Diodes DMN2600UFB User Manual

q
Features
Low On-Resistance
Low Gate Threshold Voltage
Fast Switching Speed
Ultra-Small Surface Mount Package
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
ESD Protected Gate 1kV
Qualified to AEC-Q101 Standards for High Reliability
ESD PROTECTED TO 1kV
Bottom View
DFN1006-3
DMN2600UFB
25V N-CHANNEL ENHANCEMENT MODE MOSFET
Mechanical Data
Case: DFN1006-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
Drain
Body Diode
Source
D
Top View
Internal Schematic
S
G
Gate
Gate Protection Diode
E
uivalent Circuit
Ordering Information (Note 3)
Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel
DMN2600UFB-7 NA 7 8 3000
DMN2600UFB-7B
Notes: 1. No purposefully added lead
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
NA
7 8 10,000
Marking Information
DMN2600UFB
Document number: DS31983 Rev. 4 - 2
DMN2600UFB-7 DMN2600UFB-7B
NANA
Top View
Dot Denotes
Drain Side
Top View
Bar Denotes Gate
and Source Side
1 of 6
www.diodes.com
NA = Product Type Marking Code
March 2011
© Diodes Incorporated
)
g
g
g
g
r
Maximum Ratings @T
Characteristic Symbol Value Unit
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 4) Pulsed Drain Current
Thermal Characteristics @T
Characteristic Symbol Value Unit
Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient @T
Operating and Storage Temperature Range
= 25°C unless otherwise specified
A
T
Steady
State
= 25°C unless otherwise specified
A
= 25°C R
A
= 25°C
A
T
= 85°C
A
T
V V
J
DSS GSS
I
I
DM
P
, T
D
D
θJA
STG
DMN2600UFB
25 V ±8 V
1.3
0.9
A
3.0 A
0.54 W 234 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Source Leakage
BV
DSS
I
GSS
DSS
25 - - V
- - 1
- - 10
VGS = 0V, ID = 250μA
μA μA
= 25V, VGS = 0V
V
DS
= ±8V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 5) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
0.45 - 1.0 V 350
- -
450 600
40 - - mS
|
- - 1.2 V
VDS = VGS, ID = 250μA V
= 4.5V, ID = 200mA
mΩ
GS
V
= 2.5V, ID = 100mA
GS
V
= 1.8V, ID = 75mA
GS
VDS = 3V, ID = 200mA
VGS = 0V, IS = 300mA DYNAMIC CHARACTERISTICS (Note 6) Input Capacitance Output Capacitance Reverse Transfer Capacitance
Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 substrate PCB board, with minimum recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to production testing.
C C C
R
Q Q Q
t
D(on)
t
D(off)
iss
oss
rss
t
t
s d
f
- 70.13 -
- 7.56 -
- 5.59 -
- 72.3 -
- 0.85 -
- 0.16 -
- 0.11 -
- 4.1 -
- 11.5 -
- 34.8 -
- 20.9 -
pF pF pF
Ω nC nC nC
= 15V, VGS = 0V,
V
DS
f = 1.0MHz VDS =0V, VGS = 0V, f = 1MHz
= 4.5V, VDS = 15V,
V
GS
= 1A
I
D
ns
ns
ns
= 15V, RL=15Ω
V
DS
V
= 10V, RG = 6Ω
GS
ns
DMN2600UFB
Document number: DS31983 Rev. 4 - 2
2 of 6
www.diodes.com
March 2011
© Diodes Incorporated
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