Diodes DMP21D5UFD User Manual

Page 1
DMP21D5UFD
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V
R
(BR)DSS
-20V
DS(ON) max
1.0Ω @ V
1.5Ω @ VGS = -2.5V
2.0Ω @ VGS = -1.8V
3.0Ω @ VGS = -1.5V
= -4.5V
GS
Package
X1-DFN1212-3
TA = +25°C
-600mA
-500mA
-400mA
-250mA
I
D
Features
Low On-Resistance
Very Low Gate Threshold Voltage V
Low Input Capacitance
Fast Switching Speed
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
GS(TH)
, 1.0V max
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
) and yet maintain superior switching
DS(on)
Applications
DC-DC Converters
Power Management Functions
ESD PROTECTED
Top View Bottom View
Mechanical Data
Case: X1-DFN1212-3
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe. Solderable per MIL-
STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.005 grams (approximate)
Gate
Gate Protection Diode
Equivalent Circuit
e4
Drain
Source
Pin-out Top view
Ordering Information (Note 4)
Part Number Case Packaging
DMP21D5UFD-7 X1-DFN1212-3 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
YM
KP2 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September)
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August 2012
© Diodes Incorporated
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
KP2
DMP21D5UFD
Document number: DS35931 Rev. 4 - 2
Page 2
θ
θ
)
g
g
r
DMP21D5UFD
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -4.5V
Continuous Drain Current (Note 6) VGS = -1.8V Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Body Diode continuous Current
Steady
State
Steady
State
T
= +25°C
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
DM
I
S
-20 V ±8 V
-600
-500
-400
-300
mA
mA
-2 A
-800 mA
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5)
Steady state Total Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient (Note 6)
Steady state Operating and Storage Temperature Range
P
R
P
R
T
J, TSTG
D JA D JA
0.4 W
280 °C/W
0.8 W
140 °C/W
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = +25°C I Gate-Source Leakage
BV
DSS
I
GSS
DSS
-20 — V
— — ±10.0 µA
-80
-100
VGS = 0V, ID = -1mA
nA
= -20V, VGS = 0V
V
DS
= -4.5V, VGS = 0V
V
DS
VGS = ±8V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
-0.5 — -1.0 V — 0.7 1.0 — 0.9 1.5 — 1.2 2.0 — 1.5 3.0 — 5 —
|
0.7 — S — -0.75 -1.2 V
VDS = VGS, ID = -250μA V
= -4.5V, ID = -100mA
GS
V
= -2.5V, ID = -80mA
GS
Ω
V
= -1.8V, ID = -40mA
GS
V
= -1.5V, ID = -30mA
GS
V
= -1.2V, ID = -1mA
GS
VDS = -3V, ID = -100mA
VGS = 0V, IS = -330mA, DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
Total Gate Charge VGS = -4.5V Qg Total Gate Charge VGS = -8V Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMP21D5UFD
Document number: DS35931 Rev. 4 - 2
Q
s
Q
d
t
D(on)
t
t
D(off)
t
f
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46.1 — — 7.2 — — 4.9 — — 0.5 — — 0.8 — — 0.1 — — 0.1 — — 8.5 — — 4.3 — — 20.2 — — 19.2 —
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pF
nC
ns
V
= -10V, VGS = 0V,
DS
f = 1.0MHz
= -10V, ID = -250mA
V
DS
= -3V, VGS = -2.5V,
V
DD
R
= 300Ω, RG = 25,
L
= -100mA
I
D
August 2012
© Diodes Incorporated
Page 3
R
CUR
R
T
RAIN CUR
REN
T
R,DR
OUR
ON-R
R
R
OUR
ON-R
R
RAIN-SOUR
CE O
N-R
T
N
C
1.0
0.8 (A) EN
0.6
AIN
0.4
D
-I , D
0.2
0
012345
-V , DRAIN -SOURCE VOLTAGE (V)
DS
Fig. 1 Typical Output Ch ar acteristics
2.0
Ω
1.8
1.6
1.4
ESISTANCE( )
1.2
1.0
CE
0.8
0.6
AIN-S
V = -1.8V
GS
V = 2.5V
-
GS
V = 4.5V
-
GS
0.4
0.2
DS(ON)
0
0 0.2 0.4 0.6 0.8 1.0
-I , DRAIN SOURCE CURRENT
D
Fig. 3 Typical On-Resistance vs.
Drain Current and G at e Vol t age
1.7
1.0
V= -5V
0.8
(A)
0.6
DS
T = A25 C
T = -55C
A
0.4
D
-I , D
0.2
0
0 0.5 1.0 1.5 2.0 2.5 3.0
-V , GATE SOURCE VOLTAGE(V)
GS
Fig. 2 Typical Transfer Characteristics
1.6
Ω
1.4
1.2
ESISTANCE( )
1.0
CE
0.8
0.6
AIN-S
0.4
, D
0.2
DS(ON)
0
0 0.2 0.4 0.6 0.8 1
-I , DRAIN SOURCE CURRENT (A)
D
Fig. 4 Typical On-Resistance vs.
Drain Curr ent and Temperature
1.6
DMP21D5UFD
T = A85 C
°
°
°
T = 150°C
A
125°C
T =
A
T =
A
T = 2A5°C
T = A-55°C
T = A150 C
T = A125 C
85°C
°
°
Ω
E ( )
1.4
1.5
A
1.2
1.3
ESIS
1.0
1.1
0.9
DS(ON)
R , DRAIN-SOURCE
0.7
ON-RESISTANCE (NORMALIZED)
0.5
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Fig. 5 On-Resistance Variation with Temperature
DMP21D5UFD
Document number: DS35931 Rev. 4 - 2
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0.8
0.6
0.4
, D
0.2
DS(ON)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Fig. 6 On-Resistance vs.T emperature
August 2012
© Diodes Incorporated
Page 4
GAT
T
H
R
H
O
OLT
G
C, J
UNC
TION CAPACITANC
pF)
GE CUR
REN
T
GAT
OUR
C
O
TAG
E (V) A
LD V
ES
1.4
1.2
1.0
0.8
0.6
I= -1mA
I = -250µA
D
D
1.0
0.8
0.6
0.4
T= 25C
DMP21D5UFD
°
A
E
0.4
0.2
GS(th)
-V , 0
-25 0 25 50 75 100 125 150
-50 T , JUNCTION TEMPERATURE ( C)
J
°
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
100
S
-I , SOURCE CURRENT (A)
0.2
0
0.4 0.6 0.8 1.0 1.2
-V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Diode Forward Voltage vs. Current
1,000
E (
10
T
f = 1MHz
1
0 5 10 15 20
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 9 Typical Junction Capacitance
1
R
DS(ON)
Limited
DC
P = 10sW
0.1
0.01
D
-I , DRAIN CURRENT (A)
T = 150 C
J(MAX)
T= 25C
A
Single Pulse
0.001
0.1 1 10 100
-V , DRAIN-SOURCE VOLTAGE (V)
DMP21D5UFD
Document number: DS35931 Rev. 4 - 2
P=1s
W
P = 100ms
W
P = 10ms
W
P=1ms
W
°
°
DS
Fig. 11 SOA, Safe Operation Area
C
C
C
iss
oss
rss
P = 100µs
W
(nA)
100
DSS
-I , LEAKA
E (V)
L E V
E-S
-V ,
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T = 1A50 C
°
T = 1A25 C
°
T = 8A5C
T = 2A5C
°
°
10
1
048121620
-V , DRAIN-SOURCE VOLTAGE(V)
DS
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage
8
7
6
5
4
3
2
GS
1
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Q , TOTAL GATE CHARGE (nC)
g
Fig. 12 Gate-Charge Characteristics
August 2012
© Diodes Incorporated
Page 5
DMP21D5UFD
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A3
b1
(2x)
A1
D e
E
L
b
X1-DFN1212-3
Dim Min Max Typ
A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 - - 0.13
b 0.27 0.37 0.32 b1 0.17 0.27 0.22
D 1.15 1.25 1.20
E 1.15 1.25 1.20
e - - 0.80
L 0.25 0.35 0.30
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y2
DMP21D5UFD
Document number: DS35931 Rev. 4 - 2
X
Y1
(2x)
C
Y
X1
(2x)
Dimensions Value (in mm)
C 0.80 X 0.42
X1 0.32
Y 0.50 Y1 0.50 Y2 1.50
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
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IMPORTANT NOTICE
LIFE SUPPORT
DMP21D5UFD
DMP21D5UFD
Document number: DS35931 Rev. 4 - 2
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