Diodes DMP4015SSSQ User Manual

4
8
5
Y
Product Summary
I
V
(BR)DSS
-40V
R
DS(on) max
11m @ V
15m @ VGS = -4.5V
= -10V
GS
D
TA = +25°C
-10.1A
-8.8A
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
) and yet maintain superior switching
DS(on)
Applications
DC-DC Converters Power management functions  Analog Switch
SO-8
S
S
G
Top View
Internal Schematic
DMP4015SSSQ
P-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
100% Unclamped Inductive Switch (UIS) test in production
Low Input Capacitance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Available
Mechanical Data
Case: SO-8 Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020  Terminal Connections: See Diagram  Terminals: Finish – Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.074 grams (approximate)
Top View
DS
D
D
D
G
Equivalent circuit
e3
D
S
Ordering Information (Note 4 & 5)
Part Number Qualification Case Packaging
DMP4015SSSQ-13 Automotive SO-8 2,500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_grade_definitions/.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
P4015SS
Y WW
1
DMP4015SSSQ
Document number: DS36682 Rev. 3 - 2
= Manufacturer’s Marking P4015SS = Product Type Marking Code YYWW = Date Code Marking YY = Year (ex: 13 = 2013) WW = Week (01 - 53)
1 of 6
www.diodes.com
February 2014
© Diodes Incorporated
)
g
g
g
)
r
)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -10V
Continuous Drain Current (Note 6) VGS = -4.5V
Continuous Drain Current (Note 7) VGS = -10V
Continuous Drain Current (Note 7) VGS = -4.5V
Pulsed Drain Current (10μs pulse, duty cycle = 1%) Avalanche Current (Note 8) Avalanche Energy (Note 8)
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient (Note 6) Total Power Dissipation (Note 7) Thermal Resistance, Junction to Ambient (Note 7) Thermal Resistance, Junction to Case (Note 7) Operating and Storage Temperature Range
Steady
State
Steady
State
Steady
State
Steady
State
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
= +25°C
T
A
T
= +70°C
A
V V
I I
E
P
R
P R R
T
J, TSTG
DSS
GSS
I
D
I
D
I
D
I
D
DM
AS
AS
D
θJA
D
θJA
θJc
DMP4015SSSQ
-40 V
±25 V
-9.1
-7.2
-7.8
-6.2
-10.1
-8
-8.8
-7
A
A
A
A
-100 A
-22 A
242 mJ
1.45 W 88 °C/W
1.82 W 70 °C/W
7.6 °C/W
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I
I
DSS
DSS
GSS
-40
 
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage (Note 6)
V
GS(th
R
DS (ON)
|Y V
fs
SD
-1.5 -2 -2.5 V
 
|
 
7 11 9 15
26
-0.7 -1 V
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
10. Guaranteed by design. Not subject to production testing.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate 8 .UIS in production with L = 1mH, T
9. Short duration pulse test used to minimize self-heating effect.
= +25°C
J
C C C
Q
Q
t
D(on
t
D(off
iss
oss
rss
R
G
Q
s
d
t
t
f
  
      

4234 1036
526
7.77
47.5
14.2
13.5
13.2 10
302.7
137.9
-1 μ
100
  
      

V
VGS = 0V, ID = -250μA
A
V
= -40V, VGS = 0V
nA
DS
VGS = 25V, VDS = 0V
VDS = VGS, ID = -250μA
= -10V, ID = -9.8A
V
m
S
GS
V
= -4.5V, ID = -9.8A
GS
V
= -20V, ID = -9.8A
DS
VGS = 0V, IS = -1A
= -20V, VGS = 0V
V
pF
nC
ns
DS
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
= -20V, VGS = -5V
V
DS
= -9.8A
I
D
= -10V, VDD = -20V, RG = 6Ω,
V
GS
I
= -1A, RL = 20
D
DMP4015SSSQ
Document number: DS36682 Rev. 3 - 2
2 of 6
www.diodes.com
February 2014
© Diodes Incorporated
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