Diodes BCV47 User Manual

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Features

• BV

• Darlington Transistor h

• I

• Complementary Darlington PNP Type: BCV46

• Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

• PPAP capable (Note 4)

> 60V

CEO

= 500mA high Continuous Collector Current

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> 10k @ 100mA for high gain

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SOT23

Top View Device Symbol

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B

60V NPN DARLINGTON TRANSISTOR IN SOT23

Mechanical Data

• Case: SOT23

• Case Material: molded plastic, “Green” molding compound

• UL Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Finish – Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208

• Weight 0.008 grams (approximate)

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Top View

Pin-Out

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BCV47

Ordering Information (Notes 4 & 5)

Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel

BCV47TA AEC-Q101 ZFG 7 8 3,000

BCV47TC AEC-Q101 ZFG 13 8 10,000
BCV47QTA Automotive ZFG 7 8 3,000
BCV47QTC Automotive ZFG 13 8 10,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified.

5. For packaging details, go to our website at http://www.diodes.com.

Marking Information

ZFG

BCV47

Document number: DS33001 Rev. 4 - 2

ZFG = Product Type Marking Code

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Maximum Ratings (@T

Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current

Thermal Characteristics (@T

Power Dissipation

Thermal Resistance, Junction to Ambient

Thermal Resistance, Junction to Leads (Note 8)
Operating and Storage Temperature Range

Notes: 6. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition; the device is

measured when operating in a steady-state condition.

7. Same as note (6), except the device is mounted on 15mm x 15mm FR4 PCB.

8. Thermal resistance from junction to solder-point (at the end of the leads).

= +25°C, unless otherwise specified.)

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Characteristic Symbol Value Unit

V

CBO

V

CEO

V

EBO

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C

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CM

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= +25°C, unless otherwise specified.)

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Characteristic Symbol Value Unit

(Note 6)
(Note 7) 350
(Note 6)
(Note 7) 357

R

R

T

J,TSTG

P

θJA

θJL

D

80 V
60 V

10 V
500 mA
800 mA
100 mA

310

403

350

-55 to +150

BCV47

mW

°C/W

°C/W

°C

0.4

0.3

0.2

0.1

0.0
0 255075100125150

Max Power Dissipation (W)

Temperature (°C)

Derating Curve

10

Singl e Puls e. T

1

0.1

10m 100m 1 10 100 1k

Max Power Dissipation (W)

Pulse Width (s)

Pulse Power Dissipation

amb

=25°C

400

350

300

250

D=0.5

200

150

D=0.2

100

50

0

100µ 1m 10m 100m 1 10 100 1k

Thermal Resistance (°C/W)

D=0.1

Single Pulse

D=0.05

Pulse Width (s)

Transient Thermal Impedance

BCV47

Document number: DS33001 Rev. 4 - 2

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December 2012

© Diodes Incorporated