Diodes DMN30H4D0L User Manual

Page 1
DMN30H4D0L
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V
R
(BR)DSS
300V
4 @ V
4 @ VGS = 4.5V
DS(ON)
GS
= 10V
TA = +25°C
Description and Applications
This new generation MOSFET has been designed to minimize the
on-state resistance (R
performance, making it ideal for high efficiency power management
applications.
Description and Applications
DC-DC Converters
Power management functions
Battery Operated Systems and Solid-State Relays
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories, Transistors, etc
) and yet maintain superior switching
DS(ON)
Top View
I
D
0.25A
0.25A
G
Pin Configuration
D
Top View
Features and Benefits
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Small Surface Mount Package
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram
Weight: 0.008 grams (approximate)
D
G
S
S
Equivalent Circuit
Ordering Information (Note 4)
Part Number Case Packaging
DMN30H4D0L-7 SOT23 3,000/Tape & Reel
DMN30H4D0L-13 SOT23 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2013 2014 2015 2016 2017 2018 2019
Code A B C D E F G
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN30H4D0L
Document number: DS36313 Rev. 2 - 2
2H = Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site) YM = Date Code Marking for CAT (Chengdu Assembly/ Test site) Y or Y = Year (ex: A = 2013) M = Month (ex: 9 = September)
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© Diodes Incorporated
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Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
T
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
= +25°C
A
= +70°C
T
A
Pulsed Drain Current (10s pulse, duty cycle ≦1%)
Maximum Body Diode Continuous Current (Note 6)
Thermal Characteristics (@T
Total Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Characteristic Symbol Value Units
= +25°C, unless otherwise specified.)
A
(Note 5)
(Note 6) 0.47
(Note 5)
(Note 6) 255
(Note 6)
Operating and Storage Temperature Range
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
BV
I
DSS
I
GSS
DSS
300
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
1
Static Drain-Source On-Resistance
R
DS(ON)


Diode Forward Voltage
V
SD
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout 7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f


DMN30H4D0L
Document number: DS36313 Rev. 2 - 2
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V
DSS
V
GSS
I
D
I
DM
I
S
P
D
R
JA
R
JC
T
J, TSTG
1.0 µA
±100 nA
3 V
2.1 4
2.1 4
3.8 6
0.7 1.2 V
187.3
11.7
8.7
7.6
0.5
3.3
4.9
4.7
25.8
17.5


DMN30H4D0L
300 V
±20 V
0.25
0.20
2 A
0.8 A
0.31
377
81
-55 to 150 °C
V
V
= 0V, ID = 250µA
GS
V
= 240V, V
DS
V
GS =
V
= VGS, ID = 250 µA
DS
V
= 10V, ID = 0.3A
GS
V
= 4.5V, ID = 0.2A
GS
V
= 2.7V, ID = 0.1A
GS
VGS = 0V, IS = 0.3A
VDS = 25V, VGS = 0V,
pF
f = 1.0MHz
V
= 192V, VGS = 10V,
nC
nS
DS
= 0.5A
I
D
= 60V, RL =200
V
DS
= 10V, RG = 25
V
GS
±20V, V
GS
DS
A
W
°C/W
= 0V
= 0V
February 2014
© Diodes Incorporated
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R
CUR
R
T
RAIN CUR
R
N
T
O
O
R, D
RAIN-SOUR
CE O
N-R
TAN
C
R
R
O
R
O
R
R
D
RAIN
OUR
C
DMN30H4D0L
1.0
0.8
V = 10VGS
V= 4.5V
GS
V= 3.5V
GS
0.8
V = 5.0VDS
0.7
0.6
(A)
EN
0.6
V= 3.0V
GS
(A)
E
0.5
0.4
T = 150°C
AIN
D
I, D
0.4
0.2
V= 2.5V
GS
D
I, D
0.3
0.2
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
0.1
T = -55°C
A
V= 2.2V
0.0 012345
V , DRAIN-SOURCE VOLTAGE (V)
DS
GS
Figure 1 Typical Output Characteristics
3
2.8
2.6
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V , GATE-SOURCE VOLTAGE (V)
GS
E ( )
5.5
Figure 2 Typical Transfer Characteristics
6
I = 200mA
D
5
2.4
2.2
N-RESISTANCE ( )
2
URCE
1.8
V = 4.5VGS
V = 10VGS
1.6
ESIS
4.5
4
I = 300mA
D
3.5
3
1.4
1.2
DS(ON)
R , DRAIN-S
1
0 0.1 0.2 0.3 0.4 0.5
I , DRAIN-SOURCE CURRENT (A)D Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
8
V = 4.5VGS
7
T = 150°C
6
ESISTANCE ( )
5
N-
4
CE U
3
AIN-S
2
, D
1
DS(ON)
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
I , DRAIN CURRENT (A)
D
T = 125°C
A
A
T = 25°C
A
T = 85°C
A
T = -55°C
A
Figure 5 Typical On-Resistance vs.
DMN30H4D0L
Document number: DS36313 Rev. 2 - 2
Drain Current and Temperature
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2.5
DS(ON)
2
0 2 4 6 8 1012 1416 1820
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 4 Typical Transfer Characteristics
3
V=V
10
2.5
E
GS
I = 400mA
D
2
-S
1.5
V=5V
GS
I = 200mA
D
,
1
DS(ON)
0.5
ON-RESISTANCE (NORMALIZED)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
Figure 6 On-Resistance Variation with Temperature
J
February 2014
© Diodes Incorporated
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R
RAIN-SOUR
CE O
N-R
TAN
C
GATE THRESH
O
OLTAG
OUR
CE CUR
REN
T
C
UNC
TION CAPACITANC
GAT
THR
H
O
OLT
G
R
C
U
R
RENT
6
3
E ( )
5
4
ESIS
V=5V
GS
I = 200mA
D
V=V
10
GS
I = 300mA
D
3
2
, D
1
DS(ON)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
Figure 7 On-Resistance Variation with Temperature
J
1
E (V)
2.5
2
LD V
I = 250µA
D
1.5
1
0.5
GS(th)
V,
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
J
1,000
0.9
(A)
S
I, S
0.8
0.7
0.6
0.5
0.4
0.3
0.2
T = 150°C
A
T = 125°C
A
T= 85°C
A
E (pF)
100
T= 25°C
A
10
T= -55°C
A
, J
T
0.1
0
0 0.3 0.6 0.9 1.2 1.5
V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 9 Diode Forward Voltage vs. Current
10
f = 1MHz
1
0 5 10 15 20 25 30 35 40
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 10 Typical Junction Capacitance
10
R
DS(on)
Limited
DMN30H4D0L
I= 1mA
D
C
rss
C
iss
C
oss
E (V)
8
A
6
LD V
ES
4
V = 192V
DS
I= A
0.5
D
E
2
GS
V
0
012345678
Q(nC)
, TOTAL GATE CHARGE
g
Figure 11 Gate Charge
1
(A)
0.1
AIN
D
-I , D
0.01
0.001
T = 150°C
J(max)
T = 25°C
A
V = 4.5V
GS
Single Pulse DUT on 1 * MRP Board
DC
P = 10s
W
P = 1s
P = 100ms
W
W
P = 10ms
W
P = 1ms
W
P = 100µs
W
0.1 1 10 100 1000
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 12 SOA, Safe Operation Area
DMN30H4D0L
Document number: DS36313 Rev. 2 - 2
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T
R
T T
HER
R
TANC
DMN30H4D0L
1
D = 0.9 D = 0.7
E
D = 0.5
D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
r(t),
D = 0.005
D = Single Pulse
R (t) = r(t) * R

JA JA
R = 160°C/W
JA
Duty Cycle, D = t1/ t2
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000 t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
K
J
A
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40 B 1.20 1.40 1.30
C
B
C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83
H
H 2.80 3.00 2.90 J 0.013 0.10 0.05
K1
F
D
G
L
M
K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
0° 8° -

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
DMN30H4D0L
Document number: DS36313 Rev. 2 - 2
Y
Z
C
Dimensions Value (in mm)
Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35
X
E
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A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMN30H4D0L
DMN30H4D0L
Document number: DS36313 Rev. 2 - 2
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