Diodes DMN3135LVT User Manual

Product Summary
V
R
(BR)DSS
30V
60mΩ @ V
100mΩ @ VGS = 4.5V
DS(on)
GS
= 10V
Description and Applications
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
Backlighting
DC-DC Converters
Power management functions
ADVANCE INFORMATION
) and yet maintain superior switching
DS(on)
TSOT26
Top View
G1
S2
G2
I
D
TA = 25°C
3.5A
2.8A
1
2
3
Top View
DMN3135LVT
30V DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
Case: TSOT26
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See Diagram
Terminals: Finish – Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.013 grams (approximate)
6
D1
5
S1
4
D2
Equivalent Circuit
Ordering Information (Note 4)
Part Number Case Packaging
DMN3135LVT-7 TSOT26 3000 / Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2010 2011 2012 2013 2014 2015 2016
Code X Y Z A B C D
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
31D
YM
DMN3135LVT
Document number: DS35408 Rev. 6 - 2
31D = Product Type Marking Code YM = Date Code Marking Y = Year (ex: X = 2010) M = Month (ex: 9 = September)
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© Diodes Incorporated
May 2012
θ
)
g
g
g
g
g
r
DMN3135LVT
Maximum Ratings @ T
= 25°C unless otherwise stated
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Continuous Drain Current (Note 6) VGS = 4.5V
Pulsed Drain Current (10μs pulse, duty cycle = 1%) Maximum Body Diode Forward Current (Note 5)
Thermal Characteristics @ T
Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5)
ADVANCE INFORMATION
Total Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient (Note 6) Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
30 V
±20 V
3.5
2.7
4.3
3.3
2.8
2.1
3.4
2.6
A
A
A
A
25 A
1.5 A
Steady
State t<10s
Steady
State t<10s
= 25°C unless otherwise stated
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
Characteristic Symbol Value Units
P
Steady state
t<10s 109
Steady state
t<10s 72
R
P R R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
0.84 W 155
°C/W
1.27 W 102
°C/W
34
-55 to +150 °C
Electrical Characteristics @ T
= 25°C unless otherwise stated
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
30 - - V
- - 1.0 µA
- - ±100 nA
VGS = 0V, ID = 250µA VDS = 24V, VGS = 0V
VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
1.3 1.8 2.2 V
-
|
- 4 - S
- 0.8 1 V
35 54
60
100
VDS = VGS, ID = 250A
V
= 10V, ID = 3.1A
m
GS
VGS = 4.5V, ID = 2A
VDS = 5V, ID = 3.1A
VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
C C C
R Q
Q Q Q
t
D(on)
t
D(off)
iss
oss
rss
t
t
s d
f
DMN3135LVT
Document number: DS35408 Rev. 6 - 2
- 305 -
- 40 -
- 40 -
- 1.4 -
- 4.1 -
- 9.0 -
- 1.2 -
- 1.5 -
- 2.6 -
- 4.6 -
- 13.1 -
- 2.5 -
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V
= 15V, VGS = 0V,
DS
pF
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz VDS = 15V, VGS = 4.5V, ID = 3.1A
nC
ns
= 15V, VGS = 10V, ID = 3.1A
V
DS
= 10V, VDS = 15V,
V
GS
= 3, RL = 4.7
R
G
© Diodes Incorporated
May 2012
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