Diodes DMN601DMK User Manual

Page 1
n
Product Summary
V
R
(BR)DSS
60V
max
DS(ON)
2.4 @ V
= 10V
GS
4.0 @ VGS = 4V
Description and Applications
This new generation MOSFET has been designed to minimize the on-state resistance (R performance, making it ideal for high efficiency power management
NEW PRODUCT
applications.
DC-DC Converters
Power management functions
Analog Switch
ESD PROTECTED TO 2kV
) and yet maintain superior switching
DS(on)
max
I
D
TA = 25°C
510mA
390mA
SOT26
Top View
DMN601DM
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Up To 2kV
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT26
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.015 grams (approximate)
Drai
S
G
1
1
D
G
1
2
Gate
Gate
Protection
Diode
Source
Equivalent Circuit
Per Element
Body Diode
D
2
S
2
Top View
Internal Schematic
Ordering Information (Note 3)
Part Number Case Packaging
DMN601DMK-7 SOT26 3000/Tape & Reel
Notes: 1. No purposefully added lead
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
K7K YM
K7K YM
Date Code Key
Year 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code S T U V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN601DMK
Document number: DS30657 Rev. 5 - 2
K7K = Marking Code YM = Date Code Marking Y = Year (ex: S = 2005) M = Month (ex: 9 = September)
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November 2011
© Diodes Incorporated
Page 2
θ
)
g
g
g
g
)
r
)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4V
Pulsed Drain Current (10µs pulse, duty cycle = 1%) Maximum Body Diode Continuous Current
NEW PRODUCT
Thermal Characteristics @T
Total Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient (Note 4) Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5) Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
DMN601DM
Characteristic Symbol Value Units
V
DSS
V
GSS
T
Steady
State
t<10s
Steady
State
t<10s
= 25°C unless otherwise specified
A
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
I
D
I
D
I
D
I
D
I
DM
I
S
Characteristic Symbol Value Units
P
Steady state
t<10s 121
Steady state
t<10s 88
R
P R R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
60 V ±20 V 510
400 580
470 390
300 440
340
mA
mA
mA
mA
850 mA
1.2 A
0.7 W
157
°C/W
0.98 W 113
°C/W
26
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I I
GSS
DSS
60
DSS
1
±10 μA
V
VGS = 0V, ID = 10μA
μA
= 60V, VGS = 0V
V
DS
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
1.0 1.6 2.5 V
100
0.5
⎯ ⎯
⎯ ⎯
fs
SD
|
2.4 Ω
4.0
ms
1.4 V
VDS = 10V, ID = 1mA V
= 10V, ID = 200mA
GS
VGS = 4V, ID = 200mA VDS =10V, ID = 200mA VGS = 0V, IS = 115mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Guaranteed by design. Not subject to production testing
DMN601DMK
Document number: DS30657 Rev. 5 - 2
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
6. Short duration pulse test used to minimize self-heating effect
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C
iss
C
oss
C
rss
R Q
Q
s
Q
d
t
D(on
t
t
D(off
t
f
2 of 5
30 50 pF
5 25 pF
3 5.0 pF
133
304
84
203
3.9
3.4
15.7
9.9
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
V
= 25V, VGS = 0V
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
= 4.5V, VDS = 10V,
V
GS
nC
= 250mA
I
D
V
= 30V, ID = 0.2A,
DS
ns
V
= 10V, RG = 25, RL = 150
GS
November 2011
© Diodes Incorporated
Page 3
R
CUR
RENT
GATE THRESH
O
OLTAG
NEW PRODUCT
DMN601DM
1.0
(A)
0.8
0.6
AIN
0.4
D
I, D
0.2
0
012345
V , DRAIN-SOURCE VOLT AGE (V)
DS
Fig. 1 Typical Output Characteristics
2
V = 10V
DS
I= 1mA
E (V)
D
Pulsed
10
V , GATE-SOURCE VOLTAGE (V)
GS
Fig. 2 Typical Transfer Characteristics
1.5
Ω
LD V
1
0.5
GS(TH)
V,
0
-50
10
Ω
ON-RESISTANCE ( )
DS(ON)
R , STATIC DRAIN-SOURCE
-25
T , CHANNEL TEMPERATURE (°C)
ch
25 50 75 100 125 150
0
Fig. 3 Gate Threshold Vo ltage
vs. Chann el Temperature
1
ON-RESISTANCE ( )
DS(ON)
R , STATIC DRAIN-SOURCE
0.1
Ω
ON-RESISTANCE ( )
DS(ON)
R , STATIC DRAIN-SOURCE
,
I DRAIN CURRENT(A)
D
Fig. 4 Static D r ai n- Source On-Resistance
vs. Drain Cur r ent
1
I , DRAIN CURRENT (A)
D
Fig. 5 Static Drain-Source On-Resistance
vs. Drain C urrent
DMN601DMK
Document number: DS30657 Rev. 5 - 2
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0
V GATE-SOURCE VOLTAGE (V)
GS,
Fig. 6 Static Drain-Source On-Resistance
vs. G ate- S ource V olt a ge
November 2011
© Diodes Incorporated
Page 4
Y
O
RWARD T
RAN
R
T
TAN
C
NEW PRODUCT
Ω
ON-STATE RESISTANCE ( )
DS(ON)
R , STA T IC DRAIN-SOURCE
0
T , CHANNEL TEMPERATURE ( C)
CH
Static Drain-Source On-State Resistance
Fig. 7
vs. Chann el Temperature
DMN601DM
DR
I , REVERSE DRAIN CURRENT (A)
°
E (S)
ADMI
SFE
DR
I , REVERSE DRAIN CURRENT (A)
1
|, F
fs
|
I , DRAIN CURRENT (A)
Fig.10 Forward Transfer Admittance vs. Drain Current
D
1
Package Outline Dimensions
DMN601DMK
Document number: DS30657 Rev. 5 - 2
K
J
A
B C
H
M
D
L
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Dim Min Max Typ
SOT26
A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D
H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40
M 0.10 0.20 0.15
0° 8°
α
All Dimensions in mm
0.95
November 2011
© Diodes Incorporated
Page 5
DMN601DM
Suggested Pad Layout
NEW PRODUCT
G
Z
Y
X
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
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2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
C2
C2
C1
IMPORTANT NOTICE
LIFE SUPPORT
Dimensions Value (in mm)
Z 3.20 G 1.60 X 0.55
Y 0.80 C1 2.40 C2 0.95
DMN601DMK
Document number: DS30657 Rev. 5 - 2
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November 2011
© Diodes Incorporated
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