Diodes BCW66H User Manual
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Diodes Incorporated
Features
BV
I
Low Saturation Voltage V
Complementary PNP Type: BCW68H
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP capable (Note 4)
> 45V
CEO
= 800mA High Continuous Collector Current
C
< 300mV @ 100mA
CE(sat)
SOT23
B
Top View Device Symbol
BCW66H
45V NPN SMALL SIGNAL TRANSISTOR IN SOT23
Mechanical Data
Case: SOT23
Case Material: molded plastic, “Green” molding compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight 0.008 grams (approximate)
C
E
C
E
Top View
Pin-Out
B
Ordering Information (Notes 4 & 5)
Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel
BCW66HTA AEC-Q101 EH 7 8 3,000
BCW66HQTA Automotive EH 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the
same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_compliance_definitions/.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
EH
BCW66H
Document number: DS33003 Rev. 5 - 2
EH = Product Type Marking Code
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Maximum Ratings (@T
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current
Thermal Characteristics (@T
Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Leads (Note 8)
Operating and Storage Temperature Range
Notes: 6. For a device mounted on minimum recommended pad layout 1oz weight copper that is on a single-sided FR4 PCB; device is measured under still air
conditions whilst operating in a steady-state.
7. Same as Note 6, except the device is mounted on 15mm X 15mm 1oz copper.
8. Thermal resistance from junction to solder-point (at the end of the leads).
= +25°C, unless otherwise specified.)
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Characteristic Symbol Value Unit
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
(Note 6)
(Note 7) 350
(Note 6)
(Note 7) 357
R
R
T
J,TSTG
P
θJA
θJL
D
75 V
45 V
7 V
800 mA
1000 mA
100 mA
310
403
350
-55 to +150
BCW66H
mW
C/W
C/W
C
0.4
0.3
0.2
0.1
0.0
0 255075100125150
Max Power Dissipation (W)
Temperature (°C)
Derating Curve
10
Singl e Puls e. T
1
0.1
10m 100m 1 10 100 1k
Max Power Dissipation (W)
Pulse Width (s)
Pulse Power Dissipation
amb
=25°C
400
350
300
250
D=0.5
200
150
D=0.2
100
50
0
100µ 1m 10m 100m 1 10 100 1k
Thermal Resistance (°C/W)
D=0.1
Single Pulse
D=0.05
Pulse Width (s)
Transient Thermal Impedance
BCW66H
Document number: DS33003 Rev. 5 - 2
2 of 5
www.diodes.com
© Diodes Incorporated
April 2013
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