Diodes BC846BLP4 User Manual

Features

• Low Collector-Emitter Saturation Voltage, V

• Ultra-Small Leadless Surface Mount Package

• Totally Lead-Free & Fully RoHS Compliant (Note 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

X2-DFN1006-3

Bottom View

CE(sat)

BC846BLP4

65V NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Mechanical Data

• Case: X2-DFN1006-3

• Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

B

Device Symbol

• Terminals: Finish ⎯ NiPdAu over Copper leadframe. Solderable per MIL-STD-202, Method 208

• Weight: 0.0009 grams (Approximate)

C

B

E

Device Schematic

e4

C

Top View

Ordering Information (Note 4)

Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel

BC846BLP4-7B 3S 7 8 10,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

4. For packaging details, go to our website at http://www.diodes.com.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free.

3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

Marking Information

BC846BLP4

Document number: DS35751 Rev. 2 - 2

3S

Top View

Bar Denotes Base

and Emitter Side

www.diodes.com

3S = Product Type Marking Code

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July 2012

θ

Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Value Unit

Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Peak Collector Current Peak Emitter Current

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation

Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Leads (Note 7)

Operating and Storage Temperature Range

(Note 5) (Note 6) 1 (Note 5) (Note 6) 120

BC846BLP4

V

CBO

V

CEO

V

EBO

I

C

I

CM

I

EM

P

D

R

JA

θ

R

JL

T

, T

J

STG

80 V 65 V

6 V 100 mA 200 mA 200 mA

0.46

272

110

-55 to +150

W

°C/W °C/W

°C

ESD Ratings (Note 8)

Electrostatic Discharge - Human Body Model ESD HBM ≥ 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM ≥ 400 V C

Notes: 5. For a device surface mounted on minimum recommended pad layout FR-4 PCB with single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink.

6. Same as note 5, except device is surface mounted on 25mm X 25mm collector pad heatsink with 1oz copper.

7. Thermal resistance from junction to solder-point (at the end of the collector lead).

8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

Characteristic Symbol Value Unit JEDEC Class

BC846BLP4

Document number: DS35751 Rev. 2 - 2

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July 2012

T

R

T T

HER

R

T

C

P, P

T

R

T P

O

R

P, P

OWER

PATIO

N

Thermal Characteristics

1

D = 0.9 D = 0.7

E

D = 0.5

AN

D = 0.3

ESIS

0.1

D = 0.1

MAL

D = 0.05

D = 0.02

0.01

D = 0.01

ANSIEN

D = 0.005

r(t),

D = Single Pulse

0.001

0.000001 0.0001 0.01 1 100 10,000 t1, PULSE DURATION TIME (sec)

Fig. 1 Transi ent Therm al Resis t ance

R (t) = r(t) * R

θθ

JA JA

R = 272°C/W

θ

JA

Duty Cycle, D = t1/ t2

BC846BLP4

1,000

(W)

100

IWE

Single Pulse

°

R = 272C/W

θ

JA

R = r * R

θθ

JA(t) (t) JA

T - T = P * R

JA JA(t)

θ

0.5

0.4

(W)

0.3

10

ANSIEN

EAK

1

(PK)

0.1 1E-06 0.0001 0.01 1 100 10,000

t1, PULSE DURATION TIME (sec)

Fig. 2 Single Pulse Maximum Power Dissipation

BC846BLP4

Document number: DS35751 Rev. 2 - 2

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DISSI

0.2

D

R = 272C/W

0.1

0

0 50 100 150 200

°

θ

JA

T , AMBIENT TEMPERATURE (°C)

A

Fig. 3 Power Dissipation vs . Ambi ent Te m perature

July 2012