Diodes DMP2200UFCL User Manual

Page 1
Dual P-CHANNEL ENHANCEMENT MODE MOSFET
Summary
V
R
(BR)DSS
200mΩ @V
-20V
290mΩ @V
390mΩ @V
650mΩ @V
max I
DS(on)
= -4.5V
GS
= -2.5V
GS
= -1.8V
GS
= -1.5V
GS
Description
This device provides a high performance, low R
MOSFET in the thermally and spatially efficient DFN1616-6 package.
The low R
making it ideal for use in the following applications:
of this MOSFET ensures conduction losses are kept
DS(ON)
DS(ON)
Applications
Battery disconnect switch
Load switch for power management functions
NEW PRODUCT
ESD PROTECTED
Pin1
Bottom View
max
D
-1.7 A
-1.3 A
-1.1 A
-0.5 A
P-Channel
Features
Typical off board profile of 0.5mm - ideally suited for thin
applications
Low R
PCB footprint of 2.56mm
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 standards for High Reliability
ESD Protected Gate
– minimizes conduction losses
DS(ON)
2
Mechanical Data
Case: U-DFN1616-6 Type F
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Lead Free Plating (NiPdAu Finish over Copper leadframe).
Terminals: Solderable per MIL-STD-202, Method 208
Weight: 0.04 grams (approximate)
Device Symbol Pin Configuration
Bottom View
Ordering Information (Note 4)
DMP2200UFCL
e4
Product Reel size (inches) Tape width (mm) Quantity per reel
DMP2200UFCL-7 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2014 2015 2016 2017 2018 2019 2020
Code B C D E F G H
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
P20
YM
DMP2200UFCL
Document number: DS36619 Rev. 2 - 2
P20 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: B= 2014) M = Month (ex: 9 = September)
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Page 2
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) @TA = +25°C @T
= +85°C
A
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation
Thermal Resistance, Junction to Ambient
(Note 5)
(Note 6) 1.58 W
(Note 5)
(Note 6) 80
Operating and Storage Temperature Range
NEW PRODUCT
Electrical Characteristics (@T
Characteristic Symbol Min Typ Max Unit Test Condition
= +25°C, unless otherwise specified.)
A
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
BV
I
DSS
I
GSS
DSS
-20
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage (Note 7)
V
GS(th)
R
DS (ON)
V
SD
-0.4
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
— 184 — pF
2.2 — nC
SWITCHING CHARACTERISTICS (Note 8)
Turn-On Delay Time
Turn-Off Delay Time
Turn-On Rise Time
Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
t
D(ON)
t
D(OFF)
t
t
r
f
9.8 — ns
41 — ns
DMP2200UFCL
Document number: DS36619 Rev. 2 - 2
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V
V
P
R
T
J, TSTG
DSS
GSS
I
D
D
JA
θ
153 220
260 360
25.8
18.6
0.4
0.5
23
87
DMP2200UFCL
-20 V
±8 V
-1.7
-1.2
0.66 W
193
-55 to +150 °C
V
VGS = 0V, ID = 250µA
-1 µA
±10
-1.2 V
200 290
390 650
-1.2 V
µA
mΩ
pF
pF
nC
nC
ns
ns
V
= -20V, VGS = 0V
DS
V
= ±8V, VDS = 0V
GS
V
= VGS, ID = -250µA
DS
= -4.5V, ID = -2.0A
V
GS
= -2.5V, ID = -1.2A
V
GS
= -1.8V, ID = -0.24A
V
GS
= -1.5V, ID = -0.18A
V
GS
V
= 0V, IS = -0.6A
GS
V
= -10V, VGS = 0V
DS
f
= 1.0MHz
V
= -4.5V, VDS = -10V,
GS
= -1.7A
I
D
= -10V, ID = -1.5A,
V
DD
V
GS
A
°C/W
= -4.5V, R
GEN
June 2014
© Diodes Incorporated
= 1Ω
Page 3
R
CUR
R
T
R
CUR
R
T
R
R
OUR
ON-R
R
R
OUR
CE ON-R
TANC
R
R
O
R
ON-R
R
R
OUR
C
NEW PRODUCT
DMP2200UFCL
10
8
(A)
EN
6
4
AIN
D
-I , D 2
0
00.511.522.53
V= -8.0V
GS
V= -4.5V
GS
V= -1.5V
GS
-V , DRAIN -SOURCE VOLTAGE (V)
DS
V= -4.0V
GS
V= -3.0V
GS
V= -2.5V
GS
V= -2.0V
GS
V= -1.2V
GS
Figure 1 Typical Output Characteristics
0.5
Ω
V = -1.8V
GS
0.4
ESISTANCE ( )
0.3
V = -2.5V
GS
10
V = -5.0V
DS
T = -55CA°
T = 25CA°
8
(A)
EN
AIN
-I , D
6
4
D
T = 85CA°
T = 125CA°
2
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
-V , GATE-SOURCE VOLTAGE (V)
GS
Figure 2 Typical Transfer Characteristics
2
Ω
1.8
E ( )
1.6
I = -2.0A
1.4
ESIS
D
1.2
T = 150CA°
AIN-S
, D
0.8
0.6
0.4
1
I = -1.2A
D
CE
AIN-S
, D
0.2
0.1
V = -4.5V
GS
0.2
DS(ON)
0
0246810
-I , DRAIN SOURCE CURRENT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0.5
Ω
V= -4.5V
GS
0.4
T = 150 CA°
ESISTANCE ( )
CE
U
0.3
T = 85CA°
0.2
T = 125 CA°
T = 25CA°
T = -55CA°
AIN-S
0.1
, D
DS(ON)
0
0246 810
-I , DRAIN SOURCE CURRENT (A)
D
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DS(ON)
E
AIN-S
, D
DS(ON)
ON-RESISTANCE (NORMALIZED)
I = -0.24A
D
0
012345678
-V , GATE-SOURCE CURRENT (V)
GS
Figure 4 Typical Transfer Characteristics
2
1.8
1.6
V = -4.5V
GS
I = -3A
D
1.4
1.2
V = -2.5V
1
GS
I = -1A
D
0.8
0.6
0.4
0.2
0
-50-25 0 25 50 75100125150 T , JUNCTION TEMPERATURE ( C)J°
Figure 6 On-Resistance Variation with Temperature
DMP2200UFCL
Document number: DS36619 Rev. 2 - 2
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Page 4
R
R
OUR
CE O
R
TANC
GATE THRESH
O
OLTAG
OUR
CE CUR
RENT
C
UNC
TION CAPACITANC
F
GAT
OUR
C
OLT
G
R
N CUR
REN
T
NEW PRODUCT
DMP2200UFCL
0.5
1
Ω
E ( )
E (V)
0.4
ESIS
N-
0.3
-2.
V=5V
GS
-1
I= A
D
0.2
V= -4.5V
GS
I= A
-3
AIN-S
0.1
, D
DS(on)
0
-50 -25 0 25 50 75 100 125 150
D
T , JUNCTION TEMPERATURE ( C)J°
Figure 7 On-Resistance Variation with Temperature
10
0.8
-I = 1mAD
0.6
LD V
-I = 250µA
D
0.4
0.2
GS(TH)
V,
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Figure 8 Gate Threshold Variation vs. Ambient Temperature
1000
f = 1MHz
)
8
(A)
6
4
S
-I , S
2
T= 150CA°
T= 125CA°
T= 85CA°
T= 25CA°
T= -55CA°
E (p
, J
100
10
T
C
iss
C
oss
C
rss
0
0 0.3 0.6 0.9 1.2 1.5
-V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 9 Diode Forward Voltage vs. Current
8
E (V)
6
A
E V
4
V = -10V
DS
I= -1.7A
D
E-S
2
GS
-V ,
0
0 0.5 1 1.5 2 2.5 3 3.5 4
Q , TOTAL GATE CHARGE (nC)
g
Figure 11 Gate-Charge Characteristics
1
02468101214161820
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 10 Typical Junction Capacitance
10
R
DS(on)
Limited
(A)
1
AI
0.1
D
-I , D
T = 150°C T = 25°C V = -4.5V Single Pulse DUT on 1 * MRP Board
0.01
0.1 1 10 100
DC
P = 10s
W
P = 1s
W
P = 100ms
W
P= 10ms
W
P = 1ms
W
P = 100µs
J(max)
A
GS
-V , DRAIN-SOURCE VOLTAGE (V)
DS
W
Figure 12 SOA, Safe Operation Area
DMP2200UFCL
Document number: DS36619 Rev. 2 - 2
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© Diodes Incorporated
Page 5
T
RAN
N
T T
HER
R
T
N
C
NEW PRODUCT
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
1
D = 0.9 D = 0.7
D = 0.5
E
D = 0.3
A
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
SIE
0.01
D = 0.01
D = 0.005
r(t),
Single Pulse
0.001
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
t1, PULSE DURATION TIMES (sec)
Figure 13 Transient Thermal Resistance
A
E
Z4
A
Pin #1 ID
K
x
1
D
D
1
R
0
.
1
0
0
e
b
A
D
22
E
22
L
3
Seating Plane
X
x
R (t) = r(t) * R
θθ
JA JA
R = 190°C/W
JA
θ
Duty Cycle, D = t1/ t2
U-DFN1616-6
Dim Min Max Typ
A1 0 0.05 0.02 A3 — — 0.127
D1 1.14 1.34 1.24 D2 0.38 0.58 0.48
E2 0.54 0.74 0.64
K — — 0.23
Type F
A 0.45 0.55 0.50
b 0.20 0.30 0.25
D 1.55 1.65 1.60
E 1.55 1.65 1.60
e — — 0.50
L 0.15 0.35 0.25 Z — — 0.175 All Dimensions in mm
DMP2200UFCL
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
Y
1
Y
X
2
G
1
Dimensions
C 0.500
X
1
G
Y
2
G 0.150
G1 0.180
X 0.320 X1 0.580 X2 1.320
Y 0.450 Y1 0.700
Y 1.900
Value
(in mm)
DMP2200UFCL
Document number: DS36619 Rev. 2 - 2
C
X
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DMP2200UFCL
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
NEW PRODUCT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMP2200UFCL
Document number: DS36619 Rev. 2 - 2
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