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DPLS160
Features
• Epitaxial Planar Die Construction
• Complementary NPN Type Available (DNLS160)
• Surface Mount Package Suited for Automated Assembly
• Lead Free/RoHS Compliant (Note 1)
• "Green Device" (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
NEW PRODUCT
• Terminals: Finish ⎯ Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.008 grams (approximate)
Maximum Ratings@T
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Peak Pulse Collector Current
Base Current (DC)
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
LOW V
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
PNP SURFACE MOUNT TRANSISTOR
CE(SAT)
SOT-23
B
Schematic and Pin Configuration
C
E
-80 V
-60 V
-5 V
-1 A
-2 A
-300 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 3) @ TA = 25°C PD
Thermal Resistance, Junction to Ambient (Note 3) @ TA = 25°C
Operating and Storage Temperature Range
Notes: 1. No purposefully added lead.
DS31389 Rev. 4 - 2 1 of 4
2. Diode’s Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document
AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Notes: 5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
PK1 = Product Type Marking Code
PK1
Date Code Key
Year200820092010 2011 2012 2013 2014 2015
NEW PRODUCT
Code V W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
YM = Date Code Marking
Y = Year ex: U = 2007
YM
M = Month ex: 9 = September
Package Outline Dimensions
K
J
A
Dim Min Max
C
B
G
H
M
L
F
D
SOT-23
A 0.37 0.51
B 1.20 1.40
C 2.30 2.50
D 0.89 1.03
F 0.45 0.60
G 1.78 2.05
H 2.80 3.00
J 0.013 0.10
K 0.903 1.10
L 0.45 0.61
M 0.085 0.180
α
All Dimensions in mm
0° 8°
Suggested Pad Layout
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.