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Features
• Low On-Resistance:
R
R
< 88mΩ @ V
DS(ON)
< 138mΩ @ V
DS(ON)
GS
GS
= 4.5V
= 2.5V
• Low Gate Threshold Voltage
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• Lead Free By Design/RoHS Compliant (Note 2)
• "Green" Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
NEW PRODUCT
Maximum Ratings @T
Characteristic Symbol Value Unit
Drain Source Voltage
Gate-Source Voltage
Drain Current (Note 1) TA = 25°C
TA = 70°C
Drain Current (Note 1) Pulsed
Body-Diode Continuous Current (Note 1)
= 25°C unless otherwise specified
A
DMN3150L
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Mechanical Data
• Case: SOT-323
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
SOT-323
Gate
TOP VIEW
V
V
Drain
Source
EQUIVALENT CIRCUIT
DSS
GSS
ID
IDM
IS
D
GS
Pin Configuration
28 V
±12
1.6
1.2
6.4 A
1.5 A
V
A
Thermal Characteristics
Characteristic Symbol Value Unit
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 1)
Operating and Storage Temperature Range
Electrical Characteristics @T
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
Source-Drain Diode Forward Voltage
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes: 1. Device mounted on 1in2 FR-4 PCB on 2oz. Copper. t ≤ 10 sec.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
DMN3150LW
Document number: DS31514 Rev. 1 - 2
2. No purposefully added lead.
4. Short duration pulse test used to minimize self-heating effect.
= 25°C unless otherwise specified
A
P
R
θ
T
J, TSTG
BV
DSS
I
DSS
I
GSS
V
R
DS(ON)
GS(th)
0.62 0.94 1.4 V
|Yfs|
V
SD
C
iss
C
oss
C
rss
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D
JA
28
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯
⎯
⎯
73
115
5.4
⎯ ⎯
⎯
⎯
⎯
305
74
48
350 mW
357 °C/W
-55 to +150 °C
V
V
= 0V, ID = 250μA
800 nA
±80
±800
nA
GS
V
= 28V, VGS = 0V
DS
VGS = ±12V, VDS = 0V
VGS = ±19V, VDS = 0V
VDS = VGS, ID = 250μA
88
138
⎯
1.16 V
⎯
⎯
⎯
VGS = 4.5V, ID = 1.6A
mΩ
VGS = 2.5V, ID = 1.2A
S
VDS = 5V, ID = 2.7A
VGS = 0V, IS = 1.5A
pF
VDS = 5V, VGS = 0V
pF
f = 1.0MHz
pF
August 2008
© Diodes Incorporated
8
6
4
2
0
NEW PRODUCT
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 1 Typical Output Characteristics
0.16
E
0.12
Ω
AIN-S
0.08
, S
ON-RESISTANCE ( )
0.04
DS(on)
V = 2.5V
GS
V = 4.5V
GS
V = 10V
GS
DMN3150L
8
V = 5V
DS
Pulsed
6
4
2
0
0.5 1 1.5 2 2.5 3
V , GATE-SOURCE VOLTAGE (V)
GS
Fig. 2 Typical Transfer Characteristics
f = 1 MHz
T = 25°C
A
)
E (p
C
iss
C
oss
C
rss
0
0246
I , DRAIN CURRENT (A)
D
On-Resistance
Fig. 3
vs. Drain C urrent and Gat e Volt age
1.4
1.2
1.0
0.8
8
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 4 Typical Total Capacitance
1.6
E
1.4
V = 4.5V
1.2
D
I
A
1.0
GS
I = 1.6A
D
, S
DS(ON)
0.6
0.4
ON-RESISTANCE (NORMALIZED)
0.8
0.6
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (C)
Fig. 6 Normalized Static Drain-Source On-Resistance
A
vs. Ambien t T empe rature
DMN3150LW
Document number: DS31514 Rev. 1 - 2
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August 2008
© Diodes Incorporated