Diodes DMN2300UFD User Manual

f
Product Summary
max
I
V
(BR)DSS
20V
R
200mΩ @ V 260mΩ @ VGS = 2.5V 400mΩ @ VGS = 1.8V 500mΩ @ VGS = 1.5V
DS(on)
Max
= 4.5V
GS
D
= 25°C
T
A
(Notes 4)
1.73A
1.50A
1.27A
1.15A
Description and Applications
This MOSFET has been designed to minimize the on-state resistance (R
) and yet maintain superior switching performance, making it
DS(on)
ideal for high efficiency power management applications.
Load switch
X1-DFN1212-3
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DMN2300UFD
20V N-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
Low Gate Threshold Voltage
Fast Switching Speed
“Lead Free”, RoHS Compliant (Note 1)
Halogen and Antimony Free. "Green" Device (Note 2)
ESD Protected Gate 2KV
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X1-DFN1212-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish ۛ NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.005 grams (approximate)
Drain
Source
Body Diode
Pin-out Top view
Gate
Gate Protection Diode
Equivalent Circuit
Ordering Information (Note 3)
Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel
DMN2300UFD-7 KS2 7 8 3000
Notes: 1. No purposefully added lead
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMN2300UFD
Datasheet Number: DS35443 Rev. 2 - 2
KS2 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September)
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September 2011
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Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current (Note 6)
Steady State
= 25°C (Note 4)
T
A
T
= 85°C (Note 4)
A
T
= 25°C (Note 5)
A
V V
DSS GSS
I
I
DM
D
20 V ±8 V
1.73
1.34
1.21
6.0 A
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Power Dissipation
Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
(Note 4) (Note 5) 0.47 W (Note 4) (Note 5) 265 °C/W
P
D
R
θJA
, T
T
J
STG
Notes: 4. For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of 2oz copper, in still air conditions; the device is measured
when operating in a steady-state condition.
5. Same as note 4, except the device is mounted on minimum recommended pad layout.
6. Device mounted on minimum recommended pad layout test board, 10µs pulse duty cycle = 1%.
0.96 W
130 °C/W
-55 to +150 °C
DMN2300UFD
A
Thermal Characteristics
DMN2300UFD
Datasheet Number: DS35443 Rev. 2 - 2
10
9 8
Single Pulse
°
R = 136 C/W
θ
JA
R (t) = R *r(t)
θθ
JA JA
T - T = P*R
JA JA
7 6 5 4 3 2
P(pk), PEAK TRANSIENT POWER (W)
1 0
0.0001 0.001 0.01 0.1 1 10 100 1000 t1, PULSE DURATION TIME (sec)
Fig. 1 Single Pulse Maximum Power Dissipation
I , DRAIN CURRENT (A)
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10
I(A) @P =1ms
0.1
D
0.01
DW
1
I
D
T = 150 C
J(MAX)
T= 25C
A
Single Pulse
C
D
@
)
A
(
(
I
D
°
s
0
1
=
W
P
@
)
A
@
)
A
(
I
D
A
(
I
D
°
I
D
(
A
)
@
P
W
=
1
0
0
µ
s
s
1
=
W
P
)
s
m
0
0
1
=
W
P
@
A
(
I
D
s
m
0
1
=
W
P
@
)
0.001
0.1 1 10 100 V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 2 SOA, Safe Oper at ion Area
R
DS(ON)
Limited
I(A) @
D
P =10µs
W
September 2011
© Diodes Incorporated
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T
R
T T
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R
TANC
)
g
g
g
g
)
r
)
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Diodes Incorporated
DMN2300UFD
1
E
ESIS
0.1
MAL
0.01
ANSIEN
r(t),
0.001
0.000001
D = 0.7 D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
D = 0.9
R (t) = r(t) * R
θθ
JA JA
R = 136°C/W
θ
JA
Duty Cycle, D =t1/ t2
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000 t1, PULSE DURATION TIMES (sec) Fig. 3 Transient Thermal Resistance
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I Gate-Source Leakage ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge (Note 8) Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 7. Short duration pulse test used to minimize self-heating effect.
8. Guarantee by design.
BV
DSS
I
GSS
V
GS(th
R
DS (ON)
|Y V
C C C
R
Q Q Q
t
D(on
t
D(off
DSS
fs
SD
iss oss rss
t
t
f
20 - - V
- - 1
- - ±10
0.45 - 0.95 V 200
- -
260 400 500
40 - - mS
|
- 0.7 1.2 V
s d
- 67.62 -
- 9.74 -
- 7.58 -
- 68.51 -
- 0.89 2
- 0.14 -
- 0.16 -
- 4.92 -
- 6.93 -
- 21.71 -
- 10.62 -
VGS = 0V, ID = 250μA
μA μA
= 20V, VGS = 0V
V
DS
= ±8V, VDS = 0V
V
GS
VDS = VGS, ID = 250μA
= 4.5V, ID = 900mA
V
GS
= 2.5V, ID = 800mA
V
mΩ
GS
= 1.8V, ID = 700mA
V
GS
= 1.5V, ID = 200mA
V
GS
VDS = 3V, ID = 300mA VGS = 0V, IS = 300mA
pF pF pF
Ω nC nC nC
= 25V, VGS = 0V,
V
DS
f = 1.0MHz VDS = 0V, VGS = 0V, f = 1MHz
= 4.5V, VDS = 15V,
V
GS
= 1A
I
D
ns
ns
ns
= 10V, I
V
DS
= 10V, RG = 6Ω
V
GS
ns
= 1A
D
DMN2300UFD
Datasheet Number: DS35443 Rev. 2 - 2
3 of 7
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September 2011
© Diodes Incorporated
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