Maximum Ratings – Q1@TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Drain-Source Voltage
Gate-Source Voltage
T
Continuous Drain Current (Note 4) VGS = 10V
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4.5V
Pulsed Drain Current (Note 6)
Avalanche Current (Notes 6 & 7)
Repetitive Avalanche Energy (Notes 6 & 7) L = 0.1mH
Steady
State
Steady
State
Steady
State
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
DMS3017SSD
V
DSS
V
GSS
I
D
I
D
I
D
I
DM
I
AR
E
AR
30 V
±20 V
8.0
6.5
10
7.8
8.7
7.0
A
A
A
60 A
16 A
12.8 mJ
Maximum Ratings – Q2@TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 4) VGS = 10V
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4.5V
Pulsed Drain Current (Note 6)
Avalanche Current (Notes 6 & 7)
Repetitive Avalanche Energy (Notes 6 & 7) L = 0.1mH
Steady
State
Steady
State
Steady
State
T
= 25°C
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
D
I
DM
I
AR
E
AR
30 V
±20 V
6.0
4.7
7.2
6.0
6.0
5.0
A
A
A
60 A
16 A
12.8 mJ
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient @T
= 25°C (Note 4) R
A
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @T
= 25°C (Note 5) R
A
Operating and Storage Temperature Range
Notes: 4. Device mounted on FR-4 substrate PC board, with minimum recommended pad layout. The value in any given application depends on the user’s specific
board design. Device contains two active die running at equal power.
5. Device mounted on 1 inch x 1 inch FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. Device contains two active die running
at equal power.
6. Repetitive rating, pulse width limited by junction temperature.
7. I
and EAR rating are based on low frequency and duty cycles to keep TJ = 25°C