Self-protected low side MOSFET. Monolithic over temperature, over
current, over voltage (active clamp) and ESD protected logic level
functionality. Intended as a general purpose switch.
S
SOT223
S
D
IN
Features
•Short circuit protection with auto restart
•Over-voltage protection (active clamp)
•Thermal shutdown with auto restart
•Over-current protection
•Input protection (ESD)
•High continuous current rating
•Load dump protection (actively protects load)
•Logic level input
Note:
The tab is connected to the source pin and must
be electrically isolated from the drain pin.
Connection of significant copper to the drain pin
is recommended for best thermal performance.
•Especially suited for loads with a high in-rush current such as lamps and motors.
•All types of resistive, inductive and capacitive loads in switching applications.
•C compatible power switch for 12V and 24V DC applications.
•Automotive rated.
•Replaces electromechanical relays and discrete circuits.
Linear mode capability - the current-limiting protection circuitry is designed to de-activate at low
Vds, in order not to compromise the load current during normal operation. The design maximum
DC operating current is therefore determined by the thermal capability of the package/board
combination, rather than by the protection circuitry. This does not compromise the products
ability to self protect itself at low V
Drain-source voltage for short circuit protection V
Drain-source voltage for short circuit protection V
= 5VV
IN
= 10VV
IN
Continuous input voltageV
Peak input voltageV
Operating temperature rangeT
Storage temperature rangeT
Power dissipation at T
Power dissipation at T
=25°C
A
=25°C
A
Continuous drain current @ V
Continuous drain current @ V
Continuous drain current @ V
Continuous source current (body diode)
Pulsed source current (body diode)
(a)
(c)
=10V; TA=25°C
IN
=5V; TA=25°C
IN
=5V; TA=25°C
IN
(a)
(b)
(a)
(a)
(c)
Unclamped single pulse inductive energyE
Load dump protectionV
Electrostatic discharge (human body model)V
DS
DS(SC)
DS(SC)
IN
IN
,
j
stg
P
D
P
D
I
D
I
D
I
D
I
S
I
S
AS
LoadDump
ESD
DIN humidity category, DIN 40 040E
IEC climatic category, DIN IEC 68-140/150/56
60V
36V
20V
-0.2 ... +10V
-0.2 ... +20V
-40 to +150
-55 to +150
°C
°C
1.5W
0.6W
1.3A
1.1A
0.7A
2.0A
3.3A
550mJ
80V
4000V
Thermal resistance
ParameterSymbolLimitUnit
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight
copper. Allocation of 6cm
(b) For a device surface mounted on FR4 board as (a) and measured at t<=10s.
(c) For a device surface mounted on FR4 board with the minimum copper required for connections.
(a)
(b)
(c)
2
copper 33% to source tab and 66% to drain pin with tab and drain pin electrically isolated.
(*) The drain current is limited to a reduced value when V
(†) Protection features may operate outside spec for VIN<4.5V.
(‡) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
datasheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed
for continuous, repetitive operation.
The current-limit protection circuitry is designed to de-activate at low VDS to prevent the load
current from being unnecessarily restricted during normal operation. The design max DC
operating current is therefore determined by the thermal capability of the package/board
combination, rather than by the protection circuitry (see graph on page 7 'Typical Output
Characteristic'). This does not compromise the products ability to self protect at low V
The overtemperature protection circuit trips at a minimum of 150°C. So the available package
dissipation reduces as the maximum required ambient temperature increases. This leads to the
following maximum recommended continuous operating currents.
Minimum copper area characteristics
For minimum copper condition as described in note (c)
For international sales offices visit www.zetex.com/offices
Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.