Diodes MMBD4448HCQW, MMBD4448HAQW, MMBD4448HADW, MMBD4448HCDW, MMBD4448HSDW User Manual

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Features

• Fast Switching Speed

• Low Forward Voltage: Maximum of 0.72V at 5mA

• Low Reverse Current: Maximum of 100nA at 70V

• Fast Reverse Recovery: Maximum of 4ns

• Low Capacitance: Maximum of 3.5pF

• Small Surface Mount Package

• For General Purpose Switching Applications

• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

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SURFACE MOUNT FAST SWITCHING DIODE ARRAY

Mechanical Data

• Case: SOT353 or SOT363

• Case Material: Molded Plastic, “Green” Molding Compound.

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

• Orientation: See Diagrams Below

• Weight: 0.006 grams (approximate)

SOT353/SOT363

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2

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MMBD4448HCQW /AQW

ADW /CDW /SDW /TW

UL Flammability Classification Rating 94V-0

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

AC

C

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2

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2

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2

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e3

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AC

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2

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1

SOT-353

TOP VIEW

SOT-363

TOP VIEW

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4

3

MMBD4448HCQW MMBD4448HAQW MMBD4448HADW MMBD4448HCDW MMBD4448HSDW MMBD4448HTW

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4

3

C

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1

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2

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NC

Ordering Information (Note 4)

Part Number Qualification Case Packaging

MMBD4448HADW-7-F Commercial SOT363 3000/Tape & Reel

MMBD4448HADWQ-7-F Automotive SOT363 3000/Tape & Reel

MMBD4448HAQW-7-F Commercial SOT363 3000/Tape & Reel
MMBD4448HCDW-7-F Commercial SOT363 3000/Tape & Reel
MMBD4448HCQW-7-F Commercial SOT353 3000/Tape & Reel
MMBD4448HSDW-7-F Commercial SOT363 3000/Tape & Reel

MMBD4448HTW-7-F Commercial SOT363 3000/Tape & Reel

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com.

Marking Information

KXX = Product Type Marking Code,
ex. KA5 = MMBD4448HAQW
KAA = MMBD4448HTW

YM

YM = Date Code Marking
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)

KA4

SOT-353

KA4 = Product Type Marking Code,
KA4 = MMBD4448HCQW
YM = Date Code Marking

YM

Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)

KXX

SOT-363

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3

2

KXX = Product Type Marking Code,
ex. KA6 = MMBD4448HADW

KXX YM

KXX YM

KA7 = MMBD4448HCDW
KAB = MMBD4448HSDW
YM = Date Code Marking
Y = Year (ex: Z = 2012)

SOT-363

M = Month (ex: 9 = September)

Date Code Key

Year 2000 2001 2002 2003 ….. 2012 2013 2014 2015 2016 2017 2018 2019

Code L M N P ….. Z A B C D E F G

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

MMBD4448HCQW /AQW
/ADW /CDW /SDW /TW

1 of 4

www.diodes.com

Document number: DS30153 Rev. 18 - 2

July 2012

© Diodes Incorporated

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θ

(BR)

r

P

P

OWER

PATIO

N

T

T

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U

F

O

R

RD CUR

RENT

Maximum Ratings (@T

= +25°C, unless otherwise specified.)

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Characteristic Symbol Value Unit

Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage
DC Blocking Voltage

RMS Reverse Voltage
Forward Continuous Current (Note 5)
Non-Repetitive Peak Forward Surge Current @ t = 1.0µs

@ t = 1.0s

V
V
V

V

R(RMS

I

RM

RRM

RWM

V

R

I

FM

FSM

ADW /CDW /SDW /TW

100 V

80 V

57 V

500 mA

4.0

1.0

A

Thermal Characteristics

Characteristic Symbol Value Unit

MMBD4448HCQW /AQW

Power Dissipation (Note 5)
Thermal Resistance Junction to Ambient Air (Note 5)
Operating and Storage Temperature Range

P

D

R

JA

, T

T

J

STG

Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Min Max Unit Test Condition

Reverse Breakdown Voltage (Note 6)

Forward Voltage

V

V

F

80

R

0.62

⎯

⎯

⎯

⎯

0.72

0.855

1.0

1.25
100

Reverse Current (Note 6)

I

⎯

R

50
30
25

Total Capacitance
Reverse Recovery Time

Notes: 5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which

can be found on our website at http://www.diodes.com.

6. Short duration pulse test used to minimize self-heating effect.

C

⎯

T

t

⎯

r

3.5 pF

4.0 ns

250

Note 5

1,000

(mA)

200

(mW)

100

200 mW
625 °C/W

-65 to +150 °C

V

IR = 100µA

= 5.0mA

I

F

= 10mA

I

F

V

I

= 100mA

F

= 150mA

I

F

V

= 70V

nA
µA
µA
nA

R

V

= 75V, TJ = +150°C

R

= 25V, TJ = +150°C

V

R

V

= 20V

R

VR = 6V, f = 1.0MHz
VR = 6V, IF = 5mA

150

WA

10

DISSI

100

,

50

D

S

ANE

1

AN

0

0120

T , AMBIENT TEMPERATURE ( C)

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Figure 1 Power Derating Curve, Total Package

1608040

200

°

I, INS

0.1

F

0

V , INSTANTANEOUS FORWARD VOLTAGE (V)

F

Figure 2 Typical Forw ar d C haracteristics

1.20.4 0.8

1.6

MMBD4448HCQW /AQW
/ADW /CDW /SDW /TW

Document number: DS30153 Rev. 18 - 2

2 of 4

www.diodes.com

July 2012

© Diodes Incorporated

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TANT

O

US R

R

CUR

RENT

C, TOT

C

P

C

T

C

F

T, R

R

REC

OVER

Y T

10,000

(nA)

1,000

T = 125ºC

A

3

2.5

)

E (p

T = 75ºC

100

SE

A

EVE

T = 25ºC

10

ANE

1

R

0.1

I , INS

0

20 40

V , INSTANTANEOUS REVERSE VOLTAGE (V)

R

Figure 3 Typical Reverse Characteristics

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T = 0ºC

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T = -40ºC

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60 80 100

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AN
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1.5

A
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1

T

0.5

0

0

Figure 4 Total Capacitance vs . Reverse Volt age

10 20 40

V , DC REVERSE VOLTAGE (V)

R

2.5

ADW /CDW /SDW /TW

30

MMBD4448HCQW /AQW

2.0

IME (nS)

1.5

1.0

SE

EVE

0.5

rr

0

046

Figure 5 Reverse Recovery Time vs. Forward Current

210
I , FORWARD CURRENT (mA)

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Package Outline Dimensions

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H

K

J

B C

M

D

L

F

8

SOT-353

Dim Min Max

A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Typ

F 0.40 0.45

H 1.80 2.20

J 0 0.10

K 0.90 1.00

L 0.25 0.40

M 0.10 0.22

α

0° 8°

All Dimensions in mm

A

SOT-363

Dim Min Max

B C

A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Typ

H

K

M

F 0.40 0.45
H 1.80 2.20
J 0 0.10
K 0.90 1.00
L 0.25 0.40

J

D

L

F

M 0.10 0.22

α

0° 8°

All Dimensions in mm

MMBD4448HCQW /AQW
/ADW /CDW /SDW /TW

Document number: DS30153 Rev. 18 - 2

3 of 4

www.diodes.com

July 2012

© Diodes Incorporated

/

ADW /CDW /SDW /TW

Suggested Pad Layout

MMBD4448HCQW /AQW

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Z

Y

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2012, Diodes Incorporated

www.diodes.com

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2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

C2C2

Dimensions Value (in mm)

C1

SOT-353

Z 2.5
G 1.3
X 0.42
Y 0.6

C1 1.9
C2 0.65

IMPORTANT NOTICE

Z

LIFE SUPPORT

G

Y

X

C2

C2

C1

Dimensions Value (in mm)

SOT-363

Z 2.5
G 1.3
X 0.42
Y 0.6

C1 1.9
C2 0.65

MMBD4448HCQW /AQW
/ADW /CDW /SDW /TW

Document number: DS30153 Rev. 18 - 2

4 of 4

www.diodes.com

July 2012

© Diodes Incorporated