Page 1
Features
• Planar Die Construction
• Small Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
• Qualified to AEC-Q101 Standards for High Reliability
SOD323
Top View
BZT52C2V0S - BZT52C39S
SURFACE MOUNT ZENER DIODE
Mechanical Data
• Case: SOD323
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: Cathode Band
• Weight: 0.0049 grams (approximate)
Ordering Information (Note 5)
Part Number Qualification Case Packaging
(Type Number)-7-F* Commercial SOD323 3000/Tape & Reel
(Type Number)Q-7-F* Automotive SOD323 3000/Tape & Reel
*Add “-7-F” to the appropriate type number in Electrical Characteristics Table, example: 6.2V Zener – BZT52C6V2S-7-F.
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
5. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
Fire Retardants.
2O3
Marking Information
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
XX
www.diodes.com
xx = Product Type Marking Code
(See Electrical Characteristics Table)
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© Diodes Incorporated
May 2012
Page 2
θ
BZT52C2V0S - BZT52C39S
Maximum Ratings @T
= 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Forward Voltage (Note 6) @ IF= 10mA VF
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient Air (Note 7)
Operating and Storage Temperature Range
P
R
T
J,TSTG
D
JA
Electrical Characteristics @T
Type Number
Marking
Code
Nom (V) Min (V) Max (V) (mA)
= 25°C unless otherwise specified
A
Zener Voltage
Maximum Zener Impedance
Range (Note 4)
VZ @ IZT I
ZZT @ IZTZZK @ IZK IZK IR @ VR
ZT
f = 1kHz
Ω
BZT52C2V0S WY 2.0 1.91 2.09 5 100 600 1.0 150 1.0 -3.5 0
BZT52C2V4S WX 2.4 2.20 2.60 5 100 600 1.0 50 1.0 -3.5 0
BZT52C2V7S W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0
BZT52C3V0S W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0
BZT52C3V3S W3 3.3 3.1 3.5 5 95 600 1.0 5 1.0 -3.5 0
BZT52C3V6S W4 3.6 3.4 3.8 5 90 600 1.0 5 1.0 -3.5 0
BZT52C3V9S W5 3.9 3.7 4.1 5 90 600 1.0 3 1.0 -3.5 0
BZT52C4V3S W6 4.3 4.0 4.6 5 90 600 1.0 3 1.0 -3.5 0
BZT52C4V7S W7 4.7 4.4 5.0 5 80 500 1.0 2 2.0 -3.5 0.2
BZT52C5V1S W8 5.1 4.8 5.4 5 60 480 1.0 1 2.0 -2.7 1.2
BZT52C5V6S W9 5.6 5.2 6.0 5 40 400 1.0 3 2.0 -2.0 2.5
BZT52C6V2S WA 6.2 5.8 6.6 5 10 150 1.0 2 4.0 0.4 3.7
BZT52C6V8S WB 6.8 6.4 7.2 5 15 80 1.0 1 4.0 1.2 4.5
BZT52C7V5S WC 7.5 7.0 7.9 5 15 80 1.0 0.7 5.0 2.5 5.3
BZT52C8V2S WD 8.2 7.7 8.7 5 15 80 1.0 0.5 5.0 3.2 6.2
BZT52C9V1S WE 9.1 8.5 9.6 5 15 100 1.0 0.2 6.0 3.8 7.0
BZT52C10S WF 10 9.4 10.6 5 20 150 1.0 0.1 7.0 4.5 8.0
BZT52C11S WG 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0
BZT52C12S WH 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0
BZT52C13S WI 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0
BZT52C15S WJ 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0
BZT52C16S WK 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0
BZT52C18S WL 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0
BZT52C20S WM 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0
BZT52C22S WN 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0
BZT52C24S WO 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 BZT52C27S WP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 BZT52C30S WQ 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 BZT52C33S WR 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 BZT52C36S WS 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 BZT52C39S WT 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 -
Notes: 6. Short duration pulse test used to minimize self-heating effect.
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
7. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com.
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www.diodes.com
200 mW
625
-65 to +150
Maximum
Reverse Current
(Note 6)
°C/W
°C
Temperature
Coefficient of
Zener Voltage
@ I
5mA
ZT =
mV/°C
mA uA V Min Max
May 2012
© Diodes Incorporated
Page 3
P, P
OWER
PATIO
NER CUR
R
N
T
R CUR
RENT
300
Note 7
50
T = 25°C
J
BZT52C2V0S - BZT52C39S
C3V9
C2V0
C2V7
C3V3
C4V7
C5V6
C6V8
40
N (mW)
DISSI
D
(mA)
200
100
30
20
0
0
40 80
T , AMBIENT TEMPERATURE, °C
A
Fig. 1 Power Derating Curve
T = 25°C
J
C10
C12
C15
120
160
200
(mA)
30
E
20
Test Current I
Z
I, ZE
10
0
012345678910
5.0mA
Z
V , ZENER VOLTAGE (V)
Z
Fig. 2 Typical Zen er B r ea kdown Cha r ac t eristics
1,000
V = 1V
R
V = 2V
R
C8V2
T = 25 °C
J
C18
C22
I, ZENE
Z
10
0
0
Test current I
5mA
Z
10 20 30 40
V , ZENER VOLTAGE (V)
Z
Fig. 3 Typical Zener Brea kdown Ch ar acteristics
C27
C33
C36
C39
100
V = 1V
R
T
C , TOTAL CAPACITANCE (pF)
V = 2V
R
10
1
V , NOMINAL ZENER VOLTAGE (V)
Z
10
100
Fig. 4 Typical Total Capacitance vs. Nominal Zener Voltage
Package Outline Dimensions
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
BA
M
C
H
SOD323
Dim Min Max
A 0.25 0.35
B 1.20 1.40
C 2.30 2.70
H 1.60 1.80
J 0.00 0.10
K 1.0 1.1
L 0.20 0.40
K
L
J
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M 0.10 0.15
α
0° 8°
All Dimensions in mm
May 2012
© Diodes Incorporated
Page 4
BZT52C2V0S - BZT52C39S
Suggested Pad Layout
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
X
Y
C
Dimensions Value (in mm)
Z 3.75
G 1.05
X 0.65
Y 1.35
G
Z
IMPORTANT NOTICE
LIFE SUPPORT
C 2.40
BZT52C2V0S - BZT52C39S
Document number: DS30093 Rev. 18 - 2
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May 2012
© Diodes Incorporated
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