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MMBT123S
1A NPN SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Ideal for Medium Power Amplification and Switching
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 2 and 4)
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
• Terminal Connections: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.008 grams (approximate)
Maximum Ratings @T
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
= 25°C unless otherwise specified
A
A
C
TOP VIEW
B
E
E
D
G
H
C
B
V
CBO
V
CEO
V
EBO
IC
PD
R
JA
θ
TJ, T
STG
B
C
SOT-23
Dim Min Max
A 0.37 0.51
B 1.20 1.40
C 2.30 2.50
D 0.89 1.03
K
J
L
M
E 0.45 0.60
G 1.78 2.05
H 2.80 3.00
J 0.013 0.10
K 0.903 1.10
L 0.45 0.61
M 0.085 0.180
α
E
All Dimensions in mm
0° 8°
45 V
18 V
5 V
1 A
300 mW
417
-55 to +150
°C/W
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 3)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
ON CHARACTERISTICS (Note 3)
DC Current Gain
Collector-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Current Gain-Bandwidth Product
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead. Halogen and Antimony Free.
3. Short duration pulse test used to minimize self-heating effect.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
DS30292 Rev. 7 - 2 1 of 3
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
hFE
V
CE(SAT)
C
fT
obo
45
18
5
⎯
⎯
150 800
⎯
⎯
100
www.diodes.com
⎯
⎯
⎯
1
1
0.5 V
8 pF
⎯
Fire Retardants.
2O3
V
IC = 100μA, IE = 0
V
IC = 1mA, IB = 0
V
IE = 100μA, IC = 0
μA
VCB = 40V, IE = 0
μA
V
= 4V, IC = 0
EB
⎯
IC = 100mA, V
IC = 300mA, IB = 30mA
VCB = 10V, f = 1.0MHz, IE = 0
VCB = 10V, IE = 50mA,
MHz
f = 100MHz
CE
= 1V
MMBT123S
© Diodes Incorporated
400
Note 1
350
300
N (mW)
I
250
A
1000
AI
DISSI
D
)
E (p
100
200
150
100
50
10
100
FE
h, D
V = 1.0V
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
150
175
200
Fig. 1, Max Power Dissipation vs
Ambie nt Temperature
1
0.0001
0.001
I , COLLECTOR CURRENT (A)
C
0.01
0.1
Fig. 2, Typical DC Current Gain vs
Collector Current
CE
1
10
1000
f = 1MHz
-EMI
100
LLE
10
CE (SAT)
OBO
1
CB
1
10
100
0.1
V , COLLECTOR-BASE VOLTAGE (V)
Fig. 3, Output Capacitance vs.
Collector-Base Voltage
SATURATION VOLTAG E (mV )
V,
1
0.0001 0.001 0.01 0.1 1
I , COLLECTOR CURRENT (A)
C
Fig. 4, Collector Saturation V oltage vs
Collector Current
10
DS30292 Rev. 7 - 2 2 of 3
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MMBT123S
© Diodes Incorporated