Features
• Epitaxial Planar Die Construction
• Built-In Biasing Resistors
• One 500mA PNP and One 100mA NPN
• Lead Free/RoHS Compliant (Note 1)
• "Green" Device (Note 3 and 4)
Mechanical Data
• Case: SOT-363
• Case Material - Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020A
NEW PPRODRODUCT T UC
• Terminals: Finish - Solderable per MIL-STD-202,
Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
• Marking Code: C73 See Page 4
• Ordering & Date Code: See Page 4
• Terminal Connections: See Diagram
• Weight: 0.015 grams (approximate)
P/N R1 R2
MIMD10A Tr1
Tr2
0.1K
10K
10K
-
MIMD10AMIMD10A
DUAL PRE-BIASED TRANSISTORS FOR POWER MANAGEMENT
A
C
B
2
1
E
B
2
2
H
K
J
D
SCHEMATIC DIAGRAM
E
1
SOT-363
Dim Min Max
A 0.10 0.30
C
B
B 1.15 1.35
C 2.00 2.20
C
1
D 0.65 Nominal
F 0.30 0.40
H 1.80 2.20
M
J
K 0.90 1.00
⎯
0.10
L 0.25 0.40
L
F
T
R
R
r2
1
2
R
T
1
r1
M 0.10 0.25
0°
α
All Dime sions in mmn
8°
Maximum Ratings PNP Section Tr1 @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Supply Voltage
Input Voltage
Output Current
Maximum Ratings NPN Section Tr2 @T
= 25°C unless otherwise specified
A
VCC
VIN
IO
-5 to +5 V
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Maximum Ratings - Total @T
= 25°C unless otherwise specified
A
V
CBO
V
CEO
V
EBO
IC
Characteristic Symbol Value Unit
Power Dissipation (Note 2)
Operating and Storage Temperature Range
Notes: 1. No purposefully added lead.
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30381 Rev. 8 - 2
2. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
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Tj, T
Pd
STG
-55 to +150 °C
-50 V
-500 mA
50 V
50 V
5 V
100 mA
200 mW
© Diodes Incorporated
MIMD10A
Electrical Characteristics PNP Section Tr1 @T
Characteristic Symbol Min Typ Max Unit Test Condition
Input Voltage
Output Voltage
Input Current
Output Current
DC Current Gain
Gain-Bandwidth Product*
* Transistor - For Reference Only
NEW PRODUCT
Electrical Characteristics NPN Section Tr2 @T
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Emitter Cutoff Current
Collector-Emitter Saturation Voltage
V
DC Current Transfer Ratio
Gain-Bandwidth Product*
* Transistor - For Reference Only
DS30381 Rev. 8 - 2
= 25°C unless otherwise specified
A
V
V
V
l(off)
l(on)
O(on)
-0.3
⎯ ⎯
⎯
Il ⎯ ⎯
I
⎯ ⎯
O(off)
Gl
68
fT ⎯
= 25°C unless otherwise specified
A
BV
BV
BV
I
CBO
I
EBO
CE(sat)
hFE
CBO
CEO
EBO
50
50
5
⎯ ⎯
⎯ ⎯
⎯ ⎯
100 250 600
fT ⎯
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⎯ ⎯ VCC = -5V, IO = -100μA
V
-1.5
-0.1 -0.3 V
-25 mA
-0.5
VO = 0.3, IO = -100mA
IO = -100mA/-5mA
VI = -2V
μA
VCC = -50V, VI = 0V
⎯ ⎯ ⎯
200
⎯ ⎯
⎯ ⎯
⎯ ⎯
250
0.5
0.5
0.3 V
⎯
⎯
MHz
V
V
V
μA
μA
⎯
MHz
VCE = -10V, IE = -50mA, f = 100MHz
IC = 50μA
IC = 1mA
IE = 50μA
VCB = 50V
VEB = 4V
IC/IB = 10mA / 1.0mA
IC = 1mA, VCE = 5V
VCE = 10V, IE = -5mA, f = 100MHz
⎯
© Diodes Incorporated
MIMD10A