Page 1
Features
Small Leadless Surface Mount Package
Ideally Suited for Automated Assembly Processes
Tight Tolerance on Zener Breakdown Voltage (±2%)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
NEW PRODUCT
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound.
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Bar (See Marking Information)
Terminals: Finish – NiPdAu Over Copper Leadframe.
Weight: 0.001 grams (approximate)
X1-DFN1006-2
Bottom View
BZT52B15LP
SURFACE MOUNT PRECISION ZENER DIODE
UL Flammability Classification Rating 94V-0
Solderable per MIL-STD-202, Method 208
e4
Ordering Information (Note 4)
Part Number Case Packaging
BZT52B15LP-7B X1-DFN1006-2 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
BZT52B15LP
Document number: DS36252 Rev. 1 - 2
6L
6L= Product Type Marking Code:
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P, P
O
R
PATIO
TANT
O
U
O
R
R
C
U
R
RENT
BZT52B15LP
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Forward Voltage @ IF = 10mA VF
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) TA = +25°C PD
Thermal Resistance, Junction to Ambient Air (Note 5) TA = +25°C R
Operating and Storage Temperature Range
T
J, TSTG
θJA
Electrical Characteristics (@T
NEW PRODUCT
Type
Number
Marking
Code
Nom (V) Min (V) Max (V) mA
Zener Voltage Range
VZ @ IZT I
= +25°C, unless otherwise specified.)
A
Maximum Zener
(Note 6)
ZTZZT @ IZTZZK
Impedance
f = 1kHz
@ IZKIZK IR @ V
mA µA V Min Max mA pF
Maximum
Reverse
Current
(Note 6)
BZT52B15LP 6L 15 14.70 15.30 5 15 200 1 0.05 10.5 9.2 13.0 5 100
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout which can be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. f = 1MHz, V
300
= 0V, TA = +25°C.
R
Note 5
1000
(mA)
250
100
N (mW)
200
D
T = 125°C
A
250 mW
500
-65 to +150
Temperature
Coefficient
R
T = 150°C
A
@ I
ZTC
mV/°C
Test
Current
I
ZTC
C/W
C
Maximum
Capacitance
(Note 7)
CT
150
DISSI
100
WE
D
50
0
0 255075100125150
T , AMBIENT TEMPERATURE (°C)
A
Figure 1 Power Derating Curve
WA
10
T = 85°C
0.1
A
T = 25°C
A
1
T = -55°C
A
S F
ANE
F
I , INS
200 400 600 800 1000 1200 1400 1600
V , INSTANTANEOUS FORWARD VOLTAGE(mV)
F
Figure 2 Typical Forward Characteristics
BZT52B15LP
Document number: DS36252 Rev. 1 - 2
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R CUR
RENT
NEW PRODUCT
100
10
(mA)
1
Z
0.1
I, ZENE
0.01
12 13 14 15 16 17 18
V , ZENER VOLTAGE (V)
Figure 3 Typical Zener Breakdown Characteristics
Z
BZT52B15LP
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A1
D
E
L
R
e
b
Dim Min Max Typ
A1 0 0.05 0.03
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
X
1
Y
Dimensions Value (in mm)
G
C
X1-DFN1006-2
A 0.47 0.53 0.50
b 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e - - 0.40
L 0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm
C 0.70
G 0.30
X 0.40
X1 1.10
Y 0.70
BZT52B15LP
Document number: DS36252 Rev. 1 - 2
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BZT52B15LP
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
NEW PRODUCT
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
BZT52B15LP
Document number: DS36252 Rev. 1 - 2
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