Diodes DMN3024LK3 User Manual

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D
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30V TO252 (DPAK) N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
V
R
(BR)DSS
30V
DS(on)
24mΩ @ V
39mΩ @ VGS= 4.5V
GS
= 10V
T
= 25°C
A
14.4A
11.6A
D
Description and Applications
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
Backlighting
DC-DC Converters
Power management functions
) and yet maintain superior switching
DS(on)
TOP VIEW PIN OUT -TOP VIEW
GS
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DMN3024LK3
Features and Benefits
Low on-resistance
Fast switching speed
Low gate drive
“Green” component and RoHS compliant (Note 1)
Mechanical Data
Case: TO-252 (DPAK)
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0 (Note 1)
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals Connections: See Diagram
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Below
Ordering Information: See Below
Weight: 0.33 grams (approximate)
D
G
D
S
Equivalent Circuit
Ordering Information (Note 1)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
DMN3024LK3-13 N3024L 13 16 2,500
Note: 1. Diodes, Inc. defines “Green” products as those which are Eu RoHS compliant and contain no halogens or antimony compounds; further information
about Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
Marking Information
N3024L
DMN3024LK3
Document Revision: 1
YYWW
= Manufacturer’s Marking N3024L = Product Type Marking Code YYWW = Date Code Marking YY = Year (ex: 09 = 2009) WW = Week (01-52)
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DMN3024LK3
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Drain-Source voltage Gate-Source voltage
Continuous Drain current
V
= 10V
GS
(Note 3) TA=70°C (Note 3)
V
DSS
V
GS
I
D
30 V
±20
V
14.4
12.0
A
(Note 2) 9.78
Pulsed Drain current
V
GS
= 10V Continuous Source current (Body diode) (Note 3) Pulsed Source current (Body diode) (Note 4)
(Note 4)
IDM
I
S
I
SM
46.5 A 12 A
46.5 A
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
(Note 2)
Power dissipation Linear derating factor
(Note 3)
P
D
(Note 5) (Note 2)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead (Note 6) Operating and storage temperature range
Notes: 2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note 2, except the device is measured at t 10 sec.
4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition.
6. Thermal resistance from junction to solder-point (at the end of the drain lead).
(Note 3) 14.0 (Note 5) 57.6
R
JA
θ
R
JL
T
, T
J
STG
4.1
32.5
8.9
71.4
2.17
17.4
30.8
2.24
-55 to 150
W
mW/°C
°C/W
°C
DMN3024LK3
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Thermal Characteristics
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DMN3024LK3
R
DS(on)
Limit
10
DC
1
100m
Drain Current (A)
25mm x 25mm
D
I
10m
100m 1 10
T
=25°C
amb
1oz FR4
1s
100ms
10ms
1ms
100µs
VDS Drain-Source Voltage (V)
Safe Operating Area
T
60 50 40 30 20 10
0
100µ 1m 10m 100m 1 10 100 1k
Thermal Resistance (°C/W)
=25°C
amb
25mm x 25mm
1oz FR4
D=0.5
D=0.2
D=0.1
D=0.05
Single Pulse
Pulse Width (s)
Transient Thermal Impedance
R
DS(on)
Limit
10
1
100m
Drain Current (A )
D
I
10m
0.1 1 10
DC
1s
100ms
T
=25°C
amb
50mm x 50mm
2oz FR4
10ms
1ms
100µs
VDS Drain-Source Vol tage (V)
Safe Operating Area
35 30 25 20 15 10
Thermal Re sistance (°C/W)
T
=25°C
amb
50mm x 50mm
2oz FR4
D=0.5
D=0.2
5 0
100µ 1m 10m 100m 1 10 100 1k
D=0.1
D=0.05
Single Pulse
Pulse Width (s)
Transient Thermal Imp e d ance
100
10
25mm x 25mm
1oz FR4
1
100µ 1m 10m 100m 1 10 100 1k
Max Power Di ssi pa t i on (W)
Pulse Width (s )
Single Pulse
T
=25°C
amb
50mm x 50mm
2oz FR4
Pulse Power Dissipation
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0 0 20406080100120140160
Max Power Di ssi pa t i on (W)
Temperature (°C)
50mm x 50mm
2oz FR4
25mm x 25mm
1oz FR4
Derating Curve
DMN3024LK3
Document Revision: 1
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