Diodes DMS2095LFDB User Manual

Product Summary
MOSFET
V
R
(BR)DSS
95mΩ @ V
-20V
VR V
20V
120mΩ @ VGS = -2.5V
150mΩ @ VGS = -1.8V
SCHOTTKY DIODE
400mV @ I
470mV @ IF = 1.0A
DS(on) max
I
= -4.5V
GS
IO
F max
= 0.5A
F
Description and Applications
This new generation MOSFET has been designed to minimize the on-
state resistance (R
performance, making it ideal for high efficiency power management
applications.
Power management functions
) and yet maintain superior switching
DS(ON)
U-DFN2020-6
Type B
S
D
D
NC
A
Pin1
Bottom View
G
K
D
-3.4A
-3.0A
-2.7A
1.0A
K
DMS2095LFDB
P-CHANNEL ENHANCEMENT MODE MOSFET
WITH INTEGRATED SCHOTTKY DIODE
Features and Benefits
MOSFET with Low R
Low Gate Threshold Voltage, -1.3V Max
Schottky Diode with Low Forward Voltage Drop
Low Profile, 0.5mm Max Height
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
– minimize conduction losses
DS(ON)
Mechanical Data
Case: U-DFN2020-6 Type B
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.0065 grams (approximate)
D
e4
A
G
S
Q1 P-MOSFET
D1 SCHOTTKY DIODE
K
Ordering Information (Note 4)
Part Number Case Packaging
DMS2095LFDB-7 U-DFN2020-6 Type B 3,000/Tape & Reel
DMS2095LFDB-13 U-DFN2020-6 Type B 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
MS2
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
MS2 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: V = 2008)
YM
M = Month (ex: 9 = September)
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April 2014
© Diodes Incorporated
Maximum Ratings – P-CHANNEL MOSFET – Q1 (@T
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage (Note 5)
Steady
Continuous Drain Current (Note 7) VGS = -4.5V
State
t<10s
Maximum Body Diode Forward Current (Note 7)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Ratings – SCHOTTKY – D1 (@T
A
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
Average Rectified Output Current (Note 7, t<10s)
Peak Repetitive Forward Current (Note 7, t<10s)
Non-Repetitive Peak Forward Surge Current (Note 7, t<10s) Single half sine-wave superimposed on rated load
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
= +25°C
T
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient (Note 7)
A
TA = +70°C
Steady State
t<10s 114
= +25°C
T
A
TA = +70°C
Steady State
t<10s 57
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Notes: 5. AEC-Q101 VGS maximum is ±9.6V
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
www.diodes.com
= +25°C, unless otherwise specified.)
A
V
DSS
V
GSS
= +25°C
T
A
= +70°C
T
A
T
= +25°C
A
= +70°C
T
A
I
D
I
D
I
S
I
DM
= +25°C, unless otherwise specified.)
V
RRM
V
RWM
V
R
I
O
I
FRM
I
FSM
P
D
R
JA
θ
P
D
R
JA
θ
R
JC
θ
T
J, TSTG
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DMS2095LFDB
-20 V
±12 V
-3.4
-2.7
-3.9
-3.1
-1 A
-10 A
20 V
1 A
2 A
20 A
0.81
0.52
154
1.64
1.04
77
27.5 °C/W
-55 to +150 °C
A
A
W
°C/W
W
°C/W
April 2014
© Diodes Incorporated
Electrical Characteristics – P-CHANNEL MOSFET – Q1 (@T
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
-20
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
V
GS(th)
-0.4
Static Drain-Source On-Resistance
R
DS (ON)
⎯ ⎯
Diode Forward Voltage
V
SD
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
C
iss
C
oss
C
rss
R
g
Q
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
Electrical Characteristics – SCHOTTKY – D1 (@T
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 8)
Forward Voltage (Note 8)
Reverse Current (Note 8)
Notes: 8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing
V
(BR)R
V
F
I
R
20 35
⎯ ⎯
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
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www.diodes.com
= +25°C, unless otherwise specified.)
A
0.40
0.47
V
VGS = 0V, ID = -250μA
VDS = -20V, VGS = 0V
nA
VGS = ±12V, VDS = 0V
VDS = VGS, ID = -250μA
V
= -4.5V, ID = -2.8A
GS
mΩ
VGS = -2.5V, ID = -2.0A
VGS = -1.8V, ID = -1.0A
VGS = 0V, IS = -1.0A
pF
= -10V, VGS = 0V
V
pF
pF
nC
nC
nC
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
V
= -4.5V, VDS = -10V,
GS
= -2.5A
I
D
ns
ns
ns
= -10V, VGS = -4.5V,
V
DD
= 4Ω, RG = 6
R
L
ns
ns
nC
= -2.5A, di/dt = 100A/μs
I
F
V
V
-1 μA
±800
48 65 90
-1.3 V
95 120 150
-0.42 -1.2 V
561
78
66
59.5
7.0
0.9
1.7
5.3
5.8
69
54
12.4
3.7
= +25°C, unless otherwise specified.)
A
— —
30 80 μA
DMS2095LFDB
IR = 1mA
= 0.5A
I
F
I
= 1.0A
F
VR = 20V
April 2014
© Diodes Incorporated
R
A
CUR
R
E
A
RAIN C
URREN
T
R
R
OUR
ON-R
R
R
OUR
ON-R
R
R
N
SOURC
E
R
R
A
SOU
R
C
E
ON-R
E
SIS
A
C
E
DMS2095LFDB
MOSFET Characteristics
10.0
V= -4.5V
GS
V= -2.5V
GS
V= -3.0V
GS
V= -4.0V
GS
)
NT (
IN
D
I, D
8.0
6.0
4.0
2.0
0.0 0 0.5 1 1.5 2 2.5 3
V , DRAIN -SOURCE VOLTAGE (V)
DS
V= -2.0V
GS
V= -1.2V
GS
Figure 1 Typical Output Characteristics
0.2
Ω
0.18
V= -1.5V
GS
V= -1.0V
GS
10
V = -5.0V
DS
9
8
7
(A)
6
5
4
3
D
I, D
2
1
0
0 0.5 1 1.5 2 2.5 3
T = 150CA°
T = 125CA°
V , GATE-SOURCE VOLTAGE (V)
GS
T = 85CA°
T = 25CA°
T = -55CA°
Figure 2 Typical Transfer Characteristics
0.1
V = -4.5V
Ω
0.09
GS
0.16
0.14
ESISTANCE ( )
V = -1.8V
GS
V = -2.5V
GS
CE
AIN-S
, D
0.12
0.1
0.08
0.06
0.04
0.02
DS(ON)
0
12345678910
I , DRAIN SOURCE CURRE NT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
1.6
V = -4.5V
GS
I = -3A
D
1.2
-
AI
, D
0.8
DS(ON)
V = -4.5V
GS
V = -2.5V
GS
I = -1A
D
0.08
0.07
ESISTANCE ( )
T = 125CA°
T = 150CA°
T = 85CA°
0.06
T = 25CA°
T = -55CA°
CE
AIN-S
, D
0.05
0.04
0.03
0.02
0.01
DS(ON)
0
012345678910
I , DRAIN SOURCE CURRENT (A)
D
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.12
Ω
()
0.1
N T
IN-
0.08
0.06
0.04
-2.5
V= V
GS
-1
I= A
D
V = -4.5V
GS
I= A
-3
D
ON-RESISTANCE (NORMALIZED)
0.4
-50 -25 0 25 50 75 100 125 150
T, JUNCTION TEMPERATURE (C)J°
Figure 5 On-Resistance Variation with Temperature
, D
0.02
DS(on)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Figure 6 On-Resistance Variation with Temperature
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
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© Diodes Incorporated
G
A
R
O
O
A
G
URCE CUR
R
N
GAT
E-S
OURCE VOLTAG
E
R
S
E
H
E
R
M
R
E
S
S
C
E
DMS2095LFDB
MOSFET Characteristics (cont.)
1
E (V)
0.8
LT
LD V
ESH
0.6
-I = 250µA
D
-I = 1 mAD
0.4
TE TH
0.2
GS(TH)
V,
0
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
Figure 7 Gate Threshold Variation vs. Ambient Temperature
10000
f = 1MHz
10
9
8
7
T (A) E
6
5
4
3
S
I, SO
2
1
0
0 0.3 0.6 0.9 1.2 1.5
T= 150CA°
T= 125CA°
T= 85CA°
V , SOURCE-DRAIN VOLTAGE (V)
SD
T= 25CA°
T= -55CA°
Figure 8 Diode Forward Voltage vs. Current
10
9
1000
100
C
T
C , JUNCTION CAPACITANCE (pF)
10
0 2 4 6 8 101214 161820
V , DRAIN-SOURCE VOLTAGE (V)
DS
rss
Figure 9 Typical Junction Capacitance
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
TAN I
0.1
D = 0.1
AL
D = 0.05
8
(V)
7
C
iss
C
oss
6
5
4
V = -10V
DS
I= -2.5A
D
3
2
GS
V,
1
0
0 3 6 9 12 15
Q , TOTAL GATE CHARGE (nC)
g
Figure 10 Gate-Charge Characteristics
D = 0.02
NT T I
0.01
D = 0.01
AN
D = 0.005
r(t), T
Single Pulse
R (t) = r(t) * R
θθ
JA JA
R = 155°C/W
θ
JA
Duty Cycle, D = t1/ t2
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t1, PULSE DURATION TIMES (sec)
Figure 11 Transient Thermal Resistance
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
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T
T
O
U
O
RWARD CUR
R
T
T
T
O
US R
R
CUR
R
T
DMS2095LFDB
Schottky Characteristics
10
(A)
EN
1
T = 150°C
A
T = 125°C
A
S F
T = 85°C
0.1
ANE
A
T = 25°C
A
AN
T = -55°C
A
F
I , INS
0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
V , INSTANTANEOUS FORWARD VOLTAGE (mV)
F
Figure 12 Typical Forward Characteristics
100000
(µA)
10000
EN
SE
EVE
ANE
AN
R
I , INS
T = 150°C
A
T = 125°C
A
T = 85°C
1000
100
T = 25°C
A
A
T = -55°C
A
10
1
0.1 0 2 4 6 8 10 12 14 16 18 20
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 13 Typical Reverse Characteristics
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Pin#1 ID
A
A1
D
D2
z
A3
SEATING PLANE
d
E
E2
f
e
f
L
b
U-DFN2020-6
Type B
Dim Min Max Typ
A 0.545 0.605 0.575
A1 0 0.05 0.02 A3
0.13
b 0.20 0.30 0.25
D 1.95 2.075 2.00
d
0.45
D2 0.50 0.70 0.60
e
0.65
E 1.95 2.075 2.00
E2 0.90 1.10 1.00
f
0.15
L 0.25 0.35 0.30 z
0.225
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
X2
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
G1
C
G
Dimensions Value (in mm)
Z 1.67 G 0.20
G1 0.40
X1
X1 1.0 X2 0.45
Y 0.37
Y1
Z
G
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Y1 0.70
C 0.65
April 2014
© Diodes Incorporated
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMS2095LFDB
DMS2095LFDB
Document number: DS35955 Rev. 3 - 2
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