Diodes DMN3730U User Manual

30V N-CHANNEL ENHANCEMENT MODE MOSFET IN SOT23
Product Summary
I
Max (Note 5)
V
Max R
(BR)DSS
30V
DS(on)
460mΩ @ V 560mΩ @ VGS= 2.5V
= 4.5V
GS
D
TA = 25°C
0.94A
0.85A
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(on)
ideal for high efficiency power management applications.
Load switch
Portable applications
Power Management Functions
ESD PROTECTED TO 2kV
SOT23
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DMN3730U
Features and Benefits
Low V
Low R
“Lead Free”, RoHS Compliant (Note 1)
Halogen and Antimony Free. "Green" Device (Note 2)
ESD Protected Gate 2kV
Qualified to AEC-Q101 Standards for High Reliability
can be driven directly from a battery
GS(th), DS(on)
Mechanical Data
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish-Matte Tin.
Weight: 0.08 grams (approximate)
Drain
G
D
S
Pin-Out
Gate
Gate Protection Diode
Equivalent Circuit
Body Diode
Source
Ordering Information (Note 3)
Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel
DMN3730U-7 N3U 7 8 3,000
Notes: 1. No purposefully added lead
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
N3U
YM
N3U = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September)
DMN3730U
Datasheet number: DS35308 Rev. 2 - 2
1 of 7
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July 2011
© Diodes Incorporated
P
P
T
R
T P
OWER
R
N C
URREN
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current (Note 6)
Steady
State
= 25°C (Note 5)
T
A
= 85°C (Note 5)
T
A
T
= 25°C (Note 4)
A
V V
DSS GSS
I
I
DM
D
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Power Dissipation Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 4) (Note 5) 0.71 W (Note 4) (Note 5) 177 °C/W
P
D
R
θJA
, T
T
J
STG
Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout
5. Device mounted on 25mm X 25mm square copper plate with FR-4 substrate PC board, 2oz copper
6. Device mounted on minimum recommended pad layout test board, 10
μs pulse duty cycle = 1%.
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DMN3730U
30 V ±8 V
0.94
0.68
0.75 10 A
0.45 W
275 °C/W
-55 to +150 °C
A
Thermal Characteristics
100
90
(W)
80
Single Pulse Rthja = 176C/W Rthja(t) = Rthja*r(t) T - T = P*Rthja (t)
JA
70 60
50
ANSIEN
40 30
EAK
20
(pk),
10
0
0.001 0.01 0.1 1 10 100 1000 T1, PULSE DURATION SECTION (sec)
Fig. 1 Single Maximum Power Dissipation
DMN3730U
Datasheet number: DS35308 Rev. 2 - 2
2 of 7
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100
R
DS(ON)
Limited
10
(A)
1
AI
0.1
D
I, D
0.01
0.001
T , (Max) = 150°C
J
T = 25°C
A
Single Pulse
0.01 0.1 1 10 100 V , DRAIN-SOURCE VOLTAGE
I (A) @
D
P = 100ms
W
DS
I (A) @
D
P = 10ms
W
I (A) @ DC
D
I (A) @
D
P = 1ms
W
I (A) @
D
P = 1s
W
Fig. 2 SOA, Safe Oper at ion Area
I (A) @
D
P = 100µs
W
I (A) @
D
P = 10µs
W
July 2011
© Diodes Incorporated
)
g
g
g
g
)
r
)
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Diodes Incorporated
DMN3730U
1
r(t) @ D=0.5
r(t) @ D=0.3
0.1
r(t) @ D=0.1
r(t) @ D=0.05
r(t) @ D=0.01
r(t) @ D=0.7
r(t) @ D=0.9
0.01
r(t) @ D=0.005
R(t), TRANSIENT THERMAL RESISIT ANCE
r(t) @ D=Single Pulse
0.001
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
r(t) @ D=0.01
R (t) = r(t)*R
θθ
JA JA
R = 176C/W
θ
JA
Duty Cycle, D = t1/t2
t1, PULSE DURATION TIME (sec)
Fig. 3 Transient Thermal Resist ance
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
30 - - V
- - 1
- - 3
VGS = 0V, ID = 10μA
μA μA
= 30V, VGS = 0V
V
DS
= ±8V, VDS = 0V
V
GS
ON CHARACTERISTICS Gate Threshold Voltage
Static Drain-Source On-Resistance (Note 7)
Forward Transfer Admittance Diode Forward Voltage (Note 7)
V
R
DS(on)
|Y V
GS(th
fs
SD
0.45 - 0.95 V 460
- -
560 730
40 - - mS
|
- 0.7 1.2 V
VDS = VGS, ID = 250μA V
= 4.5V, ID = 200mA
mΩ
GS
= 2.5V, ID = 100mA
V
GS
= 1.8V, ID = 75mA
V
GS
VDS = 3V, ID = 10mA
VGS = 0V, IS = 300mA DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance
Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 7. Measured under pulsed conditions to minimize self-heating effect. Pulse width 300μs; duty cycle 2%
8. For design aid only, not subject to production testing.
C C
t
t
C
oss rss
R
Q Q Q
D(on
t
D(off
t
iss
s d
f
- 64.3 -
- 6.1 -
- 4.5 -
- 70 -
- 1.6 -
- 0.2 -
- 0.2 -
- 3.5 -
- 2.8 -
- 38 -
- 13 -
pF pF pF Ω nC nC nC
= 25V, VGS = 0V,
V
DS
f = 1.0MHz VDS = 0V, VGS = 0V, f = 1MHz V
= 4.5V, VDS = 15V,
GS
= 1A
I
D
ns ns ns
= 10V, I
V
DS
= 10V, RG = 6Ω
V
GS
D
ns
= 1A
DMN3730U
Datasheet number: DS35308 Rev. 2 - 2
3 of 7
www.diodes.com
July 2011
© Diodes Incorporated
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