Diodes DMN3024SFG User Manual

Page 1
30V N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI
®
Product Summary
I
max
D
7.5A
6.3 A
V
(BR)DSS
30V
R
23m @ V
33m @ VGS = 4.5V
DS(ON)
max
= 10V
GS
TA = 25°C
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(on)
ideal for high efficiency power management applications.
ADVANCE INFORMATION
Backlighting
Power Management Functions
DC-DC Converters
Top View
POWERDI3333-8
D
D
D
D
Bottom View
Features and Benefits
100% Unclamped Inductive Switch (UIS) test in production
Low R
Small form factor thermally efficient package enables higher
density end products
Occupies just 33% of the board area occupied by SO-8 enabling smaller end product
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
– ensures on state losses are minimized
DS(ON)
Mechanical Data
Case: POWERDI3333-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
Pin 1
S
S
S
G
1 2 3 4
Top View
Internal Schematic
8 7 6 5
Ordering Information (Note 4)
Part Number Case Packaging
DMN3024SFG-7 POWERDI3333-8 2000/Tape & Reel
DMN3024SFG-13 POWERDI3333-8 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Marking Information
POWERDI is a registered trademark of Diodes Incorporated
DMN3024SFG
Document number: DS35439 Rev. 3 - 2
N34 = Product Type Marking Code
YYWW
N34
YYWW = Date Code Marking YY = Last digit of year (ex: 11 = 2011) WW = Week code (01 ~ 53)
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Page 2
θ
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Continuous Drain Current (Note 6) VGS = 4.5V
Pulsed Drain Current (10s pulse, duty cycle = 1%) Avalanche Current (Note 7) Repetitive Avalanche Energy (Note 7)
Steady
State
t<10s
Steady
State
t<10s
T
= 25°C
A
= 70°C
T
A
= 25°C
T
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
= 25°C
T
A
T
= 70°C
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
AS
E
AS
30 V
±25 V
7.5
6.0
10.5
8.5
6.3
5.0
8.5
7.6
A
A
A
A
60 A
9 A
12 mJ
ADVANCE INFORMATION
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
T
= 25°C
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
A
TA = 70°C
Steady state
t<10s 74
T
= 25°C
A
TA = 70°C
Steady state
t<10s 31 Thermal Resistance, Junction to Case (Note 6) Operating and Storage Temperature Range
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 7 .UIS in production with L = 0.3mH, TJ = 25°C
P
R
P
R R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
0.9
0.5
145
2.2
1.4 58
11
-55 to +150 °C
W
°C/W
W
°C/W
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DMN3024SFG
Document number: DS35439 Rev. 3 - 2
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Page 3
)
g
g
g
)
r
)
R
C
U
R
R
T
R
C
U
R
R
T
Electrical Characteristics T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
30 - - V
- - 1 A
- - ±100 nA
VGS = 0V, ID = 250 A VDS = 30V, VGS = 0V
VGS = ±25V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage
Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
1.0 1.3 2.4 V
- 15 23
- 24 33
|
- 11 - S
- 0.69 1 V
VDS = VGS, ID = 250A
V
= 10V, ID = 10A
m
GS
V
= 4.5V, ID = 7.5A
GS
VDS = 5V, ID = 10.0A
VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
ADVANCE INFORMATION
Total Gate Charge VGS = 4.5V Qg
C
iss
C
oss
C
rss
R
Total Gate Charge VGS = 10V Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
t
t
Q Q
D(on
t
D(off
t
s d
f
- 479 - pF
- 97 - pF
- 61 - pF
0.4 1.1 1.6
- 5.0 - nC
- 10.5 - nC
- 1.8 - nC
- 1.6 - nC
- 2.9 - ns
- 7.9 - ns
- 14.6 - ns
- 3.1 - ns
V
= 15V, VGS = 0V,
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
V
= 15V, ID = 10A
DS
V
= 10V, VDS = 15V,
GS
R
= 3, RL= 1.5,
G
(A) EN
30
25
20
V = 10V
GS
V = 4.5V
GS
V = 4.0V
GS
(A) EN
20
15
V = 5V
DS
15
AIN
10
D
I, D
5
V = 2.5V
GS
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 1 Typical Output Ch ar acteristic
V = 3.5V
GS
V = 3.0V
GS
10
V = 150°C
AIN
D
I, D
5
0
0 0.5 1 1.5 2 2.5 3 3.5 4
V , GATE-SOURCE VOLTAGE (V)
GS
Fig. 2 Typical Transfer Characteristic
GS
V = 125°C
GS
V = 85°C
GS
V = -55°C
V = 25°C
GS
GS
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DMN3024SFG
Document number: DS35439 Rev. 3 - 2
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Page 4
R
R
OUR
C
ON-R
TANC
R
RAIN-SOUR
CE O
N
R
TAN
C
OUR
CE C
U
R
R
N
T
Ω
E ( )
0.05
0.04
Ω
E ( )
V = 10V
GS
0.04
0.03
ESIS
E
0.03
V = 3.5V
GS
V = 4.5V
GS
ESIS
-
0.02
0.02
V = 10V
AIN-S
0.01
, D
DS(ON)
0
0102015 25 30
5 I , DRAIN-SOURCE CURRENT (A)
D
Fig. 3 Typical On-Resistance
vs. Drain C urrent an d G at e Vol t age
ADVANCE INFORMATION
1.7
1.5
GS
V = 4.5V
GS
I = 5A
D
0.01
, D
DS(ON)
0
0 5 10 15 20 25 30
I , DRAIN CURRENT (A)
D
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
0.06
Ω
0.05
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
1.3
1.1
0.9
DSON
R , DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
0.7
0.5
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 5 On-Resistance Variation with T emperature
2.0
1.8
V = 10V
GS
I = 10A
D
0.04
V = 4.5V
GS
I = 5A
0.03
D
0.02
V = 10V
GS
I = 10A
D
0.01
DSON
R , DRAIN-SOURCE ON-RESISTANCE ( )
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 6 On-Resistance Variation with Temperature 20 18 16
1.6
1.4
I = 1mA
D
(A)
14
E
12
T = 25°C
A
10
1.2
1.0
0.8
GS(TH)
V , GATE THRESHOLD VOLT AGE (V)
0.6
-50 -25 0 25 50 75 100 125 150
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
I = 250µA
D
T , AMBIENT TEMPERATURE (°C)
A
8 6
S
I, S
4 2
0
0.2 0.4 0.6 0.8 1.0 1.2 V , SOURCE-DRAIN VOLT AGE (V)
SD
Fig. 8 Diod e Forward Voltage vs. Cur r ent
POWERDI is a registered trademark of Diodes Incorporated
DMN3024SFG
Document number: DS35439 Rev. 3 - 2
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Page 5
C, CAPACITANC
F
GAT
O
URC
OLTAG
P, P
T
R
T P
O
R
T
R
T
T
HER
R
T
C
1,000
f = 1MHz
C
iss
10
8
E (V)
)
E (p
100
10
0 5 10 15 20 25 30
C
oss
C
rss
V , DRAIN-SOURCE VOLTAGE (V)
DS
6
E V
4
E-S
2
GS
V,
0
02 4 6 81012
Fig. 9 Typical Total Capacitance
ADVANCE INFORMATION
(W)
IWE
100
90 80 70
Single Pulse R = 61C/W
°
θ
JA
R = r * R
θθ
JA(t) (t) JA
T - T = P * R
JA JA(t)
θ
V = 15V
DS
I = 10A
D
Q , TOTAL GATE CHARGE (nC)
g
Fig. 10 Gate-Charge Characteristics
60 50
ANSIEN
40 30
EAK
20
(PK)
10
0
0.001 0.01 0.1 1 10 100 1,0000.0001 t1, PULSE DURATION TIME (sec)
Fig. 11 Single Pulse Maximum Power Dissipation
1
E
D = 0.7
D = 0.5
AN
D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
D = 0.005
r(t),
D = Single Pulse
0.001
0.00001 1,0000.0001
0.001 0.01 0.1 1 10 100 t , PULSE DURATION TIME (s)
1
D = 0.9
R (t) = r(t) * R
θθ
JA JA
R = 54°C/W
θ
JA
Duty Cycle, D = t1/ t2
Fig. 12 Transient Thermal Response
POWERDI is a registered trademark of Diodes Incorporated
DMN3024SFG
Document number: DS35439 Rev. 3 - 2
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C
Package Outline Dimensions
ADVANCE INFORMATION
E
A
Pin 1 ID
E2
A3
A1
D
D2
L
14
85
b (8x)eZ (4x)
(4x)
b2
(4x)
L1
(3x)
POWERDI3333-8
Dim Min Max Typ
D 3.25 3.35 3.30
E 3.25 3.35 3.30 D2 2.22 2.32 2.27 E2 1.56 1.66 1.61
A 0.75 0.85 0.80 A1 0 0.05 0.02 A3
b 0.27 0.37 0.32
b2
L 0.35 0.45 0.40
L1
e
Z
All Dimensions in mm
0.203
0.20
0.39
0.65
0.515
Suggested Pad Layout
Y2
Y3
X G
85
G1
14
Y1
Y
Dimensions Value (in mm)
C 0.650
G 0.230
G1 0.420
Y 3.700 Y1 2.250 Y2 1.850 Y3 0.700
X 2.370 X2 0.420
X2
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DMN3024SFG
Document number: DS35439 Rev. 3 - 2
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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
ADVANCE INFORMATION
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
POWERDI is a registered trademark of Diodes Incorporated
DMN3024SFG
Document number: DS35439 Rev. 3 - 2
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