Diodes BC847CDLP User Manual
Features
BV
Low profile 0.4mm high package for thin applications
Ultra-Small Surface Mount Package
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
CEO
> 45V
X2-DFN1310-6
Top View
BC847CDLP
45V DUAL NPN SMALL SIGNAL TRANSISTOR
Mechanical Data
Case: X2-DFN1310-6
Nominal package height: 0.4mm
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - NiPdAu, Solderable per MIL-STD-202,
Method 208
Weight: 0.0015 grams (approximate)
E C
Device Schematic
e4
CBB E
Top View
Ordering Information (Note 4)
Part Number Marking Reel Size (inches) Tape Width (mm) Quantity per Reel
BC847CDLP-7 1M 7 8 3000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
1M
(Top View)
1M = Product Type Marking Code
BC847CDLP
Document number: DS30817 Rev. 7 - 2
1 of 6
www.diodes.com
May 2013
© Diodes Incorporated
P, P
OWER
PATIO
BC847CDLP
Maximum Ratings (@T
= +25°C unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
V
V
V
CBO
CEO
EBO
IC
50 V
45 V
6 V
100 mA
Thermal Characteristics – Total Device (@T
= +25°C unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation (Note 5) Total Device
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Note: 5. For a device surface mounted on minimum recommended pad layout FR-4 PCB with single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
R
TJ, T
PD
θJA
STG
350 mW
357 °C/W
-65 to +150 °C
Thermal Characteristics – Total Device
350
300
250
N (mW)
200
150
DISSI
100
D
50
R°C/W
0
0
Figure 1 Power Dissipation vs. Ambient Temperature
Note 5
= 357
JA
25 75 125
50 100 150
T , AMBIENT TEMPERATURE (°C)
A
BC847CDLP
Document number: DS30817 Rev. 7 - 2
2 of 6
www.diodes.com
May 2013
© Diodes Incorporated
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