Diodes DMN2500UFB4 User Manual

DMN2500UFB4
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
V
(BR)DSS
20V
R
0.4Ω @ V
0.7Ω @ VGS = 1.8V
DS(on) max
= 4.5V
GS
D
TA = 25°C
1A
0.8A
Description and Applications
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management applications.
DC-DC Converters
Power management functions
ESD PROTECTED
) and yet maintain superior switching
DS(on)
X2-DFN1006-3
Bottom View
Features and Benefits
Low On-Resistance
Very Low Gate Threshold Voltage V
Low Input Capacitance
Fast Switching Speed
Ultra-Small Surfaced Mount Package
Ultra-low package profile, 0.4mm maximum package height
ESD Protected Gate
Lead, Halogen, and Antimony Free, RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
GS(TH)
, 1.0V max
Mechanical Data
Case: X2-DFN1006-3
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.001 grams (approximate)
Drain
S
D
G
Top View
Internal Schematic
Gate
Gate Protection Diode
EQUIVALENT CIRCUIT
Source
Ordering Information (Note 3)
Part Number Case Packaging
DMN2500UFB4-7 X2-DFN1006-3 3,000/Tape & Reel
DMN2500UFB4-7B X2-DFN1006-3 10,000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DMN2500UFB4
Document number: DS35724 Rev. 3 - 2
DMN2500UFB4-7 DMN2500UFB4-7B
NTNT
Top View
Dot Denotes
Drain Side
Top View
Bar Denotes Gate
and Source Side
1 of 5
www.diodes.com
NT = Product Type Marking Code
March 2012
© Diodes Incorporated
)
g
g
g
g
r
DMN2500UFB4
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 4) VGS = 4.5V
Continuous Drain Current (Note 5) VGS = 4.5V
Pulsed Drain Current (10μs pulse, duty cycle = 1%) Maximum Body Diode continuous Current
Steady
State t<10s
Steady
State t<10s
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
20 V ±6 V
810 640
950 750
1000
800
1200 1000
mA
mA
mA
mA
4 A
850 mA
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
T
= 25°C
Total Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient (Note 4)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5) Operating and Storage Temperature Range
A
TA = 70°C
Steady state
t<10s 210 °C/W
T
= 25°C
A
TA = 70°C
Steady state
t<10s 100 °C/W
P
R
P
R
T
J, TSTG
D
JA
θ
D
JA
θ
0.46
0.29
W
279 °C/W
0.95
0.6
W
134 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Source Leakage
BV
DSS
I
GSS
DSS
20 - - V
- - 100 nA
- - ±1.0
VGS = 0V, ID = 250μA VDS = 20V, VGS = 0V
μA
= ±4.5V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 6) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
0.5 - 1.0 V
0.3 0.4
-
0.4 0.5
0.5 0.7
|
- 1.4 - S
0.7 1.2 V
VDS = VGS, ID = 250μA V
= 4.5V, ID = 600mA
Ω
GS
= 2.5V, ID = 500mA
V
GS
= 1.8V, ID = 350mA
V
GS
VDS = 10V, ID = 400mA
VGS = 0V, IS = 150mA DYNAMIC CHARACTERISTICS (Note 7) Input Capacitance Output Capacitance Reverse Transfer Capacitance
Gate resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
DMN2500UFB4
Document number: DS35724 Rev. 3 - 2
C
iss
C
oss
C
rss
R Q
Q
s
Q
d
t
D(on)
t
t
D(off)
t
f
www.diodes.com
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pF
V
pF pF
Ω pC pC pC
- ns
- ns
- ns
- ns
DS
f = 1.0MHz VDS = 0V, VGS = 0V, f = 1.0MHz V
GS
= 250mA
I
D
V
DD
R
L
I
= 200mA
D
=16V, VGS = 0V,
= 4.5V, VDS = 10V,
= 10V, VGS = 4.5V,
= 47Ω, RG = 10,
© Diodes Incorporated
March 2012
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