• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
X2-DFN1006-3
Bottom View
CE(sat)
BC846BLP4
65V NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Mechanical Data
• Case: X2-DFN1006-3
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
•Moisture Sensitivity: Level 1 per J-STD-020
B
Device Symbol
• Terminals: Finish ⎯ NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
•Weight: 0.0009 grams (Approximate)
C
B
E
E
Device Schematic
e4
C
Top View
Ordering Information (Note 4)
Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel
BC846BLP4-7B 3S 7 8 10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
4. For packaging details, go to our website at http://www.diodes.com.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Peak Collector Current
Peak Emitter Current
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range
(Note 5)
(Note 6) 1
(Note 5)
(Note 6) 120
BC846BLP4
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
EM
P
D
R
JA
θ
R
JL
T
, T
J
STG
80 V
65 V
6 V
100 mA
200 mA
200 mA
0.46
272
110
-55 to +150
W
°C/W
°C/W
°C
ESD Ratings (Note 8)
Electrostatic Discharge - Human Body Model ESD HBM ≥ 8,000 V 3B
Electrostatic Discharge - Machine Model ESD MM ≥ 400 V C
Notes: 5. For a device surface mounted on minimum recommended pad layout FR-4 PCB with single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink.
6. Same as note 5, except device is surface mounted on 25mm X 25mm collector pad heatsink with 1oz copper.
7. Thermal resistance from junction to solder-point (at the end of the collector lead).
8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
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