Features
Small Leadless Surface Mount Package
Ideally Suited for Automated Assembly Processes
Tight Tolerance on Zener Breakdown Voltage (±2%)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
NEW PRODUCT
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound.
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Bar (See Marking Information)
Terminals: Finish – NiPdAu Over Copper Leadframe.
Weight: 0.001 grams (approximate)
X1-DFN1006-2
Bottom View
BZT52B15LP
SURFACE MOUNT PRECISION ZENER DIODE
UL Flammability Classification Rating 94V-0
Solderable per MIL-STD-202, Method 208
e4
Ordering Information (Note 4)
Part Number Case Packaging
BZT52B15LP-7B X1-DFN1006-2 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
BZT52B15LP
Document number: DS36252 Rev. 1 - 2
6L
6L= Product Type Marking Code:
1 of 4
www.diodes.com
April 2013
© Diodes Incorporated
BZT52B15LP
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Forward Voltage @ IF = 10mA VF
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) TA = +25°C PD
Thermal Resistance, Junction to Ambient Air (Note 5) TA = +25°C R
Operating and Storage Temperature Range
T
J, TSTG
θJA
Electrical Characteristics (@T
NEW PRODUCT
Type
Number
Marking
Code
Nom (V) Min (V) Max (V) mA
Zener Voltage Range
VZ @ IZT I
= +25°C, unless otherwise specified.)
A
Maximum Zener
(Note 6)
ZTZZT @ IZTZZK
Impedance
f = 1kHz
@ IZKIZK IR @ V
mA µA V Min Max mA pF
Maximum
Reverse
Current
(Note 6)
BZT52B15LP 6L 15 14.70 15.30 5 15 200 1 0.05 10.5 9.2 13.0 5 100
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout which can be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. f = 1MHz, V
300
= 0V, TA = +25°C.
R
Note 5
1000
(mA)
250
100
N (mW)
200
D
T = 125°C
A
250 mW
500
-65 to +150
Temperature
Coefficient
R
T = 150°C
A
@ I
ZTC
mV/°C
Test
Current
I
ZTC
C/W
C
Maximum
Capacitance
(Note 7)
CT
150
DISSI
100
WE
D
50
0
0 255075100125150
T , AMBIENT TEMPERATURE (°C)
A
Figure 1 Power Derating Curve
WA
10
T = 85°C
0.1
A
T = 25°C
A
1
T = -55°C
A
S F
ANE
F
I , INS
200 400 600 800 1000 1200 1400 1600
V , INSTANTANEOUS FORWARD VOLTAGE(mV)
F
Figure 2 Typical Forward Characteristics
BZT52B15LP
Document number: DS36252 Rev. 1 - 2
2 of 4
www.diodes.com
April 2013
© Diodes Incorporated