Diodes DMP22D4UFA User Manual

Product Summary
I
max
D
V
R
(BR)DSS
1.9 @ V
-20V
2.4 @ VGS = -2.5V
3.4 @ VGS = -1.8V 5 @ VGS = -1.5V
DS(ON)
max
= -4.5V
GS
TA = 25°C
-330mA
-300mA
-250mA
-200mA
Description and Applications
This MOSFET has been designed to minimize the on-state resistance (R
) and yet maintain superior switching performance, making it
DS(on)
ideal for high efficiency power management applications.
General Purpose Interfacing Switch
Power Management Functions
Analog Switch
ESD PROTECTED
Bottom View
DMP22D4UFA
20V P-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
Low Package Profile, 0.4mm Maximum Package height
0.48mm
Low On-Resistance
Very low Gate Threshold Voltage, 1.0V max
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 standards for High Reliability
2
package footprint, 16 times smaller than SOT23
Mechanical Data
Case: X2-DFN0806-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
Drain
D
S G
Top View
Package Pin Configuration
Gate
Gate Protection Diode
Equivalent Circuit
Source
Ordering Information (Note 4)
Part Number Case Packaging
DMP22D4UFA-7B DFN0806H4-3 10K/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DMP22D4UFA
Document number: DS35766 Rev. 2 - 2
DMP22D4UFA-7B
PW
Top View
Bar Denotes Gate
and Source Side
www.diodes.com
PW = Product Type Marking Code
1 of 6
© Diodes Incorporated
May 2012
)
g
g
g
)
r
)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
T
= 25°C
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
Continuous Drain Current (Note 5) VGS = -4.5V
Continuous Drain Current (Note 5) VGS = -1.8V
Steady
State
t<10s
Steady
State
t<10s
Pulsed Drain Current (Note 6)
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Steady state Thermal Resistance, Junction to Ambient (Note 5)
Steady state
t<10s 220 °C/W
Operating and Storage Temperature Range
DMP22D4UFA
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
P
D
R
JA
θ
T
J, TSTG
-20 V ±8 V
-330
-260
-400
-310
-250
-200
-310
-240
mA
mA
mA
mA
-800 mA
400 mW 310 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current @Tc = 25°C I Gate-Source Leakage
BV
I
DSS
DSS
GSS
-20 - - V
- - 100
- - 50
- - ±100 nA
VGS = 0V, ID = -250A V
= -16V, VGS = 0V
nA
DS
= -5V, VGS = 0V
V
DS
VGS = ±5V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
-0.4 - -1.0 V
- 1.2 1.9
- 1.5 2.4
- 2.1 3.4
- 2.5 5
- 4.0 -
100 450 - mS
|
- -0.6 -1.0 V
VDS = VGS, ID = -250A
V
= -4.5V, ID = -100mA
GS
V
= -2.5V, ID = -50mA
Ω
GS
V
= -1.8V, ID = -20mA
GS
V
= -1.5V, ID = -10mA
GS
V
= -1.2V, ID = -1mA
GS
VDS = -5V, ID = -125mA
VGS = 0V, IS = -10mA DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Device mounted on minimum recommended pad layout test board, 10s pulse duty cycle = 1%.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
C C
t
t
C
oss rss
R
Q Q Q
D(on
t
D(off
t
iss
G
s d
f
- 28.7 - pF
- 4.2 - pF
- 2.9 - pF
- 0.4 -
- 0.4 - nC
- 0.08 - nC
- 0.06 - nC
- 5.8 - ns
- 5.7 - ns
- 31.1 - ns
- 16.4 - ns
V
= -15V, VGS = 0V,
DS
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz V
= -4.5V, VDS =- 10V,
GS
I
= -250mA
D
V
= -15V, VGS = -4.5V,
DD
= 2, ID = -200mA
R
G
DMP22D4UFA
Document number: DS35766 Rev. 2 - 2
2 of 6
www.diodes.com
May 2012
© Diodes Incorporated
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