Diodes DMN3033LSN User Manual

θ
q
Features
Low Gate Charge
Low R
30 mΩ @V
40 mΩ @V
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
"Green" Device (Note 4)
DS(ON)
:
= 10V
GS
= 4.5V
GS
SC-59
Top View E
Drain
Gate
uivalent Circuit
DMN3033LSN
N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
Case: SC-59
Case Material - Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.014 grams (approximate)
D
Source
G
Pin Configuration
S
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Drain-Source Voltage Gate-Source Voltage Drain Current (Note 1) Continuous TA = 25°C T
= 70°C
A
Pulsed Drain Current (Note 2) Body-Diode Continuous Current (Note 1)
V
DSS
V
GSS
I
D
I
DM
I
S
30 V
±20
6 5
V A
24 A
2.25 A
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Total Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) t ≤10s Operating and Storage Temperature Range
Notes: 1. Device mounted on 1"x1", FR-4 PC board with 2 oz. Copper and test pulse width t 10s.
2. Repetitive Rating, pulse width limited by junction temperature.
3. No purposefully added lead.
4. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
P
D
R
JA
T
, T
J
STG
1.4 W 90
-55 to +150
°C /W
°C
DMN3033LSN
Document number: DS31116 Rev. 6 - 2
1 of 5
www.diodes.com
August 2011
© Diodes Incorporated
)
g
g
g
)
r
)
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
STATIC PARAMETERS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C
T
= 55°C
J
Gate-Body Leakage Current Gate Threshold Voltage
Static Drain-Source On-Resistance (Note 5) Forward Transconductance (Note 5)
Diode Forward Voltage (Note 5)
DYNAMIC PARAMETERS (Note 6)
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
Notes: 5. Test pulse width t = 300ms.
6. Guaranteed by design. Not subject to production testing.
BV
DSS
I
DSS
I
GSS
V
GS(th
R
DS (ON)
g
FS
V
SD
Q
Q
s
Q
d
t
D(on
t
t
D(off
t
f
C
iss
C
oss
C
rss
30
1.0
⎯ ⎯
1 5
±100
25 36
5
2.1 V 30
40
V μA nA
mΩ
S
0.7 1.1 V
10.5
3.8
2.9 11
7 63 30
755 136 108
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
nC nC nC
ns ns ns
ns pF pF pF
20
DMN3033LSN
ID = 250μA, VGS = 0V V
= 30V, VGS = 0V
DS
V
= 0V, VGS = ±20V
DS
V
= VGS, ID = 250μA
DS
= 10V, ID = 6A
V
GS
= 4.5V, ID = 5A
V
GS
V
= 10V, ID = 8A
DS
IS = 2.25A, V
VGS = 5V, V VGS = 10V, V VGS = 10V, V
= 15V, V
V
DD
R
= 1.8Ω, RG = 6Ω
D
= 10V, VGS = 0V
V
DS
f = 1.0MHz
= 0V
GS
= 15V, ID = 6A
DS
= 15V, ID = 6A
DS
= 15V, ID = 6A
DS
= 10V,
GS
18
V = 5V
DS
Pulsed
16 14 12 10
8 6
4 2
0
01234
DMN3033LSN
Document number: DS31116 Rev. 6 - 2
2 of 5
www.diodes.com
August 2011
© Diodes Incorporated
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