Features
• Dual N-Channel MOSFET
• Low On-Resistance (1.0V max)
• Very Low Gate Threshold Voltage
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• Ultra-Small Surface Mount Package
• ESD Protected up to 2kV
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 standards for High Reliability
NEW PRODUCT
ESD PROTECTED TO 2kV
SOT363
Top View
DMN5L06DWK
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
• Case: SOT363
• Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Finish – Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Weight: 0.006 grams (approximate)
D
2
S
2
Top View
Internal Schematic
S
G
G
1
1
D
1
2
Ordering Information (Note 3)
Part Number Case Packaging
DMN5L06DWK-7 SOT363 3000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2006 2007 2008 2009 2010 2011 2012
Code T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DAB YM
DAB YM
DMN5L06DWK
Document number: DS30930 Rev. 5 - 2
DAB = Marking Code
YM = Date Code Marking
Y = Year ex: T = 2006
M = Month ex: 9 = September
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DMN5L06DWK
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Drain Source Voltage
Gate-Source Voltage
Drain Current (Note 4) Continuous
Pulsed (Note 5)
V
DSS
V
GSS
I
D
50 V
±20
305
800
V
mA
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Total Power Dissipation (Note 4)
NEW PRODUCT
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
P
D
R
JA
T
, T
J
STG
250 mW
500
-65 to +150
°C/W
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @ TC = 25°C I
Gate-Body Leakage
50
BV
DSS
⎯ ⎯
DSS
I
⎯ ⎯
GSS
⎯ ⎯
60 nA
1
500
50
V
μA
nA
nA
V
= 0V, ID = 10μA
GS
V
= 50V, VGS = 0V
DS
V
= ±12V, VDS = 0V
GS
V
= ±10V, VDS = 0V
GS
= ±5V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
On-State Drain Current
Forward Transconductance
Source-Drain Diode Forward Voltage
V
GS(th
R
DS (ON)
I
D(ON
|Y
V
SD
0.49
⎯
⎯
⎯
0.5 1.4
200
|
fs
0.5
⎯
⎯
⎯
⎯
⎯ ⎯
⎯
1.0 V
3.0
2.5
2.0
⎯
1.4 V
VDS = VGS, ID = 250μA
V
Ω
V
V
A
VGS = 10V, VDS = 7.5V
mS
VDS =10V, ID = 0.2A
VGS = 0V, IS = 115mA
= 1.8V, ID = 50mA
GS
= 2.5V, ID = 50mA
GS
= 5.0V, ID = 50mA
GS
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes: 4. Device mounted on FR-4 PCB.
5. Pulse width ≤10μS, Duty Cycle ≤1%.
6. Short duration pulse test used to minimize self-heating effect.
C
⎯ ⎯
iss
C
⎯ ⎯
oss
C
⎯ ⎯
rss
50 pF
25 pF
5.0 pF
V
f = 1.0MHz
= 25V, VGS = 0V
DS
DMN5L06DWK
Document number: DS30930 Rev. 5 - 2
2 of 6
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September 2011
© Diodes Incorporated