Diodes BSP75N User Manual

BSP75N 60V self-protected low-side IntellifetTM MOSFET switch
Summary
Continuous drain source voltage VDS=60V
On-state resistance 500m
Maximum nominal load current
Minimum nominal load current
Clamping energy 550mJ
(a)
1.1A (VIN = 5V)
(c)
0.7A (VIN = 5V)
Description
Self-protected low side MOSFET. Monolithic over temperature, over current, over voltage (active clamp) and ESD protected logic level functionality. Intended as a general purpose switch.
S
SOT223
S
D
IN
Features
Short circuit protection with auto restart
Over-voltage protection (active clamp)
Thermal shutdown with auto restart
Over-current protection
Input protection (ESD)
High continuous current rating
Load dump protection (actively protects load)
Logic level input
Note:
The tab is connected to the source pin and must be electrically isolated from the drain pin. Connection of significant copper to the drain pin is recommended for best thermal performance.
Ordering information
Device Reel size
(inches)
BSP75NTA 7 12mm embossed 1000
Tape width
(mm)
Quantity per reel
Device marking
BSP75N
Issue 4 - September 2006 1 www.zetex.com
© Zetex Semiconductors plc 2006
Functional block diagram
Over voltage
protection
BSP75N
D
IN
Human body
ESD protection
Over current
protection
Over temperature
protection
Logic
dV/dt
limitation
S
Applications
Especially suited for loads with a high in-rush current such as lamps and motors.
All types of resistive, inductive and capacitive loads in switching applications.
C compatible power switch for 12V and 24V DC applications.
Automotive rated.
Replaces electromechanical relays and discrete circuits.
Linear mode capability - the current-limiting protection circuitry is designed to de-activate at low Vds, in order not to compromise the load current during normal operation. The design maximum DC operating current is therefore determined by the thermal capability of the package/board combination, rather than by the protection circuitry. This does not compromise the products ability to self protect itself at low V
.
Issue 4 - September 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
BSP75N
Absolute maximum ratings
Parameter Symbol Limit Unit
Continuous drain-source voltage V
Drain-source voltage for short circuit protection V
Drain-source voltage for short circuit protection V
= 5V V
IN
= 10V V
IN
Continuous input voltage V
Peak input voltage V
Operating temperature range T
Storage temperature range T
Power dissipation at T
Power dissipation at T
=25°C
A
=25°C
A
Continuous drain current @ V
Continuous drain current @ V
Continuous drain current @ V
Continuous source current (body diode)
Pulsed source current (body diode)
(a)
(c)
=10V; TA=25°C
IN
=5V; TA=25°C
IN
=5V; TA=25°C
IN
(a)
(b)
(a)
(a)
(c)
Unclamped single pulse inductive energy E
Load dump protection V
Electrostatic discharge (human body model) V
DS
DS(SC)
DS(SC)
IN
IN
,
j
stg
P
D
P
D
I
D
I
D
I
D
I
S
I
S
LoadDump
ESD
DIN humidity category, DIN 40 040 E
IEC climatic category, DIN IEC 68-1 40/150/56
60 V
36 V
20 V
-0.2 ... +10 V
-0.2 ... +20 V
-40 to +150
-55 to +150
°C
°C
1.5 W
0.6 W
1.3 A
1.1 A
0.7 A
2.0 A
3.3 A
550 mJ
80 V
4000 V
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight
copper. Allocation of 6cm (b) For a device surface mounted on FR4 board as (a) and measured at t<=10s. (c) For a device surface mounted on FR4 board with the minimum copper required for connections.
(a)
(b)
(c)
2
copper 33% to source tab and 66% to drain pin with tab and drain pin electrically isolated.
Issue 4 - September 2006 3 www.zetex.com
© Zetex Semiconductors plc 2006
R
R
R
JA
JA
JA
83 °C/W
45 °C/W
208 °C/W
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