Diodes BCW68H User Manual

Product Line o
Diodes Incorporated
Features
BV
I
Low Saturation Voltage V
Complementary NPN Type: BCW66H
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
> -45V
CEO
= -800mA high Continuous Collector Current
C
< -300mV @ 100mA
CE(sat)
SOT23
B
Top View
Mechanical Data
Case: SOT23
Case Material: molded plastic, “Green” molding compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
Weight 0.008 grams (approximate)
C
E
Device Symbol
BCW68H
45V PNP MEDIUM POWER TRANSISTOR IN SOT23
MIL-STD-202, Method 208
E
C
B
Top View
Pin Configuration
Ordering Information (Note 4)
Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel
BCW68HTA DH 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DH
DH = Product Type Marking Code
BCW68H
Document number: DS33004 Rev. 6 - 2
1 of 5
www.diodes.com
December 2012
© Diodes Incorporated
Product Line o
Diodes Incorporated
Maximum Ratings (@T
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Base Current
Thermal Characteristics (@T
Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Leads (Note 7) Operating and Storage Temperature Range
Notes: 5. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition; the device is
measured when operating in a steady-state condition.
6. Same as note (5), except the device is mounted on 15mm x 15mm FR4 PCB.
7. Thermal resistance from junction to solder-point (at the end of the leads).
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
V
CES
V
CEO
V
EBO
I
C
I
CM
I
B
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
(Note 5) (Note 6) 350 (Note 5) (Note 6) 357
R
R
T
J,TSTG
P
θJA
θJL
D
-60 V
-45 V
-7 V
-800 mA
-1000 mA
-100 mA
310
403
350
-55 to +150
BCW68H
mW
°C/W
°C/W
°C
0.4
0.3
0.2
0.1
0.0 0 255075100125150
Max Power Dissipation (W)
Temperature (°C)
Derating Curve
10
Singl e Puls e. T
1
0.1
10m 100m 1 10 100 1k
Max Power Dissipation (W)
Pulse Width (s)
Pulse Power Dissipation
amb
=25°C
400
350
300
250
D=0.5
200
150
D=0.2
100
50
0
100µ 1m 10m 100m 1 10 100 1k
Thermal Resistance (°C/W)
D=0.1
Single Pulse
D=0.05
Pulse Width (s)
Transient Thermal Impedance
BCW68H
Document number: DS33004 Rev. 6 - 2
2 of 5
www.diodes.com
December 2012
© Diodes Incorporated
Loading...
+ 3 hidden pages