Features
• Epitaxial Planar Die Construction
• Complementary PNP Type Available (MMBT2907AT)
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
Mechanical Data
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
• Terminal Connections: See Diagram
• Marking Information: 1P, See Page 4
• Ordering & Date Code Information: See Page 4
• Weight: 0.002 grams (approximate)
MMBT2222AT
NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
A
C
TOP VIEW
B
K
J
E
G
H
D
C
B
E
C
B
SOT-523
Dim Min Max Typ
A 0.15 0.30 0.22
B 0.75 0.85 0.80
C 1.45 1.75 1.60
D
⎯ ⎯
0.50
G 0.90 1.10 1.00
N
L
M
H 1.50 1.70 1.60
J 0.00 0.10 0.05
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
0° 8°
α
All Dimensi mm ons in
⎯
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30268 Rev. 10 - 2
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1 of 4
V
V
V
R
Tj, T
CBO
CEO
EBO
IC
Pd
JA
θ
STG
75 V
40 V
6.0 V
600 mA
150 mW
833 °C/W
-55 to +150
°C
MMBT2222AT
© Diodes Incorporated
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Base Cutoff Current
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CEX
IBL
ON CHARACTERISTICS (Note 5)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
hFE
V
CE(SAT)
V
BE(SAT)
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Input Capacitance
Current Gain-Bandwidth Product
Input Impedance
Voltage Feedback Ratio
Small-Signal Current Gain
Output Admittance
C
C
hie
hre
hfe
hoe
obo
ibo
fT
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
Notes: 5. Short duration pulse test used to minimize self-heating effect.
td
tr
ts
tf
250
75
40
6.0
⎯
⎯
35
50
75
100
40
⎯
0.6
⎯
⎯
— 30 pF
300
0.25 1.25
⎯
75 375
25 200
⎯
⎯
⎯
⎯
⎯
⎯
⎯
10 nA
20 nA
⎯
⎯
⎯
300
⎯
0.3
1.0
1.2
2.0
8 pF
⎯
4.0 X 10
10 ns
25 ns
225 ns
60 ns
1,000
V
IC = 10μA, IE = 0
V
IC = 10mA, IB = 0
V
IE = 10μA, IC = 0
V
= 60V, V
CE
V
= 60V, V
CE
IC = 100μA, V
EB(OFF)
EB(OFF)
= 10V
CE
= 3.0V
= 3.0V
IC = 1.0mA, VCE = 10V
⎯
IC = 10mA, VCE = 10V
IC = 150mA, V
CE
= 10V
IC = 500mA, VCE = 10V
IC = 150mA, IB = 15mA
V
IC = 500mA, IB = 50mA
IC = 150mA, IB = 15mA
V
IC = 500mA, IB = 50mA
VCB = 10V, f = 1.0MHz, IE = 0
VEB = 0.5V, f = 1.0MHz, IC = 0
VCE = 20V, IC = 20mA,
MHz
f = 100MHz
kΩ
VCE = 10 Vdc, IC = 10 mAdc, f = 1.0kHz
-4
= 10 Vdc, IC = 10 mAdc, f = 1.0kHz
V
CE
⎯
VCE = 10 Vdc, IC = 10 mAdc, f = 1.0kHz
μS
VCE = 10 Vdc, IC = 10 mAdc, f = 1.0kHz
VCC = 30V, IC = 150mA,
V
= - 0.5V, IB1 = 15mA
BE(off)
VCC = 30V, IC = 150mA,
IB1 = IB2 = 15mA
200
N (mW)
I
DISSI
WE
d
150
100
50
0
0
40
T , AMBIENT TEMPERATURE (°C)
A
80 120 160 200
Fig. 1 Power Derating Curve
100
E
FE
h, D
10
1
0.1
T = 125°C
A
T = +25°C
T = -25°C
A
I , COLLECTOR CURRENT (mA)
A
1
C
10
Fig. 2 Typical DC Current Gain vs.
Collector Current
V = 1.0V
100
CE
1,000
DS30268 Rev. 10 - 2
2 of 4
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MMBT2222AT
© Diodes Incorporated