Diodes DMP3065LVT User Manual

D
DMP3065LVT
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
max
D
-4.9A
-3.7A
V
(BR)DSS
-30V
R
42m @ V
65m @ VGS = -4.5V
DS(ON)
max
= -10V
GS
TA = +25°C
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
(R
) and yet maintain superior switching performance, making it
DS(ON)
ideal for high efficiency power management applications.
Backlighting
Power Management Functions
DC-DC Converters
ESD PROTECTE
TSOT26
Top View
Features and Benefits
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: TSOT26
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.015 grams (approximate)
1
DD
2
DD
GS
3
Top View
Internal Schematic
6
5
4
e3
Equivalent Circuit
Ordering Information (Note 4)
Part Number Case Packaging
DMP3065LVT-7 TSOT26 3,000/Tape & Reel
DMP3065LVT-13 TSOT26 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Shanghai A/T Site
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMP3065LVT
Document number: DS36697 Rev. 2 - 2
Chengdu A/T Site
65P = Product Type Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site) YM = Date Code Marking for CAT (Chengdu Assembly/ Test site) Y or Y = Year (ex: A = 2013) M = Month (ex: 9 = September)
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© Diodes Incorporated
DMP3065LVT
Maximum Ratings P-Channel (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = -10V
Continuous Drain Current (Note 5) VGS = -4.5V
Maximum Body Diode continuous Current
Steady
State
Steady
State
T
= +25°C
A
T
= +70°C
A
T
= +25°C
A
T
= +70°C
A
V
DSS
V
GSS
I
D
I
D
I
S
-30 V
±20 V
-4.9
-3.8
-3.7
-3.1
A
A
-2.0 A
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
Steady state
Operating and Storage Temperature Range
P
R
P
R
T
J, TSTG
JA
JA
D
D
1.2 W
102 °C/W
1.6 W
78 °C/W
-55 to +150 °C
Electrical Characteristics P-Channel (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @TJ = +25°C I
Gate-Source Leakage
BV
DSS
I
GSS
DSS
-30 — — V
— — -1 A — — ±10 A
VGS = 0V, ID = -250A
VDS = -24V, VGS = 0V
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th)
R
DS (ON)
|Y
V
fs
SD
-1 -1.7 -2.1 V
— 34 42
— 52 65
— 8.5 — S
|
— -0.75 -1.2 V
VDS = VGS, ID = -250A
V
= -10V, ID = -4.9A
m
GS
V
= -4.5V, ID = -3.7A
GS
VDS = -5V, ID = -4.9A
VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
iss
C
oss
C
rss
Total Gate Charge (VGS = -4.5V) Qg
Total Gate Charge (VGS = -10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
Q
Q
t
D(on)
t
D(off)
gs
gd
t
r
t
f
— 6.3 —
— 12.3 —
— 1.9 —
— 2.5 —
— 5.7 —
— 11.8 —
— 21.8 —
— 23.9 —
587
160
84
pF
nC
ns
V
= -15V, VGS = 0V,
DS
f = 1.0MHz
V
= -15V, ID = -4.9A
DS
= -15V, VGS = -10V,
V
DD
= -4.9A, RG = 6
I
D
DMP3065LVT
Document number: DS36697 Rev. 2 - 2
2 of 6
www.diodes.com
February 2014
© Diodes Incorporated
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