DMN2500UFB4
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
V
(BR)DSS
20V
R
0.4Ω @ V
0.7Ω @ VGS = 1.8V
DS(on) max
= 4.5V
GS
D
TA = 25°C
1A
0.8A
Description and Applications
This new generation MOSFET has been designed to minimize the onstate resistance (R
performance, making it ideal for high efficiency power management
applications.
• DC-DC Converters
• Power management functions
ADVANCE INFORMATION
ESD PROTECTED
) and yet maintain superior switching
DS(on)
X2-DFN1006-3
Bottom View
Features and Benefits
• Low On-Resistance
• Very Low Gate Threshold Voltage V
• Low Input Capacitance
• Fast Switching Speed
• Ultra-Small Surfaced Mount Package
• Ultra-low package profile, 0.4mm maximum package height
• ESD Protected Gate
• Lead, Halogen, and Antimony Free, RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
GS(TH)
, 1.0V max
Mechanical Data
• Case: X2-DFN1006-3
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
• Weight: 0.001 grams (approximate)
Drain
S
D
G
Top View
Internal Schematic
Gate
Gate
Protection
Diode
EQUIVALENT CIRCUIT
Source
Ordering Information (Note 3)
Part Number Case Packaging
DMN2500UFB4-7 X2-DFN1006-3 3,000/Tape & Reel
DMN2500UFB4-7B X2-DFN1006-3 10,000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DMN2500UFB4
Document number: DS35724 Rev. 3 - 2
DMN2500UFB4-7 DMN2500UFB4-7B
NTNT
Top View
Dot Denotes
Drain Side
Top View
Bar Denotes Gate
and Source Side
1 of 5
www.diodes.com
NT = Product Type Marking Code
March 2012
© Diodes Incorporated
DMN2500UFB4
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 4) VGS = 4.5V
Continuous Drain Current (Note 5) VGS = 4.5V
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Body Diode continuous Current
Steady
State
t<10s
Steady
State
t<10s
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
20 V
±6 V
810
640
950
750
1000
800
1200
1000
mA
mA
mA
mA
4 A
850 mA
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
T
= 25°C
Total Power Dissipation (Note 4)
ADVANCE INFORMATION
Thermal Resistance, Junction to Ambient (Note 4)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
A
TA = 70°C
Steady state
t<10s 210 °C/W
T
= 25°C
A
TA = 70°C
Steady state
t<10s 100 °C/W
P
R
P
R
T
J, TSTG
D
JA
θ
D
JA
θ
0.46
0.29
W
279 °C/W
0.95
0.6
W
134 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = 25°C I
Gate-Source Leakage
BV
DSS
I
GSS
DSS
20 - - V
- - 100 nA
- - ±1.0
VGS = 0V, ID = 250μA
VDS = 20V, VGS = 0V
μA
= ±4.5V, VDS = 0V
V
GS
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
0.5 - 1.0 V
0.3 0.4
-
0.4 0.5
0.5 0.7
|
- 1.4 - S
0.7 1.2 V
VDS = VGS, ID = 250μA
V
= 4.5V, ID = 600mA
Ω
GS
= 2.5V, ID = 500mA
V
GS
= 1.8V, ID = 350mA
V
GS
VDS = 10V, ID = 400mA
VGS = 0V, IS = 150mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
DMN2500UFB4
Document number: DS35724 Rev. 3 - 2
C
iss
C
oss
C
rss
R
Q
Q
s
Q
d
t
D(on)
t
t
D(off)
t
f
www.diodes.com
- 60.67 -
- 9.68 -
- 5.37 -
- 93 -
- 736.6 -
- 93.6 -
- 116.6 -
5.1
-
7.4
-
26.7
-
12.3
-
2 of 5
pF
V
pF
pF
Ω
pC
pC
pC
- ns
- ns
- ns
- ns
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
V
GS
= 250mA
I
D
V
DD
R
L
I
= 200mA
D
=16V, VGS = 0V,
= 4.5V, VDS = 10V,
= 10V, VGS = 4.5V,
= 47Ω, RG = 10Ω,
© Diodes Incorporated
March 2012