DMP4047LFDE
40V P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
D max
TA = +25°C
-6A
-4.9A
V
R
(BR)DSS
-40V
Package
DS(ON) max
33mΩ @ V
50m @ VGS = -4.5V
= -10V
GS
U-DFN2020-6
Type E
Description
This new generation MOSFET has been designed to minimize the onstate resistance (R
performance, making it ideal for high efficiency power management
applications.
) and yet maintain superior switching
DS(on)
Applications
• General Purpose Interfacing Switch
• Load Switching
ADVANCE INFORMATION
• Battery Management Application
• Power Management Functions
Pin1
U-DFN2020-6 Type E
Bottom View
Features
• 0.6mm profile – ideal for low profile applications
• PCB footprint of 4mm
• Low Gate Threshold Voltage
• Low On-Resistance
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: U-DFN2020-6 Type E
• Case Material: Molded Plastic, “Green” Molding Compound.
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish – NiPdAu over Copper leadframe. Solderable
• Weight: 0.0065 grams (approximate)
Pin Out
Bottom View
2
UL Flammability Classification Rating 94V-0
per MIL-STD-202, Method 208
e4
D
G
S
Equivalent Circuit
Ordering Information (Note 4)
Part Number Marking Reel size (inches) Quantity per reel
DMP4047LFDE-7 PE 7 3,000
DMP4047LFDE-13 PE 13 10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
PE
DMP4047LFDE
D
atasheet number: DS35777 Rev. 5 - 2
PE = Product Type Marking Code
YM = Date Code Marking
YM
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
1 of 6
www.diodes.com
© Diodes Incorporated
July 2012
DMP4047LFDE
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 6) VGS = 10V
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Body Diode Continuous Current
Steady
State
t<5s
Steady
State
t<5s
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
-40 V
±20 V
-3.3
-2.6
-5.3
-4.2
-6.0
-4.8
-9.5
-7.6
A
A
A
A
-40 A
3 A
Thermal Characteristics
Characteristic Symbol Value Units
T
= +25°C
ADVANCE INFORMATION
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
A
TA = +70°C
Steady state
t<5s 76
T
= +25°C
A
TA = +70°C
Steady state
t<5s 25
P
R
P
R
R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
0.7
0.42
W
180
°C/W
2.1
1.3
W
58
°C/W
10.2
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C I
Gate-Source Leakage
BV
DSS
I
GSS
DSS
-40 — — V
— —
— —
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
-1.0 — -2.2 V
—
—
|
—
26 33
36 50
5.2 — S
0.75 1.2 V
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
C
iss
C
oss
C
rss
R
Total Gate Charge (VGS = -4.5V) Qg
Total Gate Charge (VGS = -10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate
7. Short duration pulse test used to minimize self-heating effect
8. Guaranteed by design. Not subject to production testing
Q
Q
t
D(on
t
D(off
Q
s
d
t
t
f
t
r
r
— 1382 —
— 103 —
— 81 —
— 7.7 —
— 11.2 —
— 23.2 —
— 3.3 —
— 3.9 —
— 18.4 —
— 28.2 —
— 38.8 —
— 28.6 —
— 15.4 —
— 5.4 —
1 µA
±100 nA
mΩ
pF
pF
pF
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
VGS = 0V, ID = 250A
VDS = -40V, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250A
V
= -10V, ID = -4.4A
GS
V
= -4.5V, ID = -3.7A
GS
VDS = -15V, ID = -4.4A
VGS = 0V, IS = -3.9A
V
= -20V, VGS = 0V,
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
= -20V, ID = -4.9A
V
DS
= -20V, I
V
DS
= 4.5V, RG = 1
V
GS
= -3.9A, di/dt = 100A/s
I
F
= -3.9A
D
DMP4047LFDE
D
atasheet number: DS35777 Rev. 5 - 2
2 of 6
www.diodes.com
July 2012
© Diodes Incorporated