Features
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
SOT-323
Gate
Top View
Mechanical Data
Case: SOT-323
Case Material: Molded Plastic, "Green" Molding Compound,
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
Terminal Connections: See Diagram
Weight: 0.006 grams (approximate)
Drain
Source
Equivalent Circuit
BSS138W
N-CHANNEL ENHANCEMENT MODE MOSFET
Note 6. UL Flammability Classification Rating 94V-0
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
D
GS
To
View
Ordering Information (Note 4)
Part Number Case Packaging
BSS138W -7-F SOT-323 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Date Code Key
Year 2012 2013 2014 2015 2016 2017 2018
Code Z A B C D E F
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Chengdu A/T Site
K38
Shanghai A/T Site
BSS138W
Document number: DS30206 Rev. 11 - 2
K38 = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
Y M = Date Code Marking for CAT (Chengdu Assembly/ Test site)
YM
Y or Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
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September 2013
© Diodes Incorporated
BSS138W
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Drain-Gate Voltage (Note 5)
Gate-Source Voltage Continuous
Drain Current (Note 6) Continuous
V
DSS
V
DGR
V
GSS
I
D
50 V
50 V
20
V
200 mA
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
P
D
R
JA
, T
T
J
STG
200 mW
625
-55 to +150
C/W
C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
BV
I
DSS
I
GSS
50 75
DSS
V
0.5 µA
100
nA
VGS = 0V, ID = 250A
V
= 50V, VGS = 0V
DS
V
= 20V, V
GS
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
V
R
DS (ON
GS(th
g
0.5 1.2 1.5 V
1.4 3.5
100
FS
VDS = VGS, ID = 250A
VGS = 10V, ID = 0.22A
mS
V
= 25V, ID = 0.2A, f = 1.0KHz
DS
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
iss
C
oss
C
rss
50 pF
25 pF
8.0 pF
V
DS
= 10V, V
= 0V, f = 1.0MHz
GS
SWITCHING CHARACTERISTICS(Note 8)
Turn-On Delay Time
Notes: 5. RGS 20K.
6. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
BSS138W
Document number: DS30206 Rev. 11 - 2
t
D(ON
t
D(OFF
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20 ns
20 ns
= 30V, ID = 0.2A,
V
DD
R
= 50 Turn-Off Delay Time
GEN
September 2013
© Diodes Incorporated