 1.0V
CE
= 3.0V
= 3.0V
IC = 1.0mA, VCE = 1.0V
IC = 10mA, VCE = 1.0V
IC = 50mA, V
CE
= 1.0V
IC = 100mA, VCE = 1.0V
IC = 10mA, IB = 1.0mA
IC = 50mA, IB = 5.0mA
IC = 10mA, IB = 1.0mA
IC = 50mA, IB = 5.0mA
VCB = 5.0V, f = 1.0MHz, IE = 0
VEB = 0.5V, f = 1.0MHz, IC = 0
V
= 10V, IC = 1.0mA,
CE
f = 1.0kHz
VCE = 20V, IC = 10mA,
f = 100MHz
= 5.0Vdc, IC = 100μAdc,
V
CE
= 1.0KΩ, f = 1.0MHz
R
S
VCC = 3.0V, IC = 10mA,
V
= - 0.5V, IB1 = 1.0mA
BE(off)
VCC = 3.0V, IC = 10mA
IB1 = IB2 = 1.0mA
200
N (mW)
150
A
E (pF)
10
A
DISSI
100
WE
,
d
50
0
0100200
T , AMBIENT TEMPERATURE (°C)
A
Fig. 1, Power Derating Curve
DS30270 Rev. 8 - 2
2 of 4
www.diodes.com
5
, I
IBO
OBO
C , OUTPUT CAPACITANCE (pF)
0
0.1
V , COLLECTOR-BASE VOLTAGE (V)
CB
1
10
100
Fig. 2, Input and Output Capacitance vs.
Collector-Base Voltage
© Diodes Incorporated
MMBT3904T