Diodes DMN6040SFDE User Manual

60V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
D max
TA = +25°C
6.5A
5.2A
V
(BR)DSS
60V
R
DS(ON) max
38mΩ @ V
47m @ VGS = 4.5V
GS
= 10V
Package
U-DFN2020-6
Type E
Description
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
) and yet maintain superior switching
DS(on)
Applications
General Purpose Interfacing Switch
Power Management Functions
ADVANCE INFORMATION
Pin1
U-DFN2020-6 Type E
Bottom View
Bottom View
Pin Out
Features and Benefits
100% Unclamped Inductive Switch (UIS) test in production
0.6mm profile – ideal for low profile applications
PCB footprint of 4mm
Low On-Resistance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. "Green" Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
2
Mechanical Data
Case: U-DFN2020-6 Type E
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.0065 grams (approximate)
Gate
Equivalent Circuit
e4
Drain
Source
Ordering Information (Note 4)
Part Number Marking Reel size (inches) Quantity per reel
DMN6040SFDE-7 N8 7 3,000
DMN6040SFDE-13 N8 13 10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN6040SFDE
D
atasheet number: DS35792 Rev. 8 - 2
www.diodes.com
N8 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September)
1 of 6
August 2012
© Diodes Incorporated
θ
)
g
g
)
r
)
r
r
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Pulsed Drain Current (10µs pulse, duty cycle = 1%) Maximum Body Diode Continuous Current Avalanche Current (Note 7) L = 0.1mH Avalanche Energy (Note 7) L = 0.1mH
Steady
State t<10s
T
= +25°C
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
DM
I
S
I
AR
E
AR
60 V
±20 V
5.3
4.1
6.5
5.1
A
A
30 A
2.5 A
14.2 A 10 mJ
Thermal Characteristics
Characteristic Symbol Value Units
T
= +25°C
Total Power Dissipation (Note 5)
ADVANCE INFORMATION
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
A
TA = +70°C
Steady state
t<10s 132
T
= +25°C
A
TA = +70°C
Steady state
t<10s 43
P
R
P
R R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
0.66
0.42 189
2.03
1.31
W
°C/W
W
61
°C/W
9.3
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
60
V
100 nA
±100
nA
VGS = 0V, ID = 250µA VDS = 60V, VGS = 0V V
= ±20V, VDS = 0V
GS
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
SD
1
⎯ ⎯ ⎯
|
fs
30 38
35 47
4.5
0.7 1.2 V
3 V
VDS = VGS, ID = 250µA V
mΩ
V
S
V VGS = 0V, IS = 1A
= 10V, ID = 4.3A
GS
= 4.5V, ID = 4A
GS
= 10V, ID = 4.3A
DS
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
C
iss
C
oss
C
rss
R
G
Total Gate Charge (VGS = 10V) Qg Total Gate Charge (VGS = 4.5V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. I
and EAR rating are based on low frequency and duty cycles to keep TJ = +25°C.
AR
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
Q
s
Q
d
t
D(on
t
t
D(off
t
f
t
r
Q
r
1287
57 44
1.2
22.4
10.4
4.9
3.0
6.6
8.1
20.1
4.0 18
11.9
⎯ ⎯ ⎯
pF
V
= 25V, VGS = 0V
DS
f = 1.0MHz
Ω VDS = 0V, VGS = 0V, f = 1.0MHz ⎯
nC
V
= 30V, ID = 4.3A
DS
⎯ ⎯ ⎯ ⎯
nS
= 10V, VDD = 30V, RG = 6Ω,
V
GS
I
= 4.3A
D
nS
IS = 4.3A, dI/dt = 100A/μs
nC
IS = 4.3A, dI/dt = 100A/μs
DMN6040SFDE
D
atasheet number: DS35792 Rev. 8 - 2
2 of 6
www.diodes.com
August 2012
© Diodes Incorporated
Loading...
+ 4 hidden pages