Diodes DMS2220LFDB User Manual

G
P-CHANNEL ENHANCEMENT MODE MOSFET WITH INTEGRATED SBR
Features
Low On-Resistance
95mΩ @V
120mΩ @V
86mΩ (typ) @V
Low Gate Threshold Voltage, -1.3V Max
Fast Switching Speed
Low Input/Output Leakage
Incorporates Low V
Low Profile, 0.5mm Max Height
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
= -4.5V
GS
= -2.5V
GS
= -1.8V
GS
Super Barrier Rectifier (SBR)
F
U-DFN2020-6
Type B
Bottom View
Mechanical Data
Case: U-DFN2020-6 Type B
Case Material: Molded Plastic, “Green” Molding Compound. UL
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
Weight: 0.0065 grams (approximate)
ANCD
123
Q1
D1
456
S
Top View
Internal Schematic
K
SUPER BARRIER RECTIFIER
Flammability Classification Rating 94V-0
e4
per MIL-STD-202, Method 208
A
KD
Bottom View
Pin Configuration
NC
D
S
GK
®
Ordering Information (Note 4)
Part Number Case Packaging
DMS2220LFDB-7 U-DFN2020-6 Type B 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
SBR is a registered trademark of Diodes Incorporated.
ME
DMS2220LFDB
Document number: DS31546 Rev. 9 - 2
ME = Marking Code YM = Date Code Marking Y = Year (ex: V = 2008)
YM
M = Month (ex: 9 = September) Dot denotes Pin 1
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)
)
(BR)
Maximum Ratings – TOTAL DEVICE (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
P
D
R
θJA
T
, T
J
STG
1.4 W 89 °C/W
-55 to +150 °C
Maximum Ratings – P-CHANNEL MOSFET – Q1 (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage Drain Current (Note 5) Pulsed Drain Current (Note 6)
V
DSS
V
GSS
I
D
I
DM
-20 V
±12 V
-3.5 A
-12 A
Maximum Ratings – SBR – D1 (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
V
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current Non-Repetitive Peak Forward Surge Current
8.3ms single half sine-wave superimposed on rated load
Electrical Characteristics – P-CHANNEL MOSFET – Q1 (@T
V
V
R(RMS
I
RRM
RWM
V
R
I
O
FSM
20 V
= +25°C, unless otherwise specified.)
A
14 V
1 A
3 A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
I
DSS
DSS
GSS
-20 — — V — — -1 µA
— —
— —
±100 ±800
VGS = 0V, ID = -250µA VDS = -20V, VGS = 0V
= ±8V, VDS = 0V
V
GS
nA
V
= ±12V, VDS = 0V
GS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage (Note 7)
V
GS(th
R
DS(ON)
|Y V
-0.45 — -1.3 V
60 74 86
SD
— — —
— 8 — S
|
fs
— 0.7 -1.2 V
95
120
VDS = VGS, ID = -250µA
= -4.5V, ID = -2.8A
V
GS
VGS = -2.5V, ID = -2.0A
m
VGS = -1.8V, ID = -1.0A
VDS = -5V, ID = -2.8A VGS = 0V, IS = -1.6A
DYNAMIC CHARACTERISTICS
Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
— 632 — pF — 65 — pF — 54 — pF
= -10V, VGS = 0V
V
DS
f = 1.0MHz
Electrical Characteristics – SBR – D1 (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 7)
Forward Voltage
Reverse Current (Note 7)
Notes: 5. Device mounted on FR-4 PCB, on minimum recommended, 2oz Copper pad layout.
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.
V
V
F
I
R
20 — — V
R
— —
— —
— — 100 µA
0.45
0.52
V
IR = 1mA
= 0.5A
I
F
= 1.0A
I
F
VR = 20V
SBR is a registered trademark of Diodes Incorporated.
DMS2220LFDB
Document number: DS31546 Rev. 9 - 2
2 of 7
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January 2013
© Diodes Incorporated
RAIN CUR
REN
T
R
CUR
RENT
R
RAIN-SOUR
CE O
N-R
TAN
C
R
RAIN-SOUR
CE O
N-R
TAN
C
R
R
OUR
C
Q1 - P-CHANNEL MOSFET
10
8
(A)
V = -8.0V
GS
V = -4.5V
GS
V = -2.5V
GS
V = -2.0V
GS
6
V = -1.5V
GS
-I , D
4
D
2
V = -1.2V
V = -1.0V
0
01 2 3 45
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 1 Typical Output Characteristics
0.14
Ω
GS
GS
E ( )
0.12
10
V = -5V
DS
8
(A)
6
AIN
4
D
-I , D
2
0
0.5 1.0 1.5 2.0
0.14
Ω
T = 150°C
A
T = 125°C
A
-V , GATE SOURCE VOLTAGE (V)
GS
Fig. 2 Typical Transfer Characteristics
T = 85°C
T = 25°C
A
T = -55°C
A
A
E ( )
0.12
0.1
ESIS
0.08
V = -1.8V
GS
V = -2.5V
0.06
GS
V = -4.5V
GS
0.04
, D
0.02
DS(ON)
0
012345678
-I , DRAIN CURRENT (A)
D
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
1.6
1.4
E
AIN-S
, D
DS(ON)
1.2
1.0
0.8
ON-RESISTANCE (NORMALIZED)
V = -2.5V
GS
I = -2A
D
V = -4.5V
GS
I = -5A
D
0.1
ESIS
T = 125°C
A
T = 150°C
A
0.08
T = 85°C
0.06
0.04
T = -55°C
A
T = 25°C
A
A
, D
0.02
DS(ON)
0
01234 5678
-I , DRAIN CURRENT (A)
D
Fig. 4 Typical Drain-Source On-Resistance
vs. Drain Current and Temperature
Ω
0.11
0.09
V = -2.5V
GS
I = -2A
D
0.07
V = -4.5V
GS
I = -5A
D
0.05
0.6
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE (°C)
J
Fig. 5 On-Resistance Variation with Temperature
DS(ON)
0.03
R , DRAIN-SOURCE ON-RESISTANCE ( )
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE (°C)
J
Fig. 6 On-Resistance Variation with Temperature
SBR is a registered trademark of Diodes Incorporated.
DMS2220LFDB
Document number: DS31546 Rev. 9 - 2
3 of 7
www.diodes.com
January 2013
© Diodes Incorporated
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