Diodes DMN26D0UDJ User Manual

Product Summary
V
R
(BR)DSS
20V
DS(on)
3.0 @ V
= 4.5V
GS
6.0 @ VGS= 1.8V
Description
This new generation MOSFET has been designed to minimize the on-
state resistance (R
) and yet maintain superior switching
DS(on)
performance, making it ideal for high efficiency power management
applications.
Applications
DC-DC Converters
Power management functions
ESD PROTECTED
I
D
TA = +25°C
240mA 180mA
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Dual N-Channel MOSFET
Low On-Resistance:
3.0@ 4.5V
4.0@ 2.5V
6.0@1.8V
10@1.5V
Very Low Gate Threshold Voltage, 1.05V max
Low Input Capacitance
Fast Switching Speed
Ultra-Small Surface Mount Package
ESD Protected Gate (HBM 300V)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: SOT963
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.0027 grams (approximate)
D
G
1
2
SOT963
G
S
Top View Top View
Schematic and Transistor Diagram
1
1
DMN26D0UDJ
S
2
D
2
Ordering Information (Note 4)
Part Number Case Packaging
DMN26D0UDJ-7 SOT963 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Marking Information (Note 5)
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
D
G
1
S
2
2
M1
M1 = Product Type Marking Code
Notes: 5. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
S
1
DMN26D0UDJ
Document number: DS31481 Rev. 8 - 2
D
G
2
1
www.diodes.com
1 of 5
May 2014
© Diodes Incorporated
)
)
r
)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Drain Source Voltage Gate-Source Voltage
= +25°C
Continuous Drain Current (Note 6) VGS = 4.5V
Continuous Drain Current (Note 6) VGS = 1.8V
Steady
State
Steady
State
T
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
Pulsed Drain Current - TP = 10µs IDM
Thermal Characteristics
Total Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient (Note 6) Operating and Storage Temperature Range
Characteristic Symbol Value Unit
P
D
R
JA
T
, T
J
STG
DMN26D0UDJ
V
DSS
V
GSS
I
D
I
D
300 mW 409 °C/W
-55 to +150 °C
20 V 10 240
190
180 140
V
mA
mA
805 mA
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current @ TJ = +25°C
= +85°C (Note 8)
@T
J
Gate-Body Leakage
BV
I
I
DSS
DSS
GSS
20
500
1.7
1
100
V
V
= 0V, ID = 100A
GS
V
nA
µA
A nA
= 20V, VGS = 0V
DS
= 2.6V, VGS = 0V
V
DS
= ±10V, VDS = 0V
V
GS
V
= ±5V, VDS = 0V
GS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance Source-Drain Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
0.45 0.8 1.05 V
1.8 3.0
2.5 4.0
3.4 6.0
4.7 10.0
9.5
SD




180 240
|
fs
0.5 0.8 1.0 V
VDS = VGS, ID = 250A
= 4.5V, ID = 100mA
V
GS
V
= 2.5V, ID = 50mA
GS
V
= 1.8V, ID = 20mA
GS
V
= 1.5V, ID = 10mA
GS
= 1.2V, ID = 1mA
V
mS
GS
VDS =10V, ID = 0.1A VGS = 0V, IS = 10mA
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
 
14.1
2.9
1.6
  
pF pF pF
= 15V, VGS = 0V
V
DS
f = 1.0MHz
SWITCHING CHARACTERISTICS, VGS = 4.5V (Note 8)
Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time
Notes: 6. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch with minimum recommended pad layout; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design, not subject to production testing.
t
d(on
t
t
d(off
t

f
3.8
7.9
13.4
15.2
  

ns
V
= 4.5V, VDD = 10V
GS
I
= 200mA, RG = 2.0
D
DMN26D0UDJ
Document number: DS31481 Rev. 8 - 2
2 of 5
www.diodes.com
May 2014
© Diodes Incorporated
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