Product Summary
V
R
(BR)DSS
-60V
DS(on)
150m @ V
185m @ VGS= -4.5V
= -10V
GS
T
Description
This MOSFET has been designed to minimize the on-state resistance
and yet maintain superior switching performance, making it ideal for
high efficiency power management applications.
Applications
• Motor Control
• Transformer Driving Switch
• DC-DC Converters
• Power Management Functions
ADVANCE INFORMATION
• Uninterrupted Power Supply
NEW PRODUCT
SOT223
Top View
I
D
= +25°C
A
-3A
-2.7A
Features and Benefits
• 100% Unclamped Inductive Switch (UIS) test in production
• Low on-resistance
• Fast switching speed
• Lead-Free Finish; RoHS compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT223
• Case Material: Molded Plastic, “Green” Molding Compound.
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals Connections: See diagram below
• Terminals: Finish - Matte Tin annealed over Copper lead frame.
• Weight: 0.112 grams (approximate)
Pin Out - Top View
DMP6185SE
60V P-CHANNEL ENHANCEMENT MODE MOSFET
UL Flammability Classification Rating 94V-0
Solderable per MIL-STD-202, Method 208
e3
D
G
S
Equivalent Circuit
Ordering Information (Note 4)
Part Number Qualification Case Packaging
DMP6185SE-13 Standard SOT223 2,500 / Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
WW
P6185
WW
P6185
DMP6185SE
Document Number DS36465 Rev. 4 - 2
= Manufacturer’s Marking
P6185 = Marking Code
YWW = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YWW = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or Y= Year (ex: 3 = 2013)
WW = Week (01 - 53)
1 of 6
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January 2014
© Diodes Incorporated
DMP6185SE
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Drain-Source voltage
Gate-Source voltage
Continuous Drain current (Note 6) VGS = -10V
Maximum Body Diode Continuous Current
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Single Pulsed Avalanche Current (Note 7)
Single Pulsed Avalanche Energy (Note 7)
= +25°C
T
A
TA = +70°C
V
DSS
V
GS
I
D
I
S
I
DM
I
AS
E
AS
-60 V
±20
-3
-2.4
-2
-15
-16
13
V
A
A
A
A
mJ
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
ADVANCE INFORMATION
NEW PRODUCT
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
= +25°C
T
A
TA = +70°C
Steady state
t<10s 51
= +25°C
T
A
TA = +70°C
Steady state
t<10s 30
P
R
P
R
R
T
J, TSTG
JA
JA
JC
D
D
1.2
0.8
104
2.2
1.4
W
°C/W
W
60
°C/W
7.6
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
-60
− −
− −
−
-1 µA
±100 nA
−
V
VGS = 0V, ID = -250A
VDS = -48V, VGS = 0V
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
V
GS(th
R
DS (ON)
V
SD
−
-1
−
110 150
130 185
-0.75 -0.95 V
−
-3 V
VDS = VGS, ID = -250A
V
m
V
VGS = 0V, IS = -1A
= -10V, ID = -2.2A
GS
= -4.5V, ID = -1.8A
GS
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
C
iss
C
oss
C
rss
R
Total Gate Charge (VGS = -4.5V) Qg
Total Gate Charge (VGS = -10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. UIS in production with L = 0.1mH, starting T
8. Short duration pulse test used to minimize self-heating effect.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
9. Guaranteed by design. Not subject to product testing.
= +25°C.
A
Q
Q
t
D(on
t
D(off
s
d
t
t
f
t
r
Q
r
−
−
−
−
−
−
−
−
−
−
−
−
−
−
708
39
32
17
6.2
14
2.8
3.1
5.2
23
33
39
22
17
−
−
−
28
−
−
−
−
−
−
−
−
−
−
pF
pF
pF
= -30V, VGS = 0V,
V
DS
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
nC
nC
V
= -30V, ID = -12A
nC
DS
nC
ns
ns
ns
= -30V, RL = 2.5
V
DS
V
= -10V, RG = 3
GS
ns
ns
nC
= -12A, di/dt = 100A/s
I
F
DMP6185SE
Document Number DS36465 Rev. 4 - 2
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January 2014
© Diodes Incorporated