Diodes DMP3037LSS User Manual

Product Summary
V
R
(BR)DSS
-30V
32m @ V
50m @ VGS = -4.5V
DS(on) max
= -10V
GS
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
) and yet maintain superior switching
DS(on)
Applications
DC-DC Converters Power management functions  Backlighting
SO-8
Top View
I
D
TC = +25°C
-5.8A
-4.6A
S
S
G
DMP3037LSS
P-CHANNEL ENHANCEMENT MODE MOSFET
Features
 Low On-Resistance  Low Input Capacitance  Fast Switching Speed  Low Input/Output Leakage  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8 Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020  Terminal Connections: See Diagram Below  Weight: 0.072 grams (approximate)
DS
D
D
D
D
Top View
Pin-Out
G
Equivalent Circuit
S
Ordering Information (Note 4)
Part Number Case Packaging
DMP3037LSS-13 SO-8 2500 / Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
DMP3037LSS
Document number: DS36775 Rev. 2 - 2
8 5
P3037LS
WW
YY
1 4
Chengdu A/T Site Shanghai A/T Site
8 5
P3037LS
YY
WW
1 4
1 of 6
www.diodes.com
= Manufacturer’s Marking P3037LS = Product Type Marking Code YYWW = Date Code Marking YY or YY = Year (ex: 13 = 2013) WW = Week (01 - 53) YY = Date Code Marking for SAT (Shanghai Assembly/ Test site) YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
April 2014
© Diodes Incorporated
)
g
g
g
)
r
)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -10V
Pulsed Drain Current (10µs pulse, duty cycle = 1%) Avalanche Current (Notes 7) L = 0.1mH
Avalanche Energy (Notes 7) L = 0.1mH
Thermal Characteristics
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6) Operating and Storage Temperature Range
DMP3037LSS
Characteristic Symbol Value Unit
V
DSS
V
GSS
= +25°C
T
A
T
= +70°C
A
I
D
I
DM
I
AS
E
AS
Characteristic Symbol Value Units
= +25°C
T
A
T
= +70°C
A
Steady state
t<10s 58
= +25°C
T
A
T
= +70°C
A
Steady state
t<10s 45
P
R
P
R
R
T
J, TSTG
D
JA
D
JA
JC
-30 V
±20 V
-5.8
-4.6
A
-40 A
-17 A
15 mJ
1.2
0.8
100
1.6
1.0
W
°C/W
W
77
°C/W
10
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = +25°C I Gate-Source Leakage
BV
DSS
I
GSS
DSS
-30 — — V — — — —
-1.0 A
±100 nA
VGS = 0V, ID = -250A VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
V
GS(th
R
DS (ON)
V
SD
-1.0 — -2.4 V
— -0.75 -1.2 V
19 32 28 50
VDS = VGS, ID = -250A
= -10V, ID = -7A
V
m
GS
V
= -4.5V, ID = -5A
GS
VGS = 0V, IS = -1A DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
C
C
oss
C
rss
R Total Gate Charge (VGS = -10V) Qg Total Gate Charge (VGS = -4.5V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Q Q
t
D(on
t
D(off
t
t
iss
s
d
f
— — — — — — — — — — — —
931 120 102
23
19.3
9.7
2.5
3.6
3.2
11.5
55.8
30.8
— — — — — — — — — — — —
pF pF pF
Ω
nC
= -15V, VGS = 0V,
V
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = -15V, ID = -7A nC nC
= -15V, ID = -7A
V
DS
nC
ns ns ns
= -15V, VGS = -10V,
V
DS
= 2.15, R
R
L
ns
GEN
= 3,
Body Diode Reverse Recovery Time trr 13.6 nS IS = -7A, dI/dt = 100A/s Body Diode Reverse Recovery Charge Qrr 3.4 nC IS = -7A, dI/dt = 100A/s
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
7. I
and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C
AS
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMP3037LSS
Document number: DS36775 Rev. 2 - 2
2 of 6
www.diodes.com
April 2014
© Diodes Incorporated
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