Diodes BSS84 User Manual

p
M
Product Summary
I
V
(BR)DSS
-50V
R
DS(on) max
10 @ V
GS
= -5V
D
TA = +25°C
-130mA
Description
This MOSFET has been designed to minimize the on-state resistance (R
) and yet maintain superior switching performance, making it
DS(on)
ideal for high efficiency power management applications.
Applications
General Purpose Interfacing Switch  Power Management Functions  Analog Switch
SOT23
Gate
Top View Equivalent Circuit To
BSS84
P-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
 Low On-Resistance  Low Gate Threshold Voltage  Low Input Capacitance  Fast Switching Speed  Low Input/Output Leakage  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
 Case: SOT23  Case Material: UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Matte Tin Finish (Lead Free Plating) Solderable per
MIL-STD-202, Method 208
Terminal Connections: See Diagram  Weight: 0.008 grams (approximate)
Drain
Source
e3
D
G
S
View
Ordering Information (Note 4)
Part Number Qualification Case Packaging
BSS84-7-F Commercial SOT23 3000/Tape & Reel
BSS84Q-7-F Automotive SOT23 3000/Tape & Reel
BSS84-13-F Commercial SOT23 10000/Tape & Reel
BSS84Q-13-F Automotive SOT23 10000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Date Code Key
Year 1998 1999 2000 2001 2002 2003 2004 2011 2012 2013 2014 2015 2016 2017
Code J K L M N P R Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
K84
Chengdu A/T Site
YM
BSS84
Document number: DS30149 Rev. 20 - 2
K84
Shanghai A/T Site
YM
www.diodes.com
K84 = Product Type Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
Y
= Date Code Marking for CAT (Chengdu Assembly/ Test site) Y or = Year (ex: A = 2013)
Y
M = Month (ex: 9 = September)
1 of 5
August 2013
© Diodes Incorporated
)
)
)
)
BSS84
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Drain-Gate Voltage RGS 20K V Gate-Source Voltage Continuous Drain Current (Note 5) Continuous Pulsed Drain Current
V
DSS DGR
V
GSS
I
D
I
DM
-50 V
-50 V
20
V
-130 mA
-1.2 A
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
P
D
R
JA
T
, T
J
STG
300 mW 417
-55 to +150
C/W
C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
BV
I
DSS
I
GSS
DSS
-50

 
 
 
-1
-2
-100 10
V
VGS = 0V, ID = -250µA V
µA µA nA
nA
= -50V, VGS = 0V, TJ = +25°C
DS
V
= -50V, VGS = 0V, TJ = +125°C
DS
= -25V, VGS = 0V, TJ = +25°C
V
DS
V
= 20V, V
GS
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance
V
R
DS (ON
GS(th
g
FS
-0.8
0.05
-2.0 V 10
VDS = VGS, ID = -1mA VGS = -5V, ID = -0.100A S
V
= -25V, ID = -0.1A
DS
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
45 pF 25 pF
V
12 pF
= -25V, V
DS
= 0V, f = 1.0MHz
GS
SWITCHING CHARACTERISTICS (Note 7)
Turn-On Delay Time Turn-Off Delay Time
Notes: 5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing
t
D(ON
t
D(OFF
 
10 18
 
ns ns
V
= -30V, ID = -0.27A,
DD
= 50, V
R
GEN
GS
= -10V
BSS84
Document number: DS30149 Rev. 20 - 2
2 of 5
www.diodes.com
August 2013
© Diodes Incorporated
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