NEW PRODUCT
Product Summary
I
max
D
V
R
(BR)DSS
1.9 @ V
-20V
2.4 @ VGS = -2.5V
3.4 @ VGS = -1.8V
5 @ VGS = -1.5V
DS(ON)
max
= -4.5V
GS
TA = 25°C
-330mA
-300mA
-250mA
-200mA
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
(R
) and yet maintain superior switching performance, making it
DS(on)
ideal for high efficiency power management applications.
• General Purpose Interfacing Switch
• Power Management Functions
• Analog Switch
ESD PROTECTED
Bottom View
DMP22D4UFA
20V P-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
• Low Package Profile, 0.4mm Maximum Package height
• 0.48mm
• Low On-Resistance
• Very low Gate Threshold Voltage, 1.0V max
• ESD Protected Gate
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 standards for High Reliability
2
package footprint, 16 times smaller than SOT23
Mechanical Data
• Case: X2-DFN0806-3
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish – NiPdAu over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Weight: 0.001 grams (approximate)
Drain
D
S
G
Top View
Package Pin Configuration
Gate
Gate
Protection
Diode
Equivalent Circuit
Source
Ordering Information (Note 4)
Part Number Case Packaging
DMP22D4UFA-7B DFN0806H4-3 10K/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DMP22D4UFA
Document number: DS35766 Rev. 2 - 2
DMP22D4UFA-7B
PW
Top View
Bar Denotes Gate
and Source Side
www.diodes.com
PW = Product Type Marking Code
1 of 6
© Diodes Incorporated
May 2012
NEW PRODUCT
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
T
= 25°C
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
Continuous Drain Current (Note 5) VGS = -4.5V
Continuous Drain Current (Note 5) VGS = -1.8V
Steady
State
t<10s
Steady
State
t<10s
Pulsed Drain Current (Note 6)
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Steady state
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
t<10s 220 °C/W
Operating and Storage Temperature Range
DMP22D4UFA
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
P
D
R
JA
θ
T
J, TSTG
-20 V
±8 V
-330
-260
-400
-310
-250
-200
-310
-240
mA
mA
mA
mA
-800 mA
400 mW
310 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @Tc = 25°C I
Gate-Source Leakage
BV
I
DSS
DSS
GSS
-20 - - V
- - 100
- - 50
- - ±100 nA
VGS = 0V, ID = -250A
V
= -16V, VGS = 0V
nA
DS
= -5V, VGS = 0V
V
DS
VGS = ±5V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
-0.4 - -1.0 V
- 1.2 1.9
- 1.5 2.4
- 2.1 3.4
- 2.5 5
- 4.0 -
100 450 - mS
|
- -0.6 -1.0 V
VDS = VGS, ID = -250A
V
= -4.5V, ID = -100mA
GS
V
= -2.5V, ID = -50mA
Ω
GS
V
= -1.8V, ID = -20mA
GS
V
= -1.5V, ID = -10mA
GS
V
= -1.2V, ID = -1mA
GS
VDS = -5V, ID = -125mA
VGS = 0V, IS = -10mA
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Device mounted on minimum recommended pad layout test board, 10s pulse duty cycle = 1%.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
C
C
t
t
C
oss
rss
R
Q
Q
Q
D(on
t
D(off
t
iss
G
s
d
f
- 28.7 - pF
- 4.2 - pF
- 2.9 - pF
- 0.4 -
- 0.4 - nC
- 0.08 - nC
- 0.06 - nC
- 5.8 - ns
- 5.7 - ns
- 31.1 - ns
- 16.4 - ns
V
= -15V, VGS = 0V,
DS
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
V
= -4.5V, VDS =- 10V,
GS
I
= -250mA
D
V
= -15V, VGS = -4.5V,
DD
= 2, ID = -200mA
R
G
DMP22D4UFA
Document number: DS35766 Rev. 2 - 2
2 of 6
www.diodes.com
May 2012
© Diodes Incorporated