Diodes BSS138W User Manual

Page 1
p
Features
 Low On-Resistance  Low Gate Threshold Voltage  Low Input Capacitance  Fast Switching Speed
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability
SOT-323
Gate
Top View
Mechanical Data
Case: SOT-323 Case Material: Molded Plastic, "Green" Molding Compound,
Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
Terminal Connections: See Diagram  Weight: 0.006 grams (approximate)
Drain
Source
Equivalent Circuit
BSS138W
N-CHANNEL ENHANCEMENT MODE MOSFET
Note 6. UL Flammability Classification Rating 94V-0
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
D
GS
To
View
Ordering Information (Note 4)
Part Number Case Packaging
BSS138W -7-F SOT-323 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Date Code Key
Year 2012 2013 2014 2015 2016 2017 2018
Code Z A B C D E F
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Chengdu A/T Site
K38
Shanghai A/T Site
BSS138W
Document number: DS30206 Rev. 11 - 2
K38 = Product Type Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site) Y M = Date Code Marking for CAT (Chengdu Assembly/ Test site)
YM
Y or Y = Year (ex: A = 2013) M = Month (ex: 9 = September)
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September 2013
© Diodes Incorporated
Page 2
)
)
)
)
BSS138W
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Drain-Gate Voltage (Note 5) Gate-Source Voltage Continuous Drain Current (Note 6) Continuous
V
DSS
V
DGR
V
GSS
I
D
50 V 50 V
20
V
200 mA
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
P
D
R
JA
, T
T
J
STG
200 mW 625
-55 to +150
C/W
C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage
BV
I
DSS
I
GSS
50 75
DSS
V
0.5 µA
100
nA
VGS = 0V, ID = 250A V
= 50V, VGS = 0V
DS
V
= 20V, V
GS
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance
V
R
DS (ON
GS(th
g
0.5 1.2 1.5 V
1.4 3.5
100
FS
VDS = VGS, ID = 250A
VGS = 10V, ID = 0.22A
mS
V
= 25V, ID = 0.2A, f = 1.0KHz
DS
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
50 pF 25 pF
8.0 pF
V
DS
= 10V, V
= 0V, f = 1.0MHz
GS
SWITCHING CHARACTERISTICS(Note 8)
Turn-On Delay Time
Notes: 5. RGS 20K.
6. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
BSS138W
Document number: DS30206 Rev. 11 - 2
t
D(ON
t
D(OFF
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20 ns 20 ns
= 30V, ID = 0.2A,
V
DD
R
= 50Turn-Off Delay Time
GEN
September 2013
© Diodes Incorporated
Page 3
RAIN-SOUR
CE C
U
R
R
N
T
R
OUR
CE CUR
RENT
GATE THRESH
O
OLTAG
R
TAT
C
R
OUR
C
0.6
T = 25 C
°
j
0.5
(A) E
0.4
0.3
0.2
D
I, D
0.1
0
1
0
Fig. 1 Drain-Source Current vs. Drain-Source Voltage
32
V , DRAIN-SOURCE VOLTAGE (V)
DS
5
47
6
2.45
2.25
2.05
1.85
1.65
V = 10V
GS
I = 0.5A
D
1.45
1.25
ON RESISTANCE ( )
DS(ON)
R , NORMALIZED DRAIN-SOURCE
1.05
0.85
0.65
-55
-5
T, JUNCTION TEMPERATURE (°C)
j
45
V = 4.5V
GS
I = 0.075A
D
95
Fig. 3 Drain-S ource On Resi st ance vs. Ju nct i on Temperature
8
910
145
BSS138W
0.8
V = 1V
DS
0.7
(A)
0.6
0.5
0.4
0.3
AIN-S
0.2
D
I, D
0.1
0
01
V , GATE-SOURCE VOLTAGE (V)
1.50.5 2 3.5
GS
Fig. 2 Transfer Characteristics
2
1.8
E (V)
1.6
1.4
1.2
LD V
1
0.8
0.6
0.4
GS(th)
0.2
V,
0
-55
Fig. 4 Gate Threshold Voltage vs. Junction Temperature
5-25 35 9565
T, JUNCTION TEMPERATURE (°C)
j
3
I = 1.0mA
D
125
-55 C
150 C
4
°
25 C
°
°
4.52.5
155
8
V = 2.5V
GS
7
150 C
°
6
5
25 C
°
4
E
AIN-S D
I
9
V = 2.75V
GS
8
150 C
°
7
6 5
25 C
°
4
3
-55 C
°
DS(ON)
R , STATIC DRAIN-SOURCE
ON RESISTANCE ( )
2
1
0
0.02 0.04 0.06 0.08 0.160.140.120.1
0
I , DRAIN CURRENT (A)
D
Fig. 5 Drain-Source On Resistance vs. Drain Current
BSS138W
Document number: DS30206 Rev. 11 - 2
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3
, S
ON RESISTANCE ( )
2
DS(ON)
1 0
0
0.05 0.1 I , DRAIN CURRENT (A)
D
0.15 0.25
0.2
Fig. 6 Drain-Source On Resistance vs. Drain Current
-55 C
°
September 2013
© Diodes Incorporated
Page 4
R
TATIC D
R
N
OUR
C
5
R
TATIC DR
OUR
C
O
CUR
RENT
C
, CAPACITAN
C
pF)
E
-S
6
V = 4.5V
GS
150 C
°
5
4
AI
3.
V = 10V
GS
3
E
2.5
AIN-S
2
150 C
3
25 C
2
, S
ON RESISTANCE ( )
DS(ON)
1
0
0
Fig. 7 Drain-S ource On R esistance vs. Drain Cu r r ent
0.1 0.2 0.3 0.4 0.5
V , DRAIN-SOURCE VOLTAGE (V)
DS
-55 C
1
°
°
1.5
, S
ON RESISTANCE ( )
1
DS(ON)
0.5
0
0
Fig. 8 Drain-Source On Resistance vs. Drain Current
100
0.1 0.2
V = 0V
GS
f = 1MHz
I , DRAIN CURRENT (A)
D
0.3 0.4 0.5
BSS138W
°
25 C
°
-55 C
°
(A)
0.1
DE
150 C
°
25 C
°
0.01
D
I, DI
0.001
00.20.4 V , DIODE FORWARD VOLTAGE (V)
SD
0.6
Fig. 9 Body Diode Current vs. Body Diode Voltage
Package Outline Dimensions
K
J
A
B
G H
D
-55 C
°
0.8 1 1.2
C
L
C
iss
E (
10
C
oss
C
rss
1
0 5 10 15 20 25
V , DRAIN SOURCE VOLTAGE (V)
DS
30
Fig. 10 Cap acitanc e vs. Drain So ur ce Voltage
SOT-323
Dim Min Max Typ
A 0.25 0.40 0.30 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D - - 0.65 G 1.20 1.40 1.30 H 1.80 2.20 2.15
J 0.0 0.10 0.05
M
K 0.90 1.00 0.95
L 0.25 0.40 0.30
M 0.10 0.18 0.11
0° 8° -

All Dimensions in mm
BSS138W
Document number: DS30206 Rev. 11 - 2
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© Diodes Incorporated
Page 5
BSS138W
Suggested Pad Layout
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Onl y the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
BSS138W
Document number: DS30206 Rev. 11 - 2
Y
Z
X
E
C
IMPORTANT NOTICE
LIFE SUPPORT
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Dimensions Value (in mm)
Z 2.8 X 0.7 Y 0.9 C 1.9 E 1.0
September 2013
© Diodes Incorporated
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