BSP75G
60V self-protected low-side IntelliFETTM MOSFET switch
Summary
Continuous drain source voltage VDS=60V
On-state resistance 550m
Nominal load current 1.4A (V
Clamping energy 550mJ
⍀
= 5V)
IN
Description
Self-protected low side MOSFET. Monolithic over temperature, over
current, over voltage (active clamp) and ESD protected logic level
power MOSFET intended as a general purpose switch.
Features
• Short circuit protection with auto restart
• Over-voltage protection (active clamp)
• Thermal shutdown with auto restart
• Over-current protection
• Input protection (ESD)
• High continuous current rating
Note:
The tab is connected to the drain pin, and must
be electrically isolated from the source pin.
Connection of significant copper to the tab is
recommended for best thermal performance.
SOT223
S
D
D
IN
• Load dump protection (actively protects load)
• Logic level input
Ordering information
Device Reel size
(inches)
BSP75GTA 7 12mm embossed 1,000
BSP75GTC 13 12mm embossed 4,000
Tape width
(mm)
Quantity per reel
Device marking
BSP75G
Issue 4 - May 2006 1 www.zetex.com
© Zetex Semiconductors plc 2006
Functional block diagram
Over voltage
protection
BSP75G
D
IN
Human body
ESD protection
Over current
protection
Over temperature
protection
Logic
dV/dt
limitation
S
Applications
• Especially suited for loads with a high in-rush current such as lamps and motors.
• All types of resistive, inductive and capacitive loads in switching applications.
•
C compatible power switch for 12V and 24V DC applications.
• Automotive rated.
• Replaces electromechanical relays and discrete circuits.
• Linear mode capability - the current-limiting protection circuitry is designed to de-activate at
low Vds, in order not to compromise the load current during normal operation. The design
maximum DC operating current is therefore determined by the thermal capability of the
package/board combination, rather than by the protection circuitry.
Issue 4 - May 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
BSP75G
Absolute maximum ratings
Parameter Symbol Limit Unit
Continuous drain-source voltage V
Drain-source voltage for short circuit protection V
DS(SC)
Continuous input voltage V
Peak input voltage V
Operating temperature range T
Storage temperature range T
Power dissipation at T
=25°C
A
Continuous drain current @ V
Continuous drain current @ V
Pulsed drain current @ V
Continuous source current (body diode)
(a)
=10V; TA=25°C
IN
=5V; TA=25°C
IN
=10V I
IN
(a)
(a)
(a)
Pulsed source current (body diode) I
Unclamped single pulse inductive energy E
Load dump protection V
LoadDump
Electrostatic discharge (human body model) V
DS
60 V
36 V
IN
IN
, -40 to +150 °C
j
stg
P
D
I
D
I
D
DM
I
S
S
AS
-0.2 ... +10 V
-0.2 ... +20 V
-55 to +150 °C
2.5 W
1.6 A
1.4 A
5A
3A
5A
550 mJ
80 V
ESD
4000 V
DIN humidity category, DIN 40 040 E
IEC climatic category, DIN IEC 68-1 40/150/56
Thermal resistance
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 37mm x 37mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight
copper.
(b) For a device surface mounted on FR4 board and measured at t<=10s.
(c) For a device mounted on FR4 board with the minimum copper required for electrical connections.
(a)
(b)
(c)
R
R
R
⍜JA
⍜JA
⍜JA
50 °C/W
24 °C/W
208 °C/W
Issue 4 - May 2006 3 www.zetex.com
© Zetex Semiconductors plc 2006