Diodes DMN55D0UT User Manual

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Features
Low On-Resistance
Very Low Gate Threshold Voltage
Low Input Capacitance
ESD Protected Gate to 2kV
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
ESD PROTECTED TO 2kV
SOT523
Top View
DMN55D0UT
N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
Case: SOT523
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.002 grams (approximate)
Drain
D
Gate
Gate Protection Diode
Equivalent Circuit
Source
GS
To
View
Ordering Information (Note 4)
Part Number Qualification Case Packaging
DMN55D0UT -7 Commercial SOT523 3000/Tape & Reel
DMN55D0UTQ -7 Automotive SOT523 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code U V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
NAC YM
DMN55D0UT
Document number: DS31330 Rev. 5 - 2
NAC = Product Type Marking Code YM = Date Code Marking Y = Year (ex: U = 2007) M = Month (ex: 9 = September)
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December 2012
© Diodes Incorporated
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)
DMN55D0UT
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage Drain Current (Note 5) Continuous Pulsed Drain Current (Note 5)
V
DSS
V
GSS
I
D
I
DM
50 V
±12
V 160 mA 560 mA
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
P
D
R
JA
T
, T
J
STG
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current
Gate-Body Leakage
BV
I
DSS
I
GSS
50
DSS
1
1.0
5.0
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
V
GS(th
R
DS (ON)
g
0.7 0.8 1.0 V
3.1 4
180
FS
4 5
DYNAMIC CHARACTERISTICS
Input Capacitance Output Capacitance Reverse Transfer Capacitance
Notes: 5. Device mounted on FR-4 PCB, pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
DMN55D0UT
Document number: DS31330 Rev. 5 - 2
C
iss
C
oss
C
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2.1
⎯ ⎯ ⎯
200 mW 625
-55 to +150
V
VGS = 0V, ID = 250μA
μA μA
= 50V, VGS = 0V
V
DS
= ±8V, V
V
GS
= ±12V, V
V
GS
DS
DS
°C/W
°C
= 0V
= 0V
VDS = VGS, ID = 250μA V
= 4V, ID = 100mA
GS
Ω
VGS = 2.5V, ID = 80mA
mS
V
= 10V, ID = 100mA, f = 1.0KHz
DS
pF pF
V
DS
= 10V, V
= 0V, f = 1.0MHz
GS
pF
December 2012
© Diodes Incorporated
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